PCB Fabrication Services

Camptech II Circuits specializes in PCB fabrication, producing rigid, flex, rigid-flex, metal-core, and hybrid printed circuit boards for prototype and production programs. Serving engineering and manufacturing teams across the United States and Canada.

Questions? Contact our team at info@camptechii.com or call (905) 477-8790

PCB Fabrication Examples

High-quality PCB fabrication across rigid, flex, and rigid-flex designs

Rigid PCB fabrication with black solder mask and surface-mount component pads

Black Solder Mask PCBs

Multi-layer rigid PCBs with black solder mask

Flex PCB fabrication showing etched copper traces on flexible polyimide substrate

Flexible PCB

Multi-layer flexible circuit board

Rigid-flex PCB fabrication featuring flexible tail and compact rigid board sections

Rigid-Flex PCB

Complex rigid-flex circuit board construction

Rigid PCB fabrication with blue solder mask, ENIG finish, and fine-pitch pads

Blue Solder Mask PCB

High-density PCB with blue solder mask

Rigid-flex PCB fabrication with flexible interconnect and high-density component layout

Advanced Rigid-Flex

Multi-zone rigid-flex PCB assembly

Complex multi-layer PCB fabrication featuring dense routing, controlled impedance areas, and multiple connector interfaces

Complex Multi-Layer PCB

High-layer-count PCB with controlled impedance

FABRICATION CAPABILITIES

PCB Fabrication Scope

Camptech fabricates printed circuit boards for designs that require controlled materials, tight tolerances, and repeatable fabrication results.

Board Types Supported

Rigid PCBs
Flexible PCBs
Rigid-flex PCBs
Metal-core PCBs
Hybrid constructions

Layer Counts

Rigid PCBs
1–30 layers
Flexible PCBs
1–10 layers
ADVANCED MATERIALS

Materials and Stackup Capabilities

Camptech fabricates PCBs using standard and advanced laminate systems for high-speed, high-reliability, and power applications.

Laminate Materials

FR-4 and high-TG FR-4
Rogers, Arlon, Taconic, Megtron
Polyimide and ceramic materials
Aluminum-base laminates

Stackup and Impedance Control

Controlled-impedance fabrication
±10% tolerance
Minimum dielectric thickness
2 mil

PRECISION FABRICATION

Geometry, Trace, Space, and Via Capabilities

Camptech fabricates PCBs with tight geometry control for high-density and high-current designs.

Trace and Spacing Limits

Minimum Trace Width
3 mil
Minimum Spacing
3 mil
Inner-Layer Trace & Space
0.5 oz 3 mil
1 oz 3.75 mil
2 oz 5 mil
3 oz 9 mil
4 oz 12 mil
Outer-Layer Trace & Space
0.5 oz 3 mil
1 oz 4.5 mil
2 oz 7 mil
3 oz 9 mil
4 oz 14 mil
5–20 oz Contact Camptech

Via Structures

Through vias, blind vias, buried vias
Stacked microvias
Via-in-pad supported
Minimum mechanical hole size: 6 mil
Laser-drilled vias: 4–6 mil
Maximum aspect ratio: 16:1

Registration and Tolerances

Layer-to-Layer Registration
±3 mil
Routing Tolerance
±5 mil
FINISH OPTIONS

Solder Mask, Silkscreen, and Surface Finishes

Camptech fabricates PCBs with controlled solder mask registration, durable legends, and a wide range of surface finishes to meet assembly and reliability requirements.

Solder Mask

Processes
Liquid photoimageable & laser direct imaging
Registration Tolerance
Up to ±2 mil
Minimum Solder Mask Bridge
Green 4 mil
Non-green colors 5 mil
Over copper 8 mil
Colors
Green, red, blue, black, white, yellow, custom
Special Options
Peelable solder mask available

Silkscreen (Legend)

Colors
White, black, yellow, custom
Usage
Reference designators & orientation markings

Surface Finishes

HASL and lead-free HASL
ENIG and ENEPIG
Immersion silver and immersion tin
OSP
Hard gold
ADVANCED FEATURES

Advanced Via, Drilling, and Mechanical Features

Camptech fabricates PCBs with advanced via structures and mechanical features required for dense, high-reliability designs.

Blind and Buried Vias

Minimum Epoxy-Filled Via
4 mil
Maximum Aspect Ratio
10:1
Fill Options
Conductive and non-conductive epoxy fills

Plugged Vias

Plug Options
Solder-mask or non-conductive epoxy
Finished Hole Sizes
4 mil to 22.5 mil

Drilling and Pad Limits

Minimum Laser Via Pad
10 mil
(for 4 mil laser-drilled vias)
Minimum Mechanical Drill Pad
16 mil
(for 8 mil drilled holes)
Minimum BGA Pad Size
7 mil

Mechanical Features

Panelization and profiling
Routing and V-scoring
Edge plating
Controlled-depth and countersink holes
Castellated holes
QUALITY ASSURANCE

Electrical Test, Inspection, and Fabrication Quality Controls

Camptech fabricates PCBs with documented inspection and electrical test processes to verify fabrication accuracy before shipment.

Electrical Testing

Flying probe testing
Bed-of-nails test fixtures

Inspection and Verification

Layer-to-layer registration verification
Solderability testing
Impedance control testing

Quality Documentation Provided

Cross-section analysis report
Final inspection report
Electrical test report
Impedance control test report
Solderability test report
TRUSTED BY ENGINEERS

Why Engineering Teams Choose Camptech for PCB Fabrication

Engineering and manufacturing teams rely on Camptech for PCB fabrication when design requirements extend beyond standard tolerances, materials, and stackups.

Key Reasons

Fabrication capabilities defined by published limits, not marketing claims
Tight control of geometry, layer registration, and controlled impedance
Support for advanced materials and complex stackups
Electrical testing and documented inspection on every build
Fabrication data reviewed before release to prevent avoidable errors
Consistent results across prototype and production runs

Customer Feedback

"

We've purchased PCBs from Camptech II Circuits for the past five years. Our boards are high complexity, 6 to 20 layers, with controlled impedance and gigabit differential signals. Quality, pricing, and communication have been consistently strong.

Victor Tsonev
RF Engineer, Cisco Systems
"

Camptech II Circuits has been a reliable PCB supplier for over 15 years, supporting our needs from prototyping through production. Quality is consistent, pricing is competitive, and jobs are delivered on time.

Keenson Lam
Purchaser, Absopulse Electronics
"

High-quality PCB fabrication across a wide range of board styles and requirements. Strong communication and very responsive support.

Brandon Dudley
Electrical Technologist
"

Camptech has been a preferred PCB fabrication partner for almost 30 years. From quoting through production, they consistently deliver. I'm happy to recommend them.

Mary Johnson
Purchasing Manager
ORDERING INFORMATION

Lead Times, Production Scope, and Ordering

Camptech fabricates PCBs for both prototype and production requirements, with lead times matched to design complexity and build volume.

Typical Lead Times

Prototype Fabrication
2–10 business days
Production Fabrication
5 days to 4 weeks

Production Scope

Prototype quantities
Low-, mid-, and production-volume builds
Repeat and scheduled fabrication programs

Ordering and Data Submission

Gerber, drill, and fabrication drawings accepted
Stackup and impedance requirements reviewed before release

Ready to Start Your PCB Fabrication Project?