Differential Pair Impedance: PCIe Gen 5 and Glass Weave Control
High-Speed PCB Assembly Process for High-Frequency PCBs
This article is part of our High-Frequency PCB Fabrication Guide. In high-frequency PCB fabrication and assembly, signal integrity does not end at layout release. Assembly becomes part of the transmission line. At multi-gigahertz frequencies, solder joint geometry,...
PCB S-Parameter and TDR Validation for High-Frequency PCBs
Back-Drilled PCB Via Design for High-Frequency PCBs
Controlled Impedance PCB Fabrication: Stack-Up, Tolerance, and Validation
High-Frequency PCB Fabrication and Assembly – First-Pass Production Success
Warpage, Bow, and Twist: The Real Cause of PCB Assembly Defects
TLDR: Most PCB assembly defects start as warpage from design and lamination. Balance copper and symmetry, match materials, keep cutouts and mass distribution even, align with your fabricator’s press plan, tune reflow gradients, and measure flatness early. Tighten...
Invisible Cracks in PCB Assembly: Why Pad Cratering is the Silent SCRAP Killer
Stop Overpaying for PCB Assembly: Proven Tactics to Cut Cost Without Cutting Quality
PCB Assembly Failure Data: What Every PCB Designer Needs to Know
TL;DR – Key Takeaways 60–90% of PCB failures are solder paste related, not component orientation. World-class assembly achieves under 50 DPMO, use this when evaluating partners. Component orientation is only ~20% of failures, still important to fix. Tantalum...