Here is our list of the 8 PCB manufacturers
As a start, we have compiled the table below, which shows some of the manufacturing capabilities and information about customer reviews for eight primary PCB manufacturers.
Criteria | Advanced Circuits/4pcb.com | Sunstone Circuits | Bay Area Circuits | allpcb.com | jlcpcb.com | pcbgogo.com | pcbway.com | Camptech |
# of Google reviews | 6 | 9 | 3 | 12 reviews on Trustpilot | 151 Facebook reviews | 17 reviews on Trustpilot | 57 reviews on Trustpilot | 10 |
Avg. review rating (out of 5) | 3.2 | 4.2 | 5 | 3.2 | 4.5 | 3.6 | 3.8 | 4.6 |
Extensiveness/depth of the information offered in reviews | Poor | Fair | Fair | Good | Good | Good | Good | Good |
Overall do the reviews seem trustworthy | No | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Controlled impedance | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Minimum hole size | 0.1 mm | .15 mm | .08 mm | 0.2 mm | 0.2 mm | .15 mm | 0.1 mm | 0.05 mm |
Trace width/Trace Spacing | 3 mil | 3 mil | 3 mil/3 mil | 4 mil | 5 mil/5mil | 3 mil/3 mil | 3 mil/3 mil | 3 mil/3 mil |
Aspect ratio | 12:1 | 15:1 | 12:1 | 20:1 | 12:1 | |||
Routing tolerance | ± .15 mm | ± .08 mm | ± 0.15 mm | ± 0.2 mm | ± 0.2 mm | ± .15 mm | ||
Min. SMT Pitch | 0.25 mm | .1mm | 0.4 mm | .15 mm | ||||
Blind & Buried vias | Yes | Yes | Yes | Yes | No | Yes | Yes | Yes |
Via in pad | Yes | No | Yes | Yes | Yes | |||
Stacked micro-vias | Yes | Yes | Yes | No | Yes | Yes | Yes | |
Flexible PCB | No | No | No | Yes | No | Yes | Yes | Yes |
Location | U.S | U.S | U.S | China | China | China | China | Canada |
Overall score based on fabrication capabilities, quality & customer service reviews (10 being highest) | 6 | 6.5 | 7 | 7 | 7 | 8 | 8 | 9 |
Advanced Circuits/4pcb.com | Sunstone Circuits | Bay Area Circuits | allpcb.com | jlcpcb.com/ | pcbgogo.com | pcbway.com | Camptech |
Camptech Circuits
For over 40 years, electronics manufacturers have trusted and relied on Camptech II Circuits’ expertise and production capabilities to manufacture their printed circuit boards. Whether your PCB is a simple one layer design or you require a multilayer board with controlled impedance and stacked microvias built, you can depend on us to manufacture your circuit boards with affordable pricing.
Camptech’s PCB Manufacturing Capabilities
Delivery
- 2 to 10 days for prototypes
- 5 days to 4 weeks for production
PCB Types
- Rigid
- Flex
- Rigid-Flex
- Metal Core
- Hybrid
Silkscreen
- White
- Black
- Yellow
- Custom Colors

Soldermask
- Solder mask registration tolerance – up to +/-0.002”
- Minimum width of solder mask bridge: 4mil (Green), 5mil (other color); 8 mil on copper area
Soldermask colors
- Green
- Red
- Blue
- Black
- White
- Yellow
- Custom colors
- Peelable Mask
Soldermask types
- Liquid Photo Imageable (LPI)
- Laser Direct Imaging (LDI)
Surface Finishes
Aspect Ratio
The Aspect Ratio is defined as the scale of board thickness compared to the diameter of the drilled via. If you have a board with a 0.24″ thickness and a via with a 0.02″ diameter, the aspect ratio is 12:1. The higher this ratio, the increased plating that will be around a via compared to inside the via.
Laminate Materials
- FR4
- High TG FR4
- Rogers
- Arlon
- Aluminum Base
- Polyimide
- Ceramic
- Taconic
- Megtron, etc.
Blind/Buried Vias
- Minimum epoxy filled via hole diameter – 4 mil
- Maximum aspect ratio for filled vias – 10:1
- Epoxy fill types – conductive & non-conductive
A blind via is a connection from an outer layer of a board to one or more inner layers without exiting out the opposite side of the board.
Plugged Vias
- Solder mask
- Non-Conductive Epoxy
- Finished hole size for via filled with resin: 4mil to 22.5 mil>
Routing Tolerance
- ± 5 mil
Inner Layer Copper
Inner copper layer | Minimum trace/space |
0.5 oz. | 0.003” |
1 oz. | 0.00375” |
2 oz. | 0.005” |
3 oz. | 0.009” |
4 oz. | 0.012” |
Scoring Tolerance
- ± 10 mil
Outer Layer Copper
Outer copper layer | Minimum trace/space |
0.5 oz. | 0.003” |
1 oz. | 0.0045” |
2 oz. | 0.007” |
3 oz. | 0.009” |
4 oz. | 0.014” |
5 oz to 20 oz. | Please contact us |
Stacked Microvias
- Yes
Number of Layers
- 1 to 30 Layers Rigid PCBs
- 1 to 10 Layer Flexible PCBs
A PCB is made up of layers of copper foil and insulating material, laminated to the substrate.
Pad (Ring)
- Min pad size for laser drilling – 10 mil (4 mil laser via)
- Min pad size for mechanical drilling – 16 mil (8 mil drilling)
- Min BGA pad size – 7 mil
Traces
- Minimum trace width – 3 mil
- Minimum trace spacing – 3 mil
Controlled Impedance & Simulations
- ± 10% tolerance
Hole Sizes
Minimum mechanical hole size
- 6 mil
Laser hole size
- Minimum 4 mil, maximum – 6 mil
Minimum SMT Pitch
- 5 mil
Layer to Layer Registration
- ± 3 mil
Other Services
- Panelization
- Profiling
- Routing
- V-Scoring
- Edge-Plating
- Control Depth Holes
- Countersink Holes
- Castellation Holes
- Lead Time: Same Day – 4 Weeks
- Layer Count: 0 – 40 Layers
- Cu Weight: Up to 20 oz.
- Trace/Space: Down to .0025”
- Via-In-Pad
- Blind & Buried Vias
- Laser Direct Imaging
- Oversized Boards
- Stacked Microvias
- Down To .3mm Pitch
- Cavity Boards
- Buried Chip Resistors
- Laser-Drilled Microvias
Advanced Circuits’ PCB Manufacturing Capabilities
Specification | Standard | Custom |
Layer Count | 0 – 10 Layers | 0 – 40 Layers |
Turn Time | Same Day – 5 Day | Same Day – 4 Weeks |
Quantity Req. | 1 – 10000+ | 1 – 10000+ |
Materials | FR-4 | FR-4/Rogers/Polyimide/Aluminum Clad/High-Temp. FR4 & others |
Plating Finish | Lead-Free HAL* | Electrolytic Hard Gold/Soft Gold/ENIG/Nickel/Immersion Silver |
OSP/Leaded & Lead-Free HAL | ||
Cert. / Qualifications | IPC Class 2 – A600 | IPC6012 Class 2-3A / IPC6018 Class 3 MIL-PRF-31032 / MIL-PRF-55110 / ISO |
9001:2008 / AS9100C | ||
Board Thickness | .031″ / .062″ / .093″ / .125″ | Full Range Available |
Copper Weight | 1 oz. Inner / Up to 2 oz. Outer | 0.5 – 4 oz. Inner / 1 – 20 oz. Outer |
Trace/Space | 5 / 5 Mils | Down to 2.75 / 3 Mils |
Solder Mask (LPI) | Green | Various Color Options |
Legend | White | Various Color Options |
Min. Hole Size | 0.010″ | 0.004″ |
Hole Tolerance | +/- 0.005″ | +/- 0.003″ (Upon Request) |
Route Tolerance | +/- 0.010″ | +/- 0.005″ (Upon Request) |
Slots/Cutouts/Edges | Non-Plated Only | Plated / Non-Plated |
Plated Holes | Plated / Non-Plated | Plated / Non-Plated |
UL Markings/Dates | Yes** | Yes** |
Lead-Free Markings | Yes | Yes |
Gold Fingers | Yes | Yes |
Fiducials | Yes | Yes |
Scoring | Yes | Yes |
ITAR | Yes | Yes |
Castellated Holes | X | Yes |
Controlled Dielectric | X | Yes |
Controlled Impedance | X | Yes |
Counter Sinks | X | Yes |
Counter Bores | X | Yes |
Blind/Buried Vias | X | Yes |
Microvias | X | Yes |
Mask Plugged Vias | X | Yes |
Via-in-Pad | X | Yes |
Etch Back | X | Yes |
Tetra Etch | X | Yes |
Cover Coat | X | Yes |
Cavity Process | X | Yes |
Laser Rout | X | Yes |
LPI Legend | X | Yes |
Edge Mill | X | Yes |
Unique Serialization | X | Yes |
Back Drilling | X | Yes |
Controlled Depth Drill | X | Yes |
Sunstone Circuits
Based in Mulino, Oregan, Sunstone Circuits offers PCB fabrication services.
Here is the list of their manufacturing capabilities:
Sunstone Circuits’ PCB Manufacturing Capabilities
Drill Capabilities | |
Smallest Drill Size | 0.005″ |
Largest Drill Size | 0.250″ +/- 0.002″ |
*Note: Holes > 0.250″ are considered cutouts | |
Positional Tolerance | |
Control Depth Tolerance | +/- 0.0005″ |
Microvia | Yes |
Blind / Buried Via | Yes |
Min. Pad Size (via) | via + 0.006″ |
Min. Pad Size (component) | hole + 0.010″ |
Route Capabilities | |
Board Size Tolerances (Rout) | +/- 0.003″ |
Board Size Tolerance (Laser) | +/- 0.001″ |
V-Score Web Thickness | +/- 0.002″ |
V-Score Line Width | +/- 0.002″ |
Etch Tolerances | |
Trace width (of design) | +/- 0.0005″ |
Minimum Trace Width | 0.002″ |
Surface Finish | |
Tin / Lead Solder (HASL) | Yes |
Immersion Silver | Yes* |
ENIG | Yes* |
Copper Only | Yes* |
OSP | Yes* |
ENIPIG | Yes* |
Full Body Hard Gold | Yes* |
Soft Bondable Gold | Yes* |
Lead Free Solder | Yes* |
*Denotes RoHS Compliant Finish | |
Board Parameters | |
Layer Count | 0 – 36 |
Board Thickness | 0.003″ – 0.187 |
Copper Weight (finished) | 0.25 oz – 6 oz |
Materials | |
FR-4 150 Tg (RoHS Compliant) | Yes |
FR-4 170 Tg (RoHS Compliant) | Yes |
Rogers RO 3000(R) Series | No |
Rogers RO 4000(R) Series | Yes |
Rogers RT/duroid(R) Series (5000 and 6000 Series) | Yes |
Arlon | Yes |
Polyflon | Yes |
Taconic | Yes |
Certifications | |
UL Listed | |
ITAR Registered | |
Other Sunstone Capabilities | |
Controlled Impedance | |
Full-Service CAM Tooling |
Bay Area Circuits
Bay Area Circuits’ PCB Manufacturing Capabilities
Standard Capability | Advanced Capability | |
Minimum Layer Count | 1 | 1 |
Maximum Layer Count | 16 | 30 |
Trace/Space | 0.006″ | 0.002″ |
Finished Hole Size | 0.010″ | 0.004″ |
Surface Finishes | HASL, ENIG, Hard Gold, Soft Gold (see all below) | ENEPIG, OSP, EPIG (see all below) |
Materials | FR-4, High Temp FR-4, Isola, Rogers | PTFE/Duroid, Polyimide, Flex |
Controlled Impedance | +/- 10% | +/- 5% |
Annular Ring | 0.006″ | 0.003″ Mechanical, 0.001″ Laser |
Outer Layers Finished Copper | 1.5 oz to 2 oz | 1 oz to 5 oz |
Inner Layers Finished Copper | 0.5 oz to 2 oz | 0.3 oz to 4 oz |
Soldermask Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
Silkscreen Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
Filled Vias | Non-Conductive Fill | Non-Conductive Fill or Conductive Fill |
Smallest Mechanical Drill Diameter | 0.010″ | 0.004″ |
Smallest Laser Drill Diameter | N/A | 0.003″ |
Blind Vias | No | Yes |
Buried Vias | No | Yes |
Aspect Ratio | 10:01 | 15:01 |
Plated Hole to Copper | 0.008″ | 0.005″ |
Clearance – Copper to Edge of Board | Outer Layer – 0.010″ | Outer Layer – 0.005″ |
Inner Layer – 0.015″ | Inner Layer – 0.005″ | |
Minimum Panel Size | 9″ x 12″ | 8″ x 8″ |
Maximum Panel Size | 18″ x 24″ | 24″ x 36″ |
Plated Slots | Routed | Routed or Nibbled |
Non-Plated Slots | Routed | Routed or Nibbled |
Plating in Holes | 0.0008″ | 0.0015″ |
Web (or Mask Width) | 0.006″ | 0.003″ |
Soldermask Swell | 0.003″ | 0.001″ |
Silkscreen Width | 0.003″ | 0.003″ |
Inspection & Testing Criteria | ||
IPC Class 2 | Yes | Yes |
IPC Class 3 | No | Yes |
Netlist Generation and Netlist Compare | Yes | Yes |
Trace / Space | ||
Outer Layers (finished copper) | 1 oz. Cu – Min .005″ Trace/Space | 1 oz. Cu – Min .002″ Trace/Space |
2 oz. Cu – Min .008″ Trace/Space | 2 oz. Cu – Min .006″ Trace/Space | |
3 oz. Cu – Min .012″ Trace/Space | 3 oz. Cu – Min .008″ Trace/Space | |
4 oz. Cu – Min .014″ Trace/Space | 4 oz. Cu – Min .012″ Trace/Space | |
5 oz. Cu – Min .016″ Trace/Space | ||
Inner Layers | ||
0.3 oz Cu – Min .002″ Trace/Space | 0.5 oz Cu – Min .003″ Trace/Space | |
0.5 oz Cu – Min .005″ Trace/Space | 1 oz. Cu – Min .005″ Trace/Space | |
1 oz. Cu – Min .006″ Trace/Space | 2 oz. Cu – Min .008″ Trace/Space | |
2 oz. Cu – Min .012″ Trace/Space | 3 oz. Cu – Min .0012″ Trace/Space | |
4 oz. Cu – Min .016″ Trace/Space | ||
Drilling | ||
Min drilled diameter, final board thickness 0.031″ or less | 0.008″ | 0.004″ |
Min drilled diameter, final board thickness between 0.031″ and 0.062″ | 0.010″ | 0.006″ |
Min drilled diameter, final board thickness between 0.062″ and 0.093″ | 0.012″ | 0.010″ |
Min drilled diameter, final board thickness between 0.093″ and 0.125″ | 0.015″ | 0.012″ |
Min laser diameter, dielectric thickness less than or equal to 0.004″ | N/A | 0.003″ |
Min laser diameter, dielectric thickness between 0.004″ and 0.005″ | N/A | 0.004″ |
Min laser diameter, dielectric thickness between 0.005″ and 0.007″ | N/A | 0.005″ |
Controlled depth blind vias | No | Yes, max 0.75:1 aspect ratio |
Pre-drilled core blind vias | No | Yes |
Sub-lamination blind vias | No | Yes |
Build-up technology | No | Up to 4-N-4, Any layer |
Buried vias | No | Yes |
Filled vias | Non-Conductive fill | Non-Conductive or Conductive fill |
Nibbling | No | Yes |
Largest hole | 0.247″ plated, 0.250″ non-plated | No maximum |
Slots | Plated or non-plated, routed | Plated or non-plated, routed or nibbled |
Plating in holes | 0.0008″ | 0.0015″ |
Plated hole to copper | 0.008″ | 0.005″ |
Surface Finish | ||
Hot Air Solder Level (HASL – Lead) | Yes | Yes |
Hot Air Solder Level (HASL – Lead-Free) | Yes | Yes |
Electroless Nickel Immersion Gold (ENIG) | Yes | Yes |
Immersion Silver | Yes | Yes |
Hard Gold Fingers with ENIG | Yes | Yes |
Hard Gold Fingers with HASL | Yes | Yes |
Yes | Yes | |
Electrolytic Soft Gold | Yes | Yes |
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) | No | Yes |
Organic Surface Protectant (OSP) | Yes | Yes |
Bare Copper | Yes | Yes |
Electroless Palladium Immersion Gold (EPIG) | No | Yes |
Tin Nickel | No | Yes |
White Tin | Yes | Yes |
Carbon Ink | No | Yes |
Soldermask | ||
Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
Finish/Texture | Semi-gloss, Matte | Semi-gloss, Matte |
Tented Vias | Yes | Yes |
Soldermask Plugged Vias | Yes | Yes |
Soldermask Thickness over Copper | 5 micron to 25 micron | 5 micron to 25 micron |
Soldermask Web | 5 mil | 3 mil |
Soldermask Gap to Pad | 4 mil | 2 mil |
Copper Ring Under Mask-Defined Pad | 3 mil | 1 mil |
Peelable Soldermask | No | Yes |
LPI Soldermask | Yes | Yes |
Dry Film Soldermask | No | Yes |
Silkscreen | ||
Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
Minimum Legend Width | 3 mil | 3 mil |
Space between Silkscreen and Pad | 5 mil | 4 mil |
Controlled Impedance | ||
Layers | 0-10 Layers | 0-30 Layers |
Impedance Tolerance | Single-ended +/- 10% | Single-ended +/- 5% |
Impedance Tolerance | Differential Pairs +/- 10% | Differential Pairs +/- 5% |
Impedance Tolerance | Coplanar Waveguide +/- 10% | Coplanar Waveguide +/- 5% |
TDR Testing | Yes, Included | Yes, Included |
Board Thickness | ||
1-Layer or 2-Layer | Min .015″ | Max .200″ | Min .008″ | Max .250″ |
4-Layer | Min .020″ | Max .200″ | Min .015″ | Max .250″ |
6-Layer | Min .031″ | Max .200″ | Min .025″ | Max .250″ |
8-Layer | Min .047″ | Max .200″ | Min .031″ | Max .250″ |
10-Layer | Min .062″ | Max .200″ | Min .040″ | Max .250″ |
12-Layer | Min .062″ | Max .200″ | Min .047″ | Max .250″ |
14-Layer | Min .062″ | Max .200″ | Min .054″ | Max .250″ |
16-Layer | Min .062″ | Max .200″ | Min .062″ | Max .250″ |
CNC / Routing / Score / Mechanical Rules | ||
Router Bit Size | 0.078″ | Min 0.021″, Max. 0.078″ |
Spacing for Tab Rout Array | 0.100″ | |
Standard V- Score Angle | 30° | 20°, 30°, 45°, 60° |
V-Score Depth | One third of board thickness (min 0.010″) | |
Jump Score | No | Yes, overshoot up to 0.35″ |
Scoring Direction | Vertical and Horizontal | Routed Scoring |
Bevel Angle | 20, 30, 45, or 60 Degree Gold Finger Bevel | Milling/Offset or Recessed Beveling |
Countersinks | 60, 82, 90, 100 Degree Countersink ** | 60, 82, 90, 100 Degree Countersink ** |
Counterbores | Yes | Yes |
Edge Castellations | No | Castellated Edges Min .040″ |
Plated Edges | No | Yes |
Cross Section | Level 1 | Level 1, Level 2, Level 3 |
ALLPCB
ALLPCB’s PCB Manufacturing Capabilities
Technical index | Mass Batch | Small batch | Sample | |||
---|---|---|---|---|---|---|
Base Material | FR4 | Normal Tg | Shengyi S1141, KB6160,Huazhen H140(not suitable for lead free process ) | |||
Middle Tg | For HDI, multi layers: SY S1000H、ITEQIT158、HuazhengH150; TU-662; | |||||
High Tg | For thick copper、high layer:SY S1000-2; ITEQIT180A; HuazhengH170;ISOLA:FR408R; 370HR; TU-752; | |||||
Halogen Free | Middle Tg :SY S1150G、HuazhengH150HF、H160HF;high Tg: SY S1165 | |||||
High CTI | CTI≥600 SY S1600、Huazheng H1600HF、H1600A; | |||||
High Frequency | Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000 | |||||
High Speed | SY S7439;TU-862HF、TU-872SLK;ISOLA:I-Speed、I-Tera@MT40;Huazheng:H175、H180、H380 | |||||
Flex Material | Base | Glue-free:Dupont AK XingyangW-type, Panosonic RF-775; | ||||
Coverlay | SY SF305C、Xingyang Q-type | |||||
Special PP | No flow PP: VT-447LF,Taiguang 370BL Arlon 49N Ceramic filled adhesive sheet: Rogers4450F PTFE adhesive sheet: Arlon6700、Taconic FR-27/FR-28 Double-sided coatingPI: xingyang N-1010TF-mb | |||||
Metal Base | Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase | |||||
Special | High heat resistance rigidity PI: Tenghui VT-901、Arlon 85N,SY S260(Tg250) High thermal conductivity material:92ML Pure ceramic material:alumina ceramic、Aluminum nitride ceramics BT material: Taiwan Nanya NGP-200WT | |||||
Layers | FR4 | 24 | 36 | 64 | ||
Rigid&Flex /(Flex) | 16(12) | 20(12) | 24(16) | |||
High Frequency Mixed Lamination | 12 | 18 | 24 | |||
100% PTFE | 4 | 12 | 18 | |||
HDI | 2 steps | 3 steps | 4 steps | |||
Delivery Size (mm) | Max(mm) | 460*560 | 460*560 | 550*900 | ||
Min(mm) | 20*20 | 10*10 | 5*10 | |||
Width / Gap | Inner(mil) | 0.5OZ base copper: 3/3 1.0OZ base copper: 4/4 2.0OZ base copper: 5/6 3.0OZ base copper: 7/9 4.0OZ base copper: 8/12 5.0OZ base copper: 10/15 6.0OZ base copper: 12/18 10 OZ base copper: 18/24 12 OZ base copper: 20/28 | ||||
Outer(mil) | 1/3OZ base copper: 3/3 0.5OZ base copper: 4/4 1.0OZ base copper: 5/5 2.0OZ base copper: 6/8 3.0OZ base copper: 7/10 4.0OZ base copper: 8/13 5.0OZ base copper: 10/16 6.0OZ base copper: 12/18 10 OZ base copper: 18/24 12 OZ base copper: 20/28 15 OZ base copper: 24/32 | |||||
Line Width Tolerance | >5.0 mil | ±20% | ±20% | ±1.0mil | ||
≤5.0 mil | ±1.0mil | ±1.0mil | ±1.0mil | |||
Copper Thickness | Inner layer(OZ) | 4 | 6 | 12 | ||
Out layer(OZ) | 4 | 6 | 15 | |||
Board thickness(mm) | 0.5-5.0 | 0.4-6.5 | 0.4-11.5 | |||
Final Board Thickness | >1.0 mm | ±10% | ±8% | ±8% | ||
≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | |||
Board thickness/drill bit | 10:1 | 12:1 | 13:1 | |||
Contour | Bevel edge | 20~60 degree;±5degree | ||||
Bow and twist | ≤0.75% | ≤0.75% | ≤0.5% |
Drill & Hole
Technical index | Mass Batch | Small batch | Sample | |||
---|---|---|---|---|---|---|
Drilling | Min laser (mm) | 0.1 | 0.1 | 0.1 | ||
Min CNC(mm) | 0.2 | 0.15 | 0.15 | |||
Max CNC drill bit(mm) | 6.5 | 6.5 | 6.5 | |||
Min Half Hole(mm) | 0.5 | 0.4 | 0.4 | |||
PTH Hole (mm) | Normal | ±0.1 | ±0.075 | ±0.075 | ||
Pressing Hole | ±0.05 | ±0.05 | ±0.05 | |||
Hole Angle (conical) | Width of upper diameter≤6.5mm:800、900、1000、1100;Width of upper diameter≥6.5mm:900; | |||||
Precision of Depth-control Drilling(mm) | ±0.10 | ±0.075 | ±0.05 | |||
Number of blind CNC holes of one side | ≤2 | ≤3 | ≤4 | |||
Minimum via hole spacing (different network, military, medical, automobile )mm | 0.50 | 0.45 | 0.40 | |||
Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm | 0.4 | 0.35 | 0.3 | |||
The minimum hole wall spacing of the over hole (the same network mm) | 0.20 | 0.2 | 0.15 | |||
Minimum hole wall spacing (mm) for device holes | 0.80 | 0.70 | 0.70 | |||
The minimum distance from via hole to the inner copper or line | 0.2 | 0.18 | ≤10L: 0.15 >10L: 0.18 | |||
The min distance from Device hole to inner copper or line | 0.3 | 0.27 | 0.25 | |||
Welding Ring (mil) | Via hole | 4(HDI 3mil) | 3.5(HDI 3mil) | 3 | ||
Component hole | 8 | 6 | 6 | |||
Final Board Thickness | >1.0 mm | ±10% | ±8% | ±8% | ||
≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | |||
CNC | contour tolerance(mm) | ±0.15 | ±0.10 | ±0.10 | ||
V-CUT Tolerance of residual thickness(mm) (mm) | ±0.15 | ±0.10 | ±0.10 | |||
Routing slot(mm) | ±0.15 | ±0.10 | ±0.10 | |||
Precision of controlled deep milling(mm) | ±0.15 | ±0.10 | ±0.10 |
Solder Mask
Technical index | Mass Batch | Small batch | Sample | |||
---|---|---|---|---|---|---|
Solder Dam (mil) | (solder mask) | 5 | 4 | 4 | ||
(hybrid) | 6 | 5 | 5 |
Surface Treatments
Technical index | Mass Batch | Small batch | Sample | |||
---|---|---|---|---|---|---|
Surface Treatments | Immersion gold | Ni thickness (micro inch) | 118-236 | 118-236 | 118-236 | |
Max gold (uinch) | 3 | 3 | 6 | |||
Hard gold(Au thick) | Gold finger (uinch) | 15 | 30 | 60 | ||
NiPdAu | NI (uinch) | 118-236 | ||||
PA (uinch) | 2-5 | |||||
Au (uinch) | 1-5 | |||||
Graph electric gold | NI (uinch) | 120-400 | ||||
AU (uinch) | 1-3 | |||||
Immersion tin | Tin (um) | 0.8-1.2 | ||||
Immersion Ag | Ag (uinch) | 6-10 | ||||
OSP | thick (um) | 0.2-0.5 | ||||
HAL/HAL LF | BGApad(mm) | ≥0.3×0.3 | ||||
thickness (mm) | 0.6≤H≤3.0 | |||||
Board thickness vs hole diameter | Press hole≤3:1 | |||||
Tin(um) | 2.0-40.0 |
Rigid & Flex
Technical index | Mass Batch | Small batch | Sample | |||
---|---|---|---|---|---|---|
Rigid & Flex | Maximum dielectric thickness of flex | Glue –free 25um | Glue-free 75um | Glue-free75um | ||
Flex part width(mm) | ≥10 | ≥5 | ≥2 | |||
Max delivery size (mm) | 200×400 | 200×500 | 400 ×550 | |||
distance of via hole to edge of Rigid&flex(mm) | ≥1.2 | ≥1.0 | ≥0.8 | |||
(mm)distance of components hole to the edge of R&F | ≥1.5 | ≥1.2 | ≥1.0 | |||
Rigid & Flex | Structure | The outer layer structure of the flex part, the PI reinforcement structure and the separation structure | Aluminum based rigid flex , rigid flex HDI, combination, electromagnetic shielding film |
Special Tech
Technical index | Mass Batch | Small batch | Sample | |||
---|---|---|---|---|---|---|
Special Tech | Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination | Buried magnetic core PCB | Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB |
JLCPCB
JLCPCB’s PCB Manufacturing Capabilities
Features | Capability | Notes |
---|---|---|
Layer count | 1,2,4,6 layers | The number of copper layers in the board. |
Controlled Impedance | 4/6 layer, default layer stack-up | Controlled Impedance PCB Layer StackupJLCPCB Impedance Calculator |
Material | FR-4 | FR-4 Standard Tg 130-140/ Tg 155 |
Dielectric constant | 4.5(double-side PCB) | 7628 structure 4.6 2313 structure 4.05 2116 structure 4.25 |
Max. Dimension | 400x500mm | The maximum dimension JLCPCB can accept |
Dimension Tolerance | ±0.2mm | ±0.2mm for CNC routing, and ±0.4mm for V-scoring |
Board Thickness | 0.4/0.6/0.8/1.0/1.2/1.6/2.0mm | The thickness of finished board. |
Thickness Tolerance ( Thickness≥1.0mm) | ± 10% | e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%) |
Thickness Tolerance ( Thickness<1.0mm) | ± 0.1mm | e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1). |
Finished Outer Layer Copper | 1 oz/2 oz (35um/75um) | Finished copper weight of outer layer is 1oz or 2oz. |
Finished Inner Layer Copper | 0.5 oz (17um) | Finished copper weight of inner layer is 0.5oz only. |
Drill/Hole Size
Features | Capability | Notes |
---|---|---|
Drill Hole Size (Mechanical) | 0.20mm- 6.30mm | Min. drill size is 0.20mm. Max. drill size is 6.30mm. |
Drill Hole Size Tolerance | +0.13/-0.08mm | e.g. for the 0.6mm hole size, the finished hole size between 0.52mm to 0.73mm is acceptable. |
Blind/Buried Vias | Don’t support | Currently we don’t support Blind/Buried Vias, only make through holes. |
Min. Via hole size | 0.2mm | For Single&Double Layer PCB, the minimum via hole size is 0.3mm;For Multi Layer PCB, the minimum via hole size is 0.2mm |
Min. Via diameter | 0.45mm | For Single&Double Layer PCB, the minimum Via diameter is 0.6mm;For Multi Layer PCB, the minimum via diameter is 0.45mm. |
PTH hole Size | 0.20mm – 6.35mm | The annular ring size will be enlarged to 0.15mm in production. |
Pad Size | 0.70mm- 6.35mm | The pad hole size will be enlarged 0.15mm in production. |
Min. Non-plated holes | 0.50mm | The minimum NPTH dimension is 0.50mm, Please add the NPTH in the mechanical layer or keep out layer. |
Min. Plated Slots | 0.65mm | The minimum plated slot width is 0.65mm, which is drawn with a pad. |
Min. Non-Plated Slots | 1.0mm | The minimum Non-Plated Slot Width is 1.0mm, please draw the slot outline in the mechanical layer(GML or GKO) |
Min. Castellated Holes | 0.60mm | The minimum diameter of castellated holes is 0.60mm. |
Hole size Tolerance (Plated) | +0.13mm/-0.08mm | e.g. for the 1.00mm Plated hole, the finished hole size between 0.92mm to 1.13mm is acceptable. |
Hole size Tolerance (Non-Plated) | ±0.2mm | e.g. for the 1.00mm Non-Plated hole, the finished hole size between 0.80mm to 1.20mm is acceptable. |
Rectangle Hole/Slot | Don’t support | We don’t make rectangle hole/slot,the rectangle hole/slot will be made as round or oval hole/slot by default. |
Minimum Annular Ring
Minimum annular ring | PTH | |
---|---|---|
1oz Copper | 0.13mm | 0.3mm |
2oz Copper | 0.2mm | 0.3mm |
Minimum clearance
Features | Capabilities |
---|---|
Hole to hole clearance(Different nets) | 0.5mm |
Via to Via clearance(Same nets) | 0.254mm |
Pad to Pad clearance(Pad without hole, Different nets) | 0.127mm |
Pad to Pad clearance(Pad with hole, Different nets) | 0.5mm |
Via to Track | 0.254mm |
PTH to Track | 0.33mm |
NPTH to Track | 0.254mm |
Pad to Track | 0.2m |
Minimum trace width and spacing
Copper weight | Min. Trace width | Min. Spacing |
---|---|---|
H/HOZ (Inner layer) | 5mil (0.127mm) | 5mil (0.127mm) |
1oz (Outer layer) | 1/2 layers: 5mil (0.127mm) 4/6 layers: 3.5mil(0.09mm) | 1/2 layers: 5mil (0.127mm) 4/6 layers: 3.5mil(0.09mm) |
2oz (Outer layer) | 8mil (0.2mm) | 8mil (0.2mm) |
BGA
Layer count | Min. BGA Pad Dimensions | Min. Distance Between BGA |
---|---|---|
1/2 layers | 0.4 mm | 0.127mm |
4/6 layers | 0.25 mm | 0.127mm |
Solder Mask
Features | Capabilities | Notes |
---|---|---|
Solder mask opening/ expansion | 0.05mm | The solder mask should have a minimum of a 0.05 mm “growth/mask opening” around the pad to allow for any mis-registration. |
Solder bridge | 0.2mm(green) 0.254mm(other colors) | To have solder mask bridge, the spacing between copper pads edge must be 0.2mm (8mils) or more. |
Solder mask color | green, red, yellow, blue, white, and black. | We use LPI (Liquid Photo Imageable) solder mask. It is the most common type of mask used today. |
Solder mask dielectric constant | 3.8 | |
Solder mask thickness | 10-15UM |
Legend
Features | Capabilities | Notes |
---|---|---|
Minimum Line Width | 6 mil (0.153mm) | Characters width less than 6mil(0.153mm) will be unidentifiable. |
Minimum text height | 32 mil (0.8mm) | Characters height less than 32mil(0.8mm) will be unidentifiable. |
Character width to height ratio | 1:6 | The preferred ratio of width to height is 1:6. |
Pad To Silkscreen | 0.15mm | The Minimum Distance Between Pad and Silkscreen is 0.15mm. |
Board Outlines
Features | Capabilities | Notes |
---|---|---|
Trace to Outline | 0.2mm | Ships as individual board(Rounting):Trace to Outline≥0.2mm |
Trace to V-cut line | 0.4mm | Ship as panel with V-scoring: Trace to V-cut line≥0.4mm |
Panelization
Features | Capabilities | Notes |
---|---|---|
Panelization without space | 0mm | The space between boards is 0mm. |
Panelization with space | 2mm | Make sure the space between boards should be ≥2mm,otherwise it will be hard to process for rounding. |
Panelized Round board | ≥20mmx20mm | The single round board size should be≥20mmx20mm. Panelize with stamp holes and add tooling strips on four board edges |
Panelized castellated holes board | Panelize with stamp holes and add tooling strips on four board edges | The distance between castellated hole and board corner should be larger than 4mm. Recommended diameter of stamp hole is 0.5mm-0.8mm; Recommended distance between the two stamp holes is 0.2-0.3mm |
Min. Width of Breakaway Tab | 4mm | The minimum width of breakaway tab is 4mm. For breakaway with mouse-bites, the minimum width is 5mm. |
Min. Edge Rails | 4mm | If choosing panel by JLCPCB, we will add 5mm edge rails on both sides by default. |
PCBgogo
PCBgogo’s PCB Manufacturing Capabilities
No. | Item | Manufacturing Capabilities |
---|---|---|
1 | Material | FR-4 (Fiberglass) |
2 | Number of Layers | 1 Layer, 2 Layers, 4 Layers, 6 Layer, 8 Layers, 10 Layers |
3 | TG Grade | TG130~140, TG150~160, TG170~180 |
4 | Max PCB Size | 1 layer & 2 layers: 1200*300mm or 600*500mm Multi-layers: 600*500mm |
5 | Min PCB Size | 5mm*5mm |
6 | Board Size Tolerance(Outline) | ±0.2mm(CNC routing) ±0.5mm(V-scoring) |
7 | Surface Finish | HASL with lead, HASL lead free, Immersion gold(ENIG), OSP, Hard gold, ENEPIG, Immersion silver (Ag), None |
8 | Board Thickness | 1 Layer/2 Layers: 0.2~2.4mm 4 Layers: 0.4~2.4mm 6 Layers: 0.8~2.4mm 8 Layers: 1.0~2.4mm 10 Layers: 1.2~2.4mm
Note: Customized PCB thickness and Layer stackup are acceptable. |
9 | Board Thickness Tolerance | Thickness≥1.0mm: ±10% Thickness<1.0mm: ±0.1mm
Note: Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface. |
10 | Outer Layer Copper Thickness | 1oz/2oz/3oz (35μm/70μm/105μm)
Note: 2oz PCB thickness≥1.2mm, Via size≥0.25mm, Min Track/Spacing≥0.15mm
3oz PCB thickness≥2.0mm, Via size≥0.3mm, Min Track/Spacing≥0.2mm |
11 | Inner Layer Copper Thickness | 1oz/1.5oz (35μm/50μm) |
12 | Outer layer Min track/spacing | ≥3mil |
13 | Inner layer Min track/spacing | ≥4mil |
14 | Annual ring size | ≥0.13mm |
15 | Grid Line track/spacing | ≥0.2mm |
16 | Coil board Line track/spacing | ≥0.2mm |
17 | BGA pad size | ≥0.2mm |
18 | BGA Distance | ≥0.12mm |
19 | Board Outlines | Track to Outline: ≥0.3mm Trace to V-cut line: ≥0.4mm |
20 | Finished Hole Size Tolerance | ±0.08mm |
21 | Finished Hole Diameter(CNC) | 0.2mm~6.3mm
1. PCB Thickness=2.0mm, Min hole size is 0.3mm 2. PCB Thickness=2.4mm, Min hole size is 0.4mm 3. Copper Thickness=2OZ, Min hole size is 0.25mm 4. Copper Thickness=3OZ, Min hole size is 0.3mm |
22 | TH Via Distance | Equipotential: 0.15mm Isoelectric: 0.25mm |
23 | Plated Slot Size | ≥0.5mm
Note: L:W=2.5: 1 (Should be 2.5:1 or higher. If it is less than this, the holes may be misaligned.) If you can’t draw a long hole in your design, you can draw a continuous round hole and it will be regarded as a long hole. Also, it is okay to draw the oblong hole in Profile Layer instead of Drilling Layer. |
24 | Castellated Holes | ≥0.6mm |
25 | Non-Plated Holes | ≥0.8mm |
26 | NPTH to Copper Line | ≥0.2mm |
27 | Soldermask | Green, Red, Yellow, White, Black, Blue, Purple, Matte Green,Matte Black,None |
28 | Soldermask Thickness | 20~30um |
29 | Soldermask Bridge | Green: ≥0.1mm Others: ≥0.15mm |
30 | Soldermask to soldering pad distance | ≥0.05mm |
31 | Silkscreen | White, Black, Yellow, None |
32 | Minimum Character Width(Legend) | ≥0.15mm
Note: Characters of less than 0.15mm wide will be too narrow to be identifiable. |
33 | Minimum Character Height (Legend) | ≥0.75mm
Note: Characters of less than 0.8mm high will be too small to be recognizable. |
34 | Character Width to Height Ratio (Legend) | 1: 5 (In PCB silkscreen legends processing, 1:5 is the most suitable ratio) |
35 | Silkscreen to Soldermask Distance | ≥0.1mm |
36 | V-cut Line | ≥75mm
Note: PCB thickness≥0.6mm Details refer to right side picture |
37 | V-cut Line Distance | ≥3.5mm |
38 | Distance betwen Board to Board | ≥0.8mm |
39 | Stamp-hole Width | ≥2.0mm
Note: PCB size and thickness are subject to review by PCBGOGO. |
40 | Tab-route Width | ≥1.6mm
Note: PCB size and thickness are subject to review by PCBGOGO. |
41 | Edge Rail | ≥3.5mm
Note: If choosing panel by PCBGOGO, we will add 5mm edge rails on both sides by default. |
42 | Gold Finger | Bevelling Angle: 30~45° Depth: ≥1mm Length: 45mm~280mm
Note: Board thickness≥1.2mm |
43 | Special Specification | Impedance control Custom Layer Stackup Interstitial Via Hole(IVH) Via in pad Via filled with resin Countersinks/Counterbores Carbon Mask Halogen-Free Z-axis milling Edge Plating Others |
PCBWay
PCBgogo’s PCB Manufacturing Capabilities
Items | Spec. | |
---|---|---|
Number of Layers | General PCB board | 2-40 |
Buried IC | yes | |
HDI(buried and blind vias) | HDI(5+N+5) staggered and stacked vias | |
Materials | FR4(shengyi) | yes |
High Tg | Tg-220 | |
EHalongen Free | yes | |
High Frequency | yes | |
Maximum board size | 20*35inch(508*889mm) | |
Board thickness | 0.21-6.0mm | |
Minimum track line | 2mil-inner 2mil-outer | |
Minimum Spacing line | 2mil-inner 2mil-outer | |
Outer layer copper thickness | 7oz | |
Inner layer copper thickness | 7oz | |
Min. finished hole size(Mechanical) | 0.15mm | yes |
Min. finished hole size(laser hole) | 0.076mm | yes |
Aspect ratio | 12:1 | |
Solder Mask Types and brand | NAYA(LP_4G) | yes |
Tamura(TT19G) | yes | |
TAIYO(PSR2200) | yes | |
Solder Mask Color | green;blue;red;white;black | yes |
Impedance Control Tolerance | ±10%,50Ω and below:±5Ω | yes |
Plug via hole | Min.size can be plugged: | 0.1mm |
Max.size can be plugged: | 0.7mm | |
Min. annular ring can be kept | 3mil | |
Min. distance between the IC pads can keep SM bridge | 8mil | |
Min. SM bridge for green soldermask | 3mil | |
Min. SM bridge for black soldermask | 4mil | |
Surface Treatment | HASL | yes |
ENIG | yes | |
OSP | yes | |
LEAD FREE HASL | yes | |
GOLD PLATING | yes | |
IMMERSION Ag | yes | |
IMMERSION Sn | yes | |
V-Cut | CNC V-cut, degree | 20\30\45\60 |
V-cut by hand, degree | 20\30\45\60 | |
Outline Profile | CNC | |
Chamfer | The angle typeof the chamfer: | 20\30\45 |
Min. distance of jumping chamfer: | 5mm | |
Tolerance of the dimension size | ±0.1mm | |
Tolerance of the board thickness | 0.21-1.0 | ±0.1 |
1.0-2.5 | ±7% | |
2.5-6.3 | ±6% | |
Tolerance of the finished hole size | 0-0.3mm | ±0.08mm |
0.31-0.8mm | ±0.08mm | |
0.81-1.60mm | ±0.05mm | |
1.61-2.49mm | ±0.75mm | |
2.5-6.0mm | +0.15/-1mm | |
>6.0mm | +0.3/-1mm | |
Certificates(copies are needed) | UL | yes |
ISO9001 | yes | |
ISO14000 | yes | |
ROHS | yes | |
TS16949 | yes |