Rogers 4350 PCB laminate compared to Panasonic Megtron6 PCB material

PCB material selection is a crucial component in the performance of a circuit assembly.  In the past, typically FR4 was specified. But, with high-speed designs, the use of the correct laminate is critical. The use of a material with a lower dielectric constant (Dk) is advisable and preferred. This not only ensures the best signal performance, but it will also minimize any signal distortion or phase jitter of the signal.

Choosing the material for your PCB must take into consideration these factors:

  • Mechanical strength
  • Thermal characteristics
  • Electromagnetic loss
  • Environmental stability of the material in varying humidity and temperature settings
  • RF-power handling capability
  • Compatibility and use in hybrid constructions
  • Cost

Rogers RO4350B Laminates

The Rogers RO4350B laminates provide a low dissipation factor (Df), which boosts the power delivered and therefore enables high-power applications. Also, their low dielectric constant (Dk) permit rapid signal propagation. RO4350B laminates do not call for the special through-hole treatments or handling procedures as PTFE based materials. These materials are UL 94 V-0 rated for active devices and high power RF designs.

Summary of features:

  • Dk of 3.48 +/- 0.05
  • Dissipation factor of 0.0037 at 10 GHz
  • Low Z-axis coefficient of thermal expansion at 32 ppm/°C

Benefits

  • Processes like FR-4 at lower fabrication cost
  • Competitively priced
  • Excellent dimensional stability

Standard Thickness:

  • 0.004” ( not available in panel sizes larger than 24”x18”)
  • 0.0066”
  • 0.010”
  • 0.0133”
  • 0.0166”
  • 0.020”
  • 0.030”

Panasonic MEGTRON6 – R-5775 Laminates

The MEGTRON6 laminates are high speed, ultra-low loss materials with impressive HDI and thermal performance

Summary of features:

  • Dk 3.4, Df 0.004@12GHz
  • Tg (DMA) 185°C
  • T288(with copper) >120min.

    Find out the main differences between 2 of the most commonly used high-frequency, high-speed laminates; Rogers 4350B and Panasonic Megtron 6.

     

    Property Rogers RO4350B Condition Test Method Panasonic R-5775(N) – Low Dk glass cloth version Panasonic R-5775 – Normal glass cloth Test Method
    Dielectric Constant (Dk) 3.48 ± 0.05 10 GHz/23°C IPC-TM-650 2.5.5.5
    Clamped Stripline

    3.40 (@1 GHZ)

    3.35 (@12 GHZ)

    3.6 (@12 GHZ) IPC-TM-650
    2.4.24.1
    Dissipation Factor tan (Df) 0.0037
    0.0031
    10 GHz/23°C
    2.5 GHz/23°C
    IPC-TM-650 2.5.5.5

    0.002 (@1 GHZ)

    0.004 (@12 GHZ)

    0.002 (@1 GHZ)

    0.004 (@12 GHZ)

    IPC-TM-650
    2.5.5.9
    Thermal Coefficient +50 ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5 45 ppm/°C 45 ppm/°C IPC TM-650 2.4.24
    Volume Resistivity 1.2 X 1010 MΩ•cm COND A IPC-TM-650 2.5.17.1 1 X 109MΩ•cm 1 X 109MΩ•cm IPC TM-650 2.5.17.1
    Surface Resistivity 5.7 X 108 COND A IPC-TM-650 2.5.17.1 1 X 108 1 X 108 IPC TM-650 2.5.17.1
    Electrical Strength Z- axis 31.2 KV/mm 0.51mm (0.020”) IPC-TM-650 2.5.6.2
    Tensile Modulus X- 16,767 MPa
    X- 14,153 MPa
    RT ASTM D638     18,000     19,000 JIS C 6481
    Tensile Strength X- 203 MPa
    Y- 130 MPa
    RT ASTM D638
    Flexural Strength 255 MPa IPC-TM-650 2.4.4
    Dimensional Stability <0.5 mm/m after etch
    +E2/150°C
    IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion(X) 10 ppm/°C -55 to 288°C IPC-TM-650 2.4.41 14-16 @ 260°C 14-16 @ 260°C IPC-TM-650
    2.4.24
    Coefficient of Thermal Expansion(Y) 12 ppm/°C -55 to 288°C IPC-TM-650 2.4.41 14-16 @ 260°C 14-16 @ 260°C IPC-TM-650
    2.4.24
    Coefficient of Thermal Expansion(Z) 32 ppm/°C -55 to 288°C IPC-TM-650 2.4.41 45 @ 260°C 45 @ 260°C IPC-TM-650
    2.4.24
    Tg >280 °C TMA A IPC-TM-650 2.4.24.3 185 185 DSC
    Td 390 °C TGA ASTM D3850 410 410 TGA
    Thermal Conductivity 0.69 W/m/°K 80°C ASTM C518
    Moisture Absorption 0.06% 48 hrs immersion
    0.060” sample Temperature 50°C
    ASTM D570 0.14% 0.14% IPC-TM-650
    2.6.2.1
    0.030″ sample
    Density 1.86 gm/cm3 23°C ASTM D792
    Copper Peel Strength 0.88 N/mm after solder float 1 oz. EDC Foil IPC-TM-650 2.4.8 0.8 kN / m 0.8 kN / m IPC-TM-650
    2.4.8
    Flammability 94V-0 UL 94 94V-0 UL 94V-0
    Lead-Free Process Compatible Yes
    Time to delamination at 288°C with copper >120 min >120 min IPC-TM-650
    2.4.24.1

     

    In sum

    As a part of the design process, PCB designers need to specify materials that offer an optimal or near-optimal price-performance ratio. To achieve this task PCB materials need to be researched, analyzed, evaluated, and selected.

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