by admin | Mar 10, 2026 | PCB Assembly, PCB Manufacturing
This article is part of our High-Frequency PCB Fabrication Guide. In high-speed PCB fabrication, differential signaling requires both controlled impedance and matched propagation delay between pairs. Designs can meet single-ended 50-ohm targets while failing... by admin | Feb 17, 2026 | PCB Manufacturing
This article is part of our High-Frequency PCB Fabrication Guide. In high-frequency PCB fabrication, S-parameter and TDR (Time-Domain Reflectometry) measurements validate whether a design meets insertion loss, return loss, and impedance targets. A board that passes... by admin | Feb 17, 2026 | PCB Manufacturing
This article is part of our High-Frequency PCB Fabrication Guide. In high-frequency PCB fabrication, uncontrolled via stubs are a common root cause of unexpected insertion loss and return loss degradation. Designs simulate cleanly. Prototypes pass continuity testing.... by admin | Feb 17, 2026 | PCB Manufacturing
This article is part of our High-Frequency PCB Fabrication Guide. Controlled impedance PCB fabrication is the foundation of reliable high-frequency signal transmission. When trace impedance is tightly controlled, signal reflections decrease, insertion loss becomes... by admin | Feb 17, 2026 | PCB Manufacturing
High-frequency PCB fabrication and assembly become precision engineering problems above 10 GHz. Controlled impedance, material selection, via design, and S-parameter validation are not layout features. They are manufacturing tolerances that determine whether a design... by admin | Oct 27, 2025 | PCB Manufacturing
TLDR: Most PCB assembly defects start as warpage from design and lamination. Balance copper and symmetry, match materials, keep cutouts and mass distribution even, align with your fabricator’s press plan, tune reflow gradients, and measure flatness early. Tighten...
