PCB Fabrication Processes Comparison

PCB Fabrication Processes

This interactive table provides a comprehensive comparison of key PCB fabrication processes, including Subtractive, Additive, and, Semi-Additive methods.

Before diving into the comparison table, let’s briefly explain each PCB fabrication process:

1. Subtractive Process

This is the most traditional method of PCB fabrication. It starts with a fully copper-clad board and removes unwanted copper through etching, leaving only the desired circuit patterns. It’s called “subtractive” because material is removed from the initial board.

2. Additive Process

In contrast to the subtractive method, the additive process builds up the copper traces on a bare substrate. It typically starts with a thin seed layer of copper and selectively adds copper only where it’s needed for the circuit. This method is known for its ability to create very fine lines and spaces.

3. Semi-Additive Process

This method combines elements of both subtractive and additive processes. It usually begins with a thin layer of copper on the substrate, then selectively builds up additional copper where needed, and finally uses a brief etching step to remove the thin initial copper layer from non-circuit areas. This process offers a balance between the advantages of both additive and subtractive methods.

Each of these processes has its own strengths and is suited to different types of PCB designs and production requirements. The interactive table below will help you compare these processes in detail across various important factors.

By examining various aspects such as Basic Principle, Common Methods, Starting Material, Copper Application, Etching Required, Line Width/Spacing, Copper Thickness Control, Material Waste, Cost, Environmental Impact, Typical Applications, Production, Speed – the table allows you to explore the advantages and disadvantages of each process.

You can customize your view by selecting specific processes using the buttons or toggling different features with the checkboxes, making it easier to focus on what matters most to you. Whether you’re an engineer, designer, or manufacturer, this table simplifies the decision-making process by presenting critical information in a user-friendly format.

This is an interactive table. You can select/deselect processes using the buttons below and toggle features using the checkboxes.
FeatureSubtractiveAdditiveSemi-Additive
Basic PrincipleRemoves unwanted copper from a fully plated boardBuilds up copper only where neededCombines aspects of both subtractive and additive
Common MethodsPanel Plating, Pattern PlatingFully Additive Process (FAP)Modified Semi-Additive Process (mSAP), Semi-Additive Process (SAP)
Starting MaterialFully copper-clad laminateBare laminate with seed layerThin copper-clad laminate
Copper ApplicationFull layer applied, then selectively removedSelectively deposited only where neededThin base layer, then selectively built up
Etching RequiredSignificantMinimal or noneMinimal (flash etching)
Line Width/SpacingLimited by etching (typically >75μm)Very fine (<25μm possible)Fine (<50μm possible)
Copper Thickness ControlChallenging, especially for high-aspect-ratio featuresExcellentVery good
Material WasteHighLowLow to Moderate
CostLower for simple boards, higher for complexHigher initial cost, economical for complex boardsModerate, balances cost and performance
Environmental ImpactHigher due to etching chemicalsLower, minimal chemical wasteModerate, less waste than subtractive
Typical ApplicationsGeneral-purpose PCBs, larger feature sizesHigh-density interconnect (HDI), flexible circuitsSmartphones, tablets, high-performance computing
Production SpeedFaster for simple designsCan be slower, especially for thick copperModerate to fast
Advantages - Well-established process
- Cost-effective for simple boards
- Good for thick copper layers
- Excellent for fine lines and spaces
- Minimal material waste
- Superior copper thickness uniformity
- Good balance of fine lines and cost
- Suitable for high volume production
- Better than subtractive for fine features
Disadvantages - Limited fine-line capability
- High material waste
- Challenges with thick boards
- Higher initial cost
- Slower process
- Limited availability
- More complex process
- Requires more advanced equipment
- Not as fine-featured as full additive