PCB Footprint Checklist Senior Hardware Engineers Use to Prevent Assembly Failures
Pre-Release Footprint Audit That Ensures Assembly Success.
This checklist covers what your EDA tools do not check - the 70% of footprint decisions that cause assembly failures, rework, and field returns. 50+ verification points. Numeric tolerances. Nine failure modes with pass/fail criteria. If a footprint passes, it is released. If it does not, it is not.
Critical
Tier 1: Non-Negotiable Assembly Risk Controls
If any item in this section fails, the footprint is not released.
1. Datasheet and Source Control
2. Pad Geometry Accuracy
3. Paste Volume Control
4. Thermal Balance
5. Solder Mask Strategy
6. 3D and Mechanical
Contextual
Tier 2: Context-Dependent Controls
7. Fine Pitch (≤ 0.5 mm)
8. QFN Exposed Pads
9. BGA Pads and Escapes
10. High-Speed / RF
Process
Library Governance
11. Footprint Reuse
12. Naming and Metadata
13. Deviations
14. Review
Final Gate
Pre-Release Failure Mode Audit
Each failure mode requires both verification points to pass.
Tombstoning
QFN Float / Voiding
Head-in-Pillow (BGA)
Bridging
Weak Solder Fillet
Open Joint
Assembly Inspection Failure
Second-Source Breakage
Mechanical Interference
Access the PDF version of this checklist
Download, print, and use during your footprint design reviews.
Download NOW ↓