(905) 477-8790 info@camptechii.com

Manufacturing Capabilities


1 to 30 Layers Rigid PCBs

1 to 10 Layer Flexible PCB

1 to 5 days delivery on prototypes

5 to 20 days delivery on production quantities

a

Multilayer Rigid-Flexible PCBs

 

N

Aluminum backing PCBs

 

/

Printed Circuit board thickness from 0.020 to 0.125

 

a

Minimum line width .003

 

0

Minimum spacing .003

 

)

Min. SMT pitch .005

 

[

Minimum hole size .006

 

\

Laser Hole .002

 

g

Controlled Impedance

 

+

Hole to hole location +/- .001

 

Z

Pad to pad annular ring (solder mask) per IPC spec

 

Z

Hole to pad annular ring (circuitry) per IPC spec

 

1

NC routed dimension +/- .005

 

1

NC scored dimension +/- .010

 

 

Process Capabilities


  • Materials: FR4, High TG FR4, RoHS FR4, CEM, Teflon, Aluminum Base, Polyimide, Ceramic
  • Material Manufacturers: Kingboard, Nanya, Isola, Rogers, Arlon, Taconic, Metclad¦
  • Photo-plotting
  • LPI technology Screen coat/ Imaging system for accurate mask registration
  • Solder mask Colors available include: Green, Red, Blue, Black, White and Clear
  • LEAD Hot air solder leveling SMOBC
  • LEAD-FREE Hot Air leveling SMOBC (RoHS)
  • Immersion Gold (ENIG)
  • Immersion Silver
  • Immersion Tin
  • Organic ( OSP )
  • Soft Wire bondable Gold
  • Hard Gold
  • BURIED and BLIND Viaas
  • Carbon Ink
  • Electrical test 100 % fault verification (Clamshell, flying probe and net-list)
  • Peelable solder mask (mask coverage on areas where no reflow required)
  • Profiling, Routing, V-Score
  • Panel form standard for Automated Assembly