When you start searching for a PCB manufacturer, you will find a long list of companies each offering different capabilities, price, delivery, and quality. You might find that a company provides exceptional quality and price for a 4 layer board, but they can’t deliver the quality you need for a more complex design. And, this could also work the other way – a PCB manufacturer with advanced capabilities might not be offer competitive pricing for a 2 layer board.

To help you with your search, we have compiled this list of printed circuit board manufacturers and have provided an overview of their capabilities and services.

PCB Laminate and Prepreg Materials

Camptech Circuits

At Camptech, we believe that responsibility, honesty, competence, and accountability are the primary and pivotal factors in leading and managing our organization. In developing and maintaining the trust of our customers, employees, and suppliers we have shaped and maintain a system of corporate governance that is ingrained in the day-to-day dealings of the company’s management and employees.

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Delivery


  • 4 to 10 days for prototypes
  • 5 days to 4 weeks for production

Min. Trace Width


  • 3 mil

Min. Gap Between Traces


  • 3 mil

Min. SMT Pitch


  • 5 mil

Min. Mechanical Hole Size


  • 6 mil

Minimum Laser Hole


  • 2 mil

 

PCB drill hole size

 

Scoring Tolerance


  • +/- 10 mil

Routing Tolerance


  • +/- 5 mil

Outer Copper Thickness (finished)


  • 1 oz. to 20 oz.

Blind/Buried Vias


  • Yes

A blind via is a connection from an outer layer of a board to one or more inner layers without exiting out the opposite side of the board.

Blind, buried, through-hole PCB vias

 

Aspect Ratio


  • 12:1

Electrical Test


  • Flying Probe
  • Test Fixture

Surface Finish


  • HASL
  • Lead-Free HASL
  • ENIG
  • ENEPIG
  • Immersion Silver
  • Immersion Tin
  • OSP
  • Hard Gold

Number of Layers


A PCB is made up of layers of copper foil and insulating material, laminated to the substrate.

 

Board Types


Legend (Silkscreen)


  • White
  • Black
  • Yellow
  • Custom Colors

Components locations and other markings on a PCB are identified using a silkscreen legend.

PCB silkscreen legend

 

Stacked Microvias


  • Yes

Via in Pad


  • Yes

Controlled Impedance & Simulations


  • Yes

Plugged Vias


  • Solder mask
  • Non-Conductive Epoxy

Solder Mask Colors


  • Green
  • Red
  • Blue
  • Black
  • White
  • Yellow
  • Custom colors
  • Peelable Mask

Material


  • FR4
  • High TG FR4
  • Rogers
  • Arlon
  • Aluminum Base
  • Polyimide
  • Ceramic
  • Taconic
  • Megtron, etc.

Other Services


  • Panelization
  • Profiling
  • Routing
  • V-Scoring
  • Edge-Plating
  • Control Depth Holes
  • Countersink Holes
  • Castellation Holes

Advanced Circuits

 

This company is MIL-PRF-31032, MIL-PRF-55110G, AS9100C, ISO 9001:2008 Certified, IPC 6012 Class 2, 3 and 3A Qualified, and ITAR Registered. They operate divisions in Aurora, CO, Tempe, AZ, and Maple Grove, MN.

Advanced Circuits offers printed circuit board manufacturing with two options: Standard & Custom Spec.  Choosing between the two options will depend on your PCB design requirements and specifications.

Here are some highlights of their service:

  • Lead Time: Same Day – 4 Weeks
  • Layer Count: 0 – 40 Layers
  • Cu Weight: Up to 20 oz.
  • Trace/Space: Down to .0025” 
  • Via-In-Pad 
  • Blind & Buried Vias
  • Laser Direct Imaging
  • Oversized Boards
  • Stacked Microvias
  • Down To .3mm Pitch
  • Cavity Boards
  • Buried Chip Resistors
  • Laser-Drilled Microvias

Capabilities

 

SpecificationStandardCustom
Layer Count0 – 10 Layers0 – 40 Layers
Turn TimeSame Day – 5 DaySame Day – 4 Weeks
Quantity Req.1 – 10000+1 – 10000+
MaterialsFR-4FR-4/Rogers/Polyimide/Aluminum Clad/High-Temp. FR4 & others
Plating FinishLead-Free HAL*Electrolytic Hard Gold/Soft Gold/ENIG/Nickel/Immersion Silver
OSP/Leaded & Lead-Free HAL
Cert. / QualificationsIPC Class 2 – A600IPC6012 Class 2-3A / IPC6018 Class 3  MIL-PRF-31032 / MIL-PRF-55110 / ISO
9001:2008 / AS9100C
Board Thickness.031″ / .062″ / .093″ / .125″Full Range Available
Copper  Weight1 oz. Inner / Up to 2 oz. Outer0.5 – 4 oz. Inner / 1 – 20 oz. Outer
Trace/Space5 / 5 MilsDown to 2.75 / 3 Mils
Solder Mask (LPI)GreenVarious Color Options
LegendWhiteVarious Color Options
Min. Hole Size0.010″0.004″
Hole Tolerance+/- 0.005″+/- 0.003″ (Upon Request)
Route Tolerance+/- 0.010″+/- 0.005″ (Upon Request)
Slots/Cutouts/EdgesNon-Plated OnlyPlated / Non-Plated
Plated HolesPlated / Non-PlatedPlated / Non-Plated
UL Markings/DatesYes**Yes**
Lead-Free MarkingsYesYes
Gold FingersYesYes
FiducialsYesYes
ScoringYesYes
ITARYesYes
Castellated HolesXYes
Controlled DielectricXYes
Controlled ImpedanceXYes
Counter SinksXYes
Counter BoresXYes
Blind/Buried ViasXYes
MicroviasXYes
Mask Plugged ViasXYes
Via-in-PadXYes
Etch BackXYes
Tetra EtchXYes
Cover CoatXYes
Cavity ProcessXYes
Laser RoutXYes
LPI LegendXYes
Edge MillXYes
Unique  SerializationXYes
Back DrillingXYes
Controlled Depth DrillXYes

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Sunstone Circuits

Based in Mulino, Oregan, Sunstone Circuits offers PCB fabrication services.

Here is the list of their manufacturing capabilities:

Capabilities

 

Drill Capabilities
Smallest Drill Size0.005″
Largest Drill Size0.250″  +/- 0.002″
    *Note: Holes > 0.250″ are considered cutouts
Positional Tolerance
Control Depth Tolerance+/- 0.0005″
MicroviaYes
Blind / Buried ViaYes
Min. Pad Size (via)via + 0.006″
Min. Pad Size (component)hole + 0.010″
Route Capabilities
Board Size Tolerances (Rout)+/- 0.003″
Board Size Tolerance (Laser)+/- 0.001″
V-Score Web Thickness+/- 0.002″
V-Score Line Width+/- 0.002″
Etch Tolerances
Trace width (of design)+/- 0.0005″
Minimum Trace Width0.002″
Surface Finish
Tin / Lead Solder (HASL)Yes
Immersion SilverYes*
ENIGYes*
Copper OnlyYes*
OSPYes*
ENIPIGYes*
Full Body Hard GoldYes*
Soft Bondable GoldYes*
Lead Free SolderYes*
 *Denotes RoHS Compliant Finish
Board Parameters
Layer Count 0 – 36
Board Thickness0.003″ – 0.187
Copper Weight (finished)0.25 oz – 6 oz
Materials
FR-4 150 Tg (RoHS Compliant)Yes
FR-4 170 Tg (RoHS Compliant)Yes
Rogers RO 3000(R) SeriesNo
Rogers RO 4000(R) SeriesYes
Rogers RT/duroid(R) Series (5000 and 6000 Series)Yes
ArlonYes
PolyflonYes
TaconicYes
Certifications
UL Listed
ITAR Registered
Other Sunstone Capabilities
Controlled Impedance
Full Service CAM Tooling

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Bay Area Circuits

The company has been serving the advanced PCB manufacturing needs of design engineering firms in the commercial, industrial, and medical industries, contract assemblers, and original equipment manufacturers for over 40 years.
Standard CapabilityAdvanced Capability
Overview
Minimum Layer Count11
Maximum Layer Count1630
Trace/Space0.006″0.002″
Finished Hole Size0.010″0.004″
Surface FinishesHASL, ENIG, Hard Gold, Soft Gold (see all below)ENEPIG, OSP, EPIG (see all below)
MaterialsFR-4, High Temp FR-4, Isola, RogersPTFE/Duroid, Polyimide, Flex
Controlled Impedance+/- 10%+/- 5%
Annular Ring0.006″0.003″ Mechanical, 0.001″ Laser
Outer Layers Finished Copper1.5 oz to 2 oz1 oz to 5 oz
Inner Layers Finished Copper0.5 oz to 2 oz0.3 oz to 4 oz
Soldermask ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Silkscreen ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Filled ViasNon-Conductive FillNon-Conductive Fill or Conductive Fill
Smallest Mechanical Drill Diameter0.010″0.004″
Smallest Laser Drill DiameterN/A0.003″
Blind ViasNoYes
Buried ViasNoYes
Aspect Ratio10:0115:01
Plated Hole to Copper0.008″0.005″
Clearance – Copper to Edge of BoardOuter Layer – 0.010″Outer Layer – 0.005″
Inner Layer – 0.015″Inner Layer – 0.005″
Minimum Panel Size9″ x 12″8″ x 8″
Maximum Panel Size18″ x 24″24″ x 36″
Plated SlotsRoutedRouted or Nibbled
Non-Plated SlotsRoutedRouted or Nibbled
Plating in Holes0.0008″0.0015″
Web (or Mask Width)0.006″0.003″
Soldermask Swell0.003″0.001″
Silkscreen Width0.003″0.003″
Inspection & Testing Criteria
IPC Class 2YesYes
IPC Class 3NoYes
Netlist Generation and Netlist CompareYesYes
Trace / Space
Outer Layers (finished copper)1 oz. Cu – Min .005″ Trace/Space1 oz. Cu – Min .002″ Trace/Space
2 oz. Cu – Min .008″ Trace/Space2 oz. Cu – Min .006″ Trace/Space
3 oz. Cu – Min .012″ Trace/Space3 oz. Cu – Min .008″ Trace/Space
4 oz. Cu – Min .014″ Trace/Space4 oz. Cu – Min .012″ Trace/Space
5 oz. Cu – Min .016″ Trace/Space
Inner Layers
0.3 oz Cu – Min .002″ Trace/Space0.5 oz Cu – Min .003″ Trace/Space
0.5 oz Cu – Min .005″ Trace/Space1 oz. Cu – Min .005″ Trace/Space
1 oz. Cu – Min .006″ Trace/Space2 oz. Cu – Min .008″ Trace/Space
2 oz. Cu – Min .012″ Trace/Space3 oz. Cu – Min .0012″ Trace/Space
4 oz. Cu – Min .016″ Trace/Space
Drilling
Min drilled diameter, final board thickness 0.031″ or less0.008″0.004″
Min drilled diameter, final board thickness between 0.031″ and 0.062″0.010″0.006″
Min drilled diameter, final board thickness between 0.062″ and 0.093″0.012″0.010″
Min drilled diameter, final board thickness between 0.093″ and 0.125″0.015″0.012″
Min laser diameter, dielectric thickness less than or equal to 0.004″N/A0.003″
Min laser diameter, dielectric thickness between 0.004″ and 0.005″N/A0.004″
Min laser diameter, dielectric thickness between 0.005″ and 0.007″N/A0.005″
Controlled depth blind viasNoYes, max 0.75:1 aspect ratio
Pre-drilled core blind viasNoYes
Sublamination blind viasNoYes
Build-up technologyNoUp to 4-N-4, Any layer
Buried viasNoYes
Filled viasNon-Conductive fillNon-Conductive or Conductive fill
NibblingNoYes
Largest hole0.247″ plated, 0.250″ non-platedNo maximum
SlotsPlated or non-plated, routedPlated or non-plated, routed or nibbled
Plating in holes0.0008″0.0015″
Plated hole to copper0.008″0.005″
Surface Finish
Hot Air Solder Level (HASL – Lead)YesYes
Hot Air Solder Level (HASL – Lead-Free)YesYes
Electroless Nickel Immersion Gold (ENIG)YesYes
Immersion SilverYesYes
Hard Gold Fingers with ENIGYesYes
Hard Gold Fingers with HASLYesYes
YesYes
Electrolytic Soft GoldYesYes
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)NoYes
Organic Surface Protectant (OSP)YesYes
Bare CopperYesYes
Electroless Palladium Immersion Gold (EPIG)NoYes
Tin NickelNoYes
White TinYesYes
Carbon InkNoYes
Soldermask
ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Finish/TextureSemi-gloss, MatteSemi-gloss, Matte
Tented ViasYesYes
Soldermask Plugged ViasYesYes
Soldermask Thickness over Copper5 micron to 25 micron5 micron to 25 micron
Soldermask Web5 mil3 mil
Soldermask Gap to Pad4 mil2 mil
Copper Ring Under Mask-Defined Pad3 mil1 mil
Peelable SoldermaskNoYes
LPI SoldermaskYesYes
Dry Film SoldermaskNoYes
Silkscreen
ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Minimum Legend Width3 mil3 mil
Space between Silkscreen and Pad5 mil4 mil
Controlled Impedance
Layers0-10 Layers0-30 Layers
Impedance ToleranceSingle-ended +/- 10%Single-ended +/- 5%
Impedance ToleranceDifferential Pairs +/- 10%Differential Pairs +/- 5%
Impedance ToleranceCoplanar Waveguide +/- 10%Coplanar Waveguide +/- 5%
TDR TestingYes, IncludedYes, Included
Board Thickness
1-Layer or 2-LayerMin .015″ | Max .200″Min .008″ | Max .250″
4-LayerMin .020″ | Max .200″Min .015″ | Max .250″
6-LayerMin .031″ | Max .200″Min .025″ | Max .250″
8-LayerMin .047″ | Max .200″Min .031″ | Max .250″
10-LayerMin .062″ | Max .200″Min .040″ | Max .250″
12-LayerMin .062″ | Max .200″Min .047″ | Max .250″
14-LayerMin .062″ | Max .200″Min .054″ | Max .250″
16-LayerMin .062″ | Max .200″Min .062″ | Max .250″
CNC / Routing / Score / Mechanical Rules
Router Bit Size0.078″Min 0.021″, Max. 0.078″
Spacing for Tab Rout Array0.100″
Standard V- Score Angle30°20°, 30°, 45°, 60°
V-Score DepthOne third of board thickness (min 0.010″)
Jump ScoreNoYes, overshoot up to 0.35″
Scoring DirectionVertical and HorizontalRouted Scoring
Bevel Angle20, 30, 45, or 60 Degree Gold Finger BevelMilling/Offset or Recessed Beveling
Countersinks60, 82, 90, 100 Degree Countersink **60, 82, 90, 100 Degree Countersink **
CounterboresYesYes
Edge CastellationsNoCastellated Edges Min .040″
Plated EdgesNoYes
Cross SectionLevel 1Level 1, Level 2, Level 3

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