PCB Fabrication Processes
Before diving into the comparison table, let’s briefly explain each PCB fabrication process:
1. Subtractive Process
This is the most traditional method of PCB fabrication. It starts with a fully copper-clad board and removes unwanted copper through etching, leaving only the desired circuit patterns. It’s called “subtractive” because material is removed from the initial board.
2. Additive Process
In contrast to the subtractive method, the additive process builds up the copper traces on a bare substrate. It typically starts with a thin seed layer of copper and selectively adds copper only where it’s needed for the circuit. This method is known for its ability to create very fine lines and spaces.
3. Semi-Additive Process
This method combines elements of both subtractive and additive processes. It usually begins with a thin layer of copper on the substrate, then selectively builds up additional copper where needed, and finally uses a brief etching step to remove the thin initial copper layer from non-circuit areas. This process offers a balance between the advantages of both additive and subtractive methods.
Each of these processes has its own strengths and is suited to different types of PCB designs and production requirements. The interactive table below will help you compare these processes in detail across various important factors.
By examining various aspects such as Basic Principle, Common Methods, Starting Material, Copper Application, Etching Required, Line Width/Spacing, Copper Thickness Control, Material Waste, Cost, Environmental Impact, Typical Applications, Production, Speed – the table allows you to explore the advantages and disadvantages of each process.
You can customize your view by selecting specific processes using the buttons or toggling different features with the checkboxes, making it easier to focus on what matters most to you. Whether you’re an engineer, designer, or manufacturer, this table simplifies the decision-making process by presenting critical information in a user-friendly format.
Feature | Subtractive | Additive | Semi-Additive |
---|---|---|---|
Basic Principle | Removes unwanted copper from a fully plated board | Builds up copper only where needed | Combines aspects of both subtractive and additive |
Common Methods | Panel Plating, Pattern Plating | Fully Additive Process (FAP) | Modified Semi-Additive Process (mSAP), Semi-Additive Process (SAP) |
Starting Material | Fully copper-clad laminate | Bare laminate with seed layer | Thin copper-clad laminate |
Copper Application | Full layer applied, then selectively removed | Selectively deposited only where needed | Thin base layer, then selectively built up |
Etching Required | Significant | Minimal or none | Minimal (flash etching) |
Line Width/Spacing | Limited by etching (typically >75μm) | Very fine (<25μm possible) | Fine (<50μm possible) |
Copper Thickness Control | Challenging, especially for high-aspect-ratio features | Excellent | Very good |
Material Waste | High | Low | Low to Moderate |
Cost | Lower for simple boards, higher for complex | Higher initial cost, economical for complex boards | Moderate, balances cost and performance |
Environmental Impact | Higher due to etching chemicals | Lower, minimal chemical waste | Moderate, less waste than subtractive |
Typical Applications | General-purpose PCBs, larger feature sizes | High-density interconnect (HDI), flexible circuits | Smartphones, tablets, high-performance computing |
Production Speed | Faster for simple designs | Can be slower, especially for thick copper | Moderate to fast |
Advantages |
- Well-established process - Cost-effective for simple boards - Good for thick copper layers |
- Excellent for fine lines and spaces - Minimal material waste - Superior copper thickness uniformity |
- Good balance of fine lines and cost - Suitable for high volume production - Better than subtractive for fine features |
Disadvantages |
- Limited fine-line capability - High material waste - Challenges with thick boards |
- Higher initial cost - Slower process - Limited availability |
- More complex process - Requires more advanced equipment - Not as fine-featured as full additive |