by admin | Sep 15, 2025 | PCB Assembly, PCB Manufacturing
TL;DR: Pad cratering = tiny, subsurface cracks under copper pads. It’s hard to see and a major cause of “mystery” PCB assembly scrap. The fixes: pick pad-crater-resistant laminates, use the right pad/mask geometry, and minimize flex in handling, depanel, and ICT. On... by admin | Aug 26, 2025 | PCB Manufacturing
TL;DR – Key Takeaways 60–90% of PCB failures are solder paste related, not component orientation. World-class assembly achieves under 50 DPMO, use this when evaluating partners. Component orientation is only ~20% of failures, still important to fix. Tantalum... by admin | Aug 14, 2025 | PCB Assembly, PCB Design, PCB Manufacturing
TL;DR: If your PCB fiducials are poorly designed or placed, your pick-and-place accuracy will suffer. This guide explains the essentials of fiducial design so your assembly partners deliver consistent, high-quality results. Why Fiducials Matter Fiducials are the... by admin | Jul 30, 2025 | PCB Manufacturing
🔍 TL;DR – PCB Impedance Control Begins with Stackup Collaboration PCB impedance control starts upstream — with the stackup. Your design tool is helpful, but it can’t build your board. Real stackup collaboration = faster builds, better margins, and fewer surprises.... by admin | Jul 10, 2025 | PCB Manufacturing
Published: [Date] | Reading Time: 2 minutes TL;DR Never start layout until the stackup is finalized. Involve your fabricator early—they know what’s possible. Keep one version of the stackup with all critical info shared with your team. When Stackups Go Wrong, You Pay... by admin | Jun 3, 2025 | PCB Design, PCB Manufacturing, Stack-up
Signal integrity and thermal performance don’t start at the layout stage—they start with your stackup. Here’s how poor layer planning quietly breaks your 6-layer design. The Hidden Failure Path in 6-Layer Boards You can route it cleanly. Simulate it thoroughly. Drop...
