by admin | Mar 10, 2026 | PCB Assembly, PCB Manufacturing
This article is part of our High-Frequency PCB Fabrication Guide. In high-speed PCB fabrication, differential signaling requires both controlled impedance and matched propagation delay between pairs. Designs can meet single-ended 50-ohm targets while failing... by admin | Mar 10, 2026 | PCB Assembly
This article is part of our High-Frequency PCB Fabrication Guide. In high-frequency PCB fabrication and assembly, signal integrity does not end at layout release. Assembly becomes part of the transmission line. At multi-gigahertz frequencies, solder joint geometry,... by admin | Feb 17, 2026 | PCB Manufacturing
This article is part of our High-Frequency PCB Fabrication Guide. In high-frequency PCB fabrication, S-parameter and TDR (Time-Domain Reflectometry) measurements validate whether a design meets insertion loss, return loss, and impedance targets. A board that passes... by admin | Feb 17, 2026 | PCB Manufacturing
This article is part of our High-Frequency PCB Fabrication Guide. In high-frequency PCB fabrication, uncontrolled via stubs are a common root cause of unexpected insertion loss and return loss degradation. Designs simulate cleanly. Prototypes pass continuity testing.... by admin | Feb 17, 2026 | PCB Manufacturing
This article is part of our High-Frequency PCB Fabrication Guide. Controlled impedance PCB fabrication is the foundation of reliable high-frequency signal transmission. When trace impedance is tightly controlled, signal reflections decrease, insertion loss becomes...
