When you start searching for a PCB manufacturer, you will find a long list of companies offering different capabilities, price, delivery, and quality. You might find that a company provides exceptional quality and price for a 4 layer board, but they can’t deliver the quality you need for a more complex design. This could also work the other way – a PCB manufacturer with advanced capabilities might not offer competitive pricing for a 2 layer board. To help you with your search, we have compiled this list of printed circuit board manufacturers and we have provided an overview of their capabilities and services.
Camptech Circuits
At Camptech, we believe that responsibility, honesty, competence, and accountability are the primary and pivotal factors in leading and managing our organization. In developing and maintaining the trust of our customers, employees, and suppliers we have shaped and maintain a system of corporate governance that is ingrained in the day-to-day dealings of the company’s management and employees.
Delivery
- 4 to 10 days for prototypes
- 5 days to 4 weeks for production
Min. Trace Width
- 3 mil
Min. Gap Between Traces
- 3 mil
Min. SMT Pitch
- 5 mil
Min. Mechanical Hole Size
- 6 mil
Minimum Laser Hole
- 2 mil
Scoring Tolerance
- +/- 10 mil
Routing Tolerance
- +/- 5 mil
Outer Copper Thickness (finished)
- 1 oz. to 20 oz.
Blind/Buried Vias
- Yes
A blind via is a connection from an outer layer of a board to one or more inner layers without exiting out the opposite side of the board.
Aspect Ratio
- 12:1
Electrical Test
- Flying Probe
- Test Fixture
Number of Layers
- 1 to 30 Layers Rigid PCBs
- 1 to 10 Layer Flexible PCBs
A PCB is made up of layers of copper foil and insulating material, laminated to the substrate.
Legend (Silkscreen)
- White
- Black
- Yellow
- Custom Colors
Components locations and other markings on a PCB are identified using a silkscreen legend.
Stacked Microvias
- Yes
Via in Pad
- Yes
Controlled Impedance & Simulations
- Yes
Plugged Vias
- Solder mask
- Non-Conductive Epoxy
Solder Mask Colors
- Green
- Red
- Blue
- Black
- White
- Yellow
- Custom colors
- Peelable Mask
Other Services
- Panelization
- Profiling
- Routing
- V-Scoring
- Edge-Plating
- Control Depth Holes
- Countersink Holes
- Castellation Holes
Read our related blog post:
Comparison table of 8 PCB Manufacturers’
Capabilities and Customer Reviews
Advanced Circuits
This company is MIL-PRF-31032, MIL-PRF-55110G, AS9100C, ISO 9001:2008 Certified, IPC 6012 Class 2, 3 and 3A Qualified, and ITAR Registered. They operate divisions in Aurora, CO, Tempe, AZ, and Maple Grove, MN.
Advanced Circuits offers printed circuit board manufacturing with two options: Standard & Custom Spec. Choosing between the two options will depend on your PCB design requirements and specifications.
Here are some highlights of their service:
- Lead Time: Same Day – 4 Weeks
- Layer Count: 0 – 40 Layers
- Cu Weight: Up to 20 oz.
- Trace/Space: Down to .0025”
- Via-In-Pad
- Blind & Buried Vias
- Laser Direct Imaging
- Oversized Boards
- Stacked Microvias
- Down To .3mm Pitch
- Cavity Boards
- Buried Chip Resistors
- Laser-Drilled Microvias
Capabilities
| Specification | Standard | Custom |
| Layer Count | 0 – 10 Layers | 0 – 40 Layers |
| Turn Time | Same Day – 5 Day | Same Day – 4 Weeks |
| Quantity Req. | 1 – 10000+ | 1 – 10000+ |
| Materials | FR-4 | FR-4/Rogers/Polyimide/Aluminum Clad/High-Temp. FR4 & others |
| Plating Finish | Lead-Free HAL* | Electrolytic Hard Gold/Soft Gold/ENIG/Nickel/Immersion Silver |
| OSP/Leaded & Lead-Free HAL | ||
| Cert. / Qualifications | IPC Class 2 – A600 | IPC6012 Class 2-3A / IPC6018 Class 3 MIL-PRF-31032 / MIL-PRF-55110 / ISO |
| 9001:2008 / AS9100C | ||
| Board Thickness | .031″ / .062″ / .093″ / .125″ | Full Range Available |
| Copper Weight | 1 oz. Inner / Up to 2 oz. Outer | 0.5 – 4 oz. Inner / 1 – 20 oz. Outer |
| Trace/Space | 5 / 5 Mils | Down to 2.75 / 3 Mils |
| Solder Mask (LPI) | Green | Various Color Options |
| Legend | White | Various Color Options |
| Min. Hole Size | 0.010″ | 0.004″ |
| Hole Tolerance | +/- 0.005″ | +/- 0.003″ (Upon Request) |
| Route Tolerance | +/- 0.010″ | +/- 0.005″ (Upon Request) |
| Slots/Cutouts/Edges | Non-Plated Only | Plated / Non-Plated |
| Plated Holes | Plated / Non-Plated | Plated / Non-Plated |
| UL Markings/Dates | Yes** | Yes** |
| Lead-Free Markings | Yes | Yes |
| Gold Fingers | Yes | Yes |
| Fiducials | Yes | Yes |
| Scoring | Yes | Yes |
| ITAR | Yes | Yes |
| Castellated Holes | X | Yes |
| Controlled Dielectric | X | Yes |
| Controlled Impedance | X | Yes |
| Counter Sinks | X | Yes |
| Counter Bores | X | Yes |
| Blind/Buried Vias | X | Yes |
| Microvias | X | Yes |
| Mask Plugged Vias | X | Yes |
| Via-in-Pad | X | Yes |
| Etch Back | X | Yes |
| Tetra Etch | X | Yes |
| Cover Coat | X | Yes |
| Cavity Process | X | Yes |
| Laser Rout | X | Yes |
| LPI Legend | X | Yes |
| Edge Mill | X | Yes |
| Unique Serialization | X | Yes |
| Back Drilling | X | Yes |
| Controlled Depth Drill | X | Yes |
Sunstone Circuits
Based in Mulino, Oregan, Sunstone Circuits offers PCB fabrication services.
Here is the list of their manufacturing capabilities:
Capabilities
| Drill Capabilities | |
| Smallest Drill Size | 0.005″ |
| Largest Drill Size | 0.250″ +/- 0.002″ |
| *Note: Holes > 0.250″ are considered cutouts | |
| Positional Tolerance | |
| Control Depth Tolerance | +/- 0.0005″ |
| Microvia | Yes |
| Blind / Buried Via | Yes |
| Min. Pad Size (via) | via + 0.006″ |
| Min. Pad Size (component) | hole + 0.010″ |
| Route Capabilities | |
| Board Size Tolerances (Rout) | +/- 0.003″ |
| Board Size Tolerance (Laser) | +/- 0.001″ |
| V-Score Web Thickness | +/- 0.002″ |
| V-Score Line Width | +/- 0.002″ |
| Etch Tolerances | |
| Trace width (of design) | +/- 0.0005″ |
| Minimum Trace Width | 0.002″ |
| Surface Finish | |
| Tin / Lead Solder (HASL) | Yes |
| Immersion Silver | Yes* |
| ENIG | Yes* |
| Copper Only | Yes* |
| OSP | Yes* |
| ENIPIG | Yes* |
| Full Body Hard Gold | Yes* |
| Soft Bondable Gold | Yes* |
| Lead Free Solder | Yes* |
| *Denotes RoHS Compliant Finish | |
| Board Parameters | |
| Layer Count | 0 – 36 |
| Board Thickness | 0.003″ – 0.187 |
| Copper Weight (finished) | 0.25 oz – 6 oz |
| Materials | |
| FR-4 150 Tg (RoHS Compliant) | Yes |
| FR-4 170 Tg (RoHS Compliant) | Yes |
| Rogers RO 3000(R) Series | No |
| Rogers RO 4000(R) Series | Yes |
| Rogers RT/duroid(R) Series (5000 and 6000 Series) | Yes |
| Arlon | Yes |
| Polyflon | Yes |
| Taconic | Yes |
| Certifications | |
| UL Listed | |
| ITAR Registered | |
| Other Sunstone Capabilities | |
| Controlled Impedance | |
| Full Service CAM Tooling |
Bay Area Circuits
The company has been serving the advanced PCB manufacturing needs of design engineering firms in the commercial, industrial, and medical industries, contract assemblers, and original equipment manufacturers for over 40 years.
| Standard Capability | Advanced Capability | |
| Overview | ||
| Minimum Layer Count | 1 | 1 |
| Maximum Layer Count | 16 | 30 |
| Trace/Space | 0.006″ | 0.002″ |
| Finished Hole Size | 0.010″ | 0.004″ |
| Surface Finishes | HASL, ENIG, Hard Gold, Soft Gold (see all below) | ENEPIG, OSP, EPIG (see all below) |
| Materials | FR-4, High Temp FR-4, Isola, Rogers | PTFE/Duroid, Polyimide, Flex |
| Controlled Impedance | +/- 10% | +/- 5% |
| Annular Ring | 0.006″ | 0.003″ Mechanical, 0.001″ Laser |
| Outer Layers Finished Copper | 1.5 oz to 2 oz | 1 oz to 5 oz |
| Inner Layers Finished Copper | 0.5 oz to 2 oz | 0.3 oz to 4 oz |
| Soldermask Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Silkscreen Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Filled Vias | Non-Conductive Fill | Non-Conductive Fill or Conductive Fill |
| Smallest Mechanical Drill Diameter | 0.010″ | 0.004″ |
| Smallest Laser Drill Diameter | N/A | 0.003″ |
| Blind Vias | No | Yes |
| Buried Vias | No | Yes |
| Aspect Ratio | 10:01 | 15:01 |
| Plated Hole to Copper | 0.008″ | 0.005″ |
| Clearance – Copper to Edge of Board | Outer Layer – 0.010″ | Outer Layer – 0.005″ |
| Inner Layer – 0.015″ | Inner Layer – 0.005″ | |
| Minimum Panel Size | 9″ x 12″ | 8″ x 8″ |
| Maximum Panel Size | 18″ x 24″ | 24″ x 36″ |
| Plated Slots | Routed | Routed or Nibbled |
| Non-Plated Slots | Routed | Routed or Nibbled |
| Plating in Holes | 0.0008″ | 0.0015″ |
| Web (or Mask Width) | 0.006″ | 0.003″ |
| Soldermask Swell | 0.003″ | 0.001″ |
| Silkscreen Width | 0.003″ | 0.003″ |
| Inspection & Testing Criteria | ||
| IPC Class 2 | Yes | Yes |
| IPC Class 3 | No | Yes |
| Netlist Generation and Netlist Compare | Yes | Yes |
| Trace / Space | ||
| Outer Layers (finished copper) | 1 oz. Cu – Min .005″ Trace/Space | 1 oz. Cu – Min .002″ Trace/Space |
| 2 oz. Cu – Min .008″ Trace/Space | 2 oz. Cu – Min .006″ Trace/Space | |
| 3 oz. Cu – Min .012″ Trace/Space | 3 oz. Cu – Min .008″ Trace/Space | |
| 4 oz. Cu – Min .014″ Trace/Space | 4 oz. Cu – Min .012″ Trace/Space | |
| 5 oz. Cu – Min .016″ Trace/Space | ||
| Inner Layers | ||
| 0.3 oz Cu – Min .002″ Trace/Space | 0.5 oz Cu – Min .003″ Trace/Space | |
| 0.5 oz Cu – Min .005″ Trace/Space | 1 oz. Cu – Min .005″ Trace/Space | |
| 1 oz. Cu – Min .006″ Trace/Space | 2 oz. Cu – Min .008″ Trace/Space | |
| 2 oz. Cu – Min .012″ Trace/Space | 3 oz. Cu – Min .0012″ Trace/Space | |
| 4 oz. Cu – Min .016″ Trace/Space | ||
| Drilling | ||
| Min drilled diameter, final board thickness 0.031″ or less | 0.008″ | 0.004″ |
| Min drilled diameter, final board thickness between 0.031″ and 0.062″ | 0.010″ | 0.006″ |
| Min drilled diameter, final board thickness between 0.062″ and 0.093″ | 0.012″ | 0.010″ |
| Min drilled diameter, final board thickness between 0.093″ and 0.125″ | 0.015″ | 0.012″ |
| Min laser diameter, dielectric thickness less than or equal to 0.004″ | N/A | 0.003″ |
| Min laser diameter, dielectric thickness between 0.004″ and 0.005″ | N/A | 0.004″ |
| Min laser diameter, dielectric thickness between 0.005″ and 0.007″ | N/A | 0.005″ |
| Controlled depth blind vias | No | Yes, max 0.75:1 aspect ratio |
| Pre-drilled core blind vias | No | Yes |
| Sublamination blind vias | No | Yes |
| Build-up technology | No | Up to 4-N-4, Any layer |
| Buried vias | No | Yes |
| Filled vias | Non-Conductive fill | Non-Conductive or Conductive fill |
| Nibbling | No | Yes |
| Largest hole | 0.247″ plated, 0.250″ non-plated | No maximum |
| Slots | Plated or non-plated, routed | Plated or non-plated, routed or nibbled |
| Plating in holes | 0.0008″ | 0.0015″ |
| Plated hole to copper | 0.008″ | 0.005″ |
| Surface Finish | ||
| Hot Air Solder Level (HASL – Lead) | Yes | Yes |
| Hot Air Solder Level (HASL – Lead-Free) | Yes | Yes |
| Electroless Nickel Immersion Gold (ENIG) | Yes | Yes |
| Immersion Silver | Yes | Yes |
| Hard Gold Fingers with ENIG | Yes | Yes |
| Hard Gold Fingers with HASL | Yes | Yes |
| Yes | Yes | |
| Electrolytic Soft Gold | Yes | Yes |
| Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) | No | Yes |
| Organic Surface Protectant (OSP) | Yes | Yes |
| Bare Copper | Yes | Yes |
| Electroless Palladium Immersion Gold (EPIG) | No | Yes |
| Tin Nickel | No | Yes |
| White Tin | Yes | Yes |
| Carbon Ink | No | Yes |
| Soldermask | ||
| Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Finish/Texture | Semi-gloss, Matte | Semi-gloss, Matte |
| Tented Vias | Yes | Yes |
| Soldermask Plugged Vias | Yes | Yes |
| Soldermask Thickness over Copper | 5 micron to 25 micron | 5 micron to 25 micron |
| Soldermask Web | 5 mil | 3 mil |
| Soldermask Gap to Pad | 4 mil | 2 mil |
| Copper Ring Under Mask-Defined Pad | 3 mil | 1 mil |
| Peelable Soldermask | No | Yes |
| LPI Soldermask | Yes | Yes |
| Dry Film Soldermask | No | Yes |
| Silkscreen | ||
| Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Minimum Legend Width | 3 mil | 3 mil |
| Space between Silkscreen and Pad | 5 mil | 4 mil |
| Controlled Impedance | ||
| Layers | 0-10 Layers | 0-30 Layers |
| Impedance Tolerance | Single-ended +/- 10% | Single-ended +/- 5% |
| Impedance Tolerance | Differential Pairs +/- 10% | Differential Pairs +/- 5% |
| Impedance Tolerance | Coplanar Waveguide +/- 10% | Coplanar Waveguide +/- 5% |
| TDR Testing | Yes, Included | Yes, Included |
| Board Thickness | ||
| 1-Layer or 2-Layer | Min .015″ | Max .200″ | Min .008″ | Max .250″ |
| 4-Layer | Min .020″ | Max .200″ | Min .015″ | Max .250″ |
| 6-Layer | Min .031″ | Max .200″ | Min .025″ | Max .250″ |
| 8-Layer | Min .047″ | Max .200″ | Min .031″ | Max .250″ |
| 10-Layer | Min .062″ | Max .200″ | Min .040″ | Max .250″ |
| 12-Layer | Min .062″ | Max .200″ | Min .047″ | Max .250″ |
| 14-Layer | Min .062″ | Max .200″ | Min .054″ | Max .250″ |
| 16-Layer | Min .062″ | Max .200″ | Min .062″ | Max .250″ |
| CNC / Routing / Score / Mechanical Rules | ||
| Router Bit Size | 0.078″ | Min 0.021″, Max. 0.078″ |
| Spacing for Tab Rout Array | 0.100″ | |
| Standard V- Score Angle | 30° | 20°, 30°, 45°, 60° |
| V-Score Depth | One third of board thickness (min 0.010″) | |
| Jump Score | No | Yes, overshoot up to 0.35″ |
| Scoring Direction | Vertical and Horizontal | Routed Scoring |
| Bevel Angle | 20, 30, 45, or 60 Degree Gold Finger Bevel | Milling/Offset or Recessed Beveling |
| Countersinks | 60, 82, 90, 100 Degree Countersink ** | 60, 82, 90, 100 Degree Countersink ** |
| Counterbores | Yes | Yes |
| Edge Castellations | No | Castellated Edges Min .040″ |
| Plated Edges | No | Yes |
| Cross Section | Level 1 | Level 1, Level 2, Level 3 |