High processing temperatures are an essential consideration when selecting a PCB laminate. Elevated temperatures cause delamination, which results from the weakening of the material’s copper/dielectric bond.

PCB materials used for a lead-free circuit assembly need to endure high re-flow oven and rework temperatures. So, these materials’ thermal performance and reliability are necessary to result in a properly assembled PCB.

High re-flow oven temperatures can diminish the strength of the copper/dielectric bond in standard PCB laminates, which affects the reliability of the PCB. Lead-free laminates are engineered to maintain their electrical and mechanical stability at raised processing temperatures.

Lead free PCB material comparison table

When your design calls for a lead-free PCB, a careful comparison of the electrical and mechanical characteristics of PCB materials can help you select the right base material for your PCB.

This table provides you with quick access to important information you need for your design.

 

Product ITEQ
ITEQ180A
Isola
370HR
Isola
185HR
Isola
IS415
Ventec
VT47
Material Type High Tg Epoxy High Tg Epoxy High Tg Epoxy High Tg Epoxy High Tg Epoxy
Halogen Free No No No No No
Flammability UL94 V-0 V-0 V-0 V-0 V-0
Glass Transition Temp Tg – ºC 175 180 180 200 180
Td (Decomposition Temp) by TGA – ºC 345 340 340 370 355
Dk 1 GHz 4.17 4.04 3.71 4.3
Dk 2-3 GHz 4.30 4.04 4.01 3.72
Dk 10-12 GHz 4.10 3.92 3.88 3.71
Df 1 GHz 0.0150 0.0192 0.0131 0.016
Df 2-3 GHz 0.015 0.021 0.0200 0.0120
Df 10-12 GHz 0.016 0.025 0.0236 0.0125
Moisture Absorption (%) 0.10% 0.15% 0.15% 0.15% 0.12%
CTE X-Axis (PPM/ºC) Pre Tg 11 to 13 13 13 13 11
CTE Y-Axis (PPM/ºC) Pre Tg 13 to 15 14 14 13 13
CTE Z-Axis (ppm/ºC) Pre Tg 45 45 40 45 45
Peel Strength – 1oz (35μm) – N/mm 1.40 1.25 1.04 1.225 1.3
T260 – minutes 60 60 60 >60
T288 – minutes 20 30 >15 >20 >30
Flexural strength – N/mm2 X – 500 to 530
Y- 410 to 440
X – 620.53
Y – 530.90
X – 669.48
Y – 372.32
X – 511.59
Y – 355.77
X – 500
Y – 420
Young’s modulus – N/mm2 X – 25,814
Y – 21,912
X – 25,993
Y – 23008
X – 24,338
Y – 22063
Tensile strength – N/mm2 X – 385
Y – 245
X – 368
Y – 246
X – 302
Y – 218
Volume Resistivity – MΩ/cm
A. After moisture resistance
B. At elevated temperature
1×109 a) 3.0 x 108
b) 7.0 x 108
a) 3.0 x 108
b) 7.0 x 108
a) 3.81 x 108
b) 3.90 x 108
a) 5x 108
Dielectric strength – kV >50 >50 >50 60
Surface Resistivity – MΩ
A. After moisture resistance
B. At elevated temperature
1×108 a) 3.0 x 106
b) 2.0 x 108
a) 3.0 x 106
b) 2.0 x 108
a) 2.81 x 106
b) 2.64 x 108
a) 5 x 107
Dimensional stability – mm/M
Thermal Conductivity – W/mK 0.40 0.40 0.40 0.50
% Z-axis Expansion (50-260ºC) (CTE Z Axis) 2.70% 2.8% 2.7% 2.8% 2.3%

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