(905) 477-8790 info@camptechii.com

Manufacturing Capabilities

  • 1 to 30 Layers Rigid PCB’s
  • 1 to 10 Layer Flexible PCB’s
  • Multilayer Rigid-Flexible PCB’s
  • Aluminum backing PCB’s
  • 24 hr to 5 days delivery on prototypes
  • 5 days to 4 weeks delivery on production
  • Copper thickness from ½ oz to 5 oz (max)
  • Printed Circuit board thickness from 0.020 to 0.125
  • Minimum line width .003
  • Minimum spacing .003
  • Min SMT pitch .005
  • Minimum hole size .006
  • Laser Hole .002
  • Controlled Impedance
  • Hole to hole location +/- .001
  • Pad to pad annular ring (solder mask) per IPC spec
  • Hole to pad annular ring (circuitry) per IPC spec
  • NC routed dimension +/- .005
  • NC scored dimension +/- .010
  • 1 to 30 Layers Rigid PCB’s
  • 1 to 10 Layer Flexible PCB’s
  • Multilayer Rigid-Flexible PCB’s
  • Aluminum backing PCB’s
  • 24 hr to 5 days delivery on prototypes
  • 5 days to 4 weeks delivery on production
  • Copper thickness from ½ oz to 5 oz (max)
  • Printed Circuit board thickness from 0.020 to 0.125
  • Minimum line width .003
  • Minimum spacing .003
  • Min SMT pitch .005
  • Minimum hole size .006
  • Laser Hole .002
  • Controlled Impedance
  • Hole to hole location +/- .001
  • Pad to pad annular ring (solder mask) per IPC spec
  • Hole to pad annular ring (circuitry) per IPC spec
  • NC routed dimension +/- .005
  • NC scored dimension +/- .010