Finding a PCB manufacturer could prove to be a time-consuming and risky task. A web search returns many search results with no easy way to compare the various PCB companies.
When choosing a PCB manufacturer, there are a number of factors to consider such as quality, capabilities, customer service, price, customer satisfaction, and trustworthiness.
The good news is that we have done a lot of the research and analysis for you.
Here is our list of the top 10 PCB manufacturers
As a start, we have compiled the table below, which shows some of the manufacturing capabilities and information about customer reviews for eight primary PCB manufacturers.
| Criteria | Advanced Circuits/4pcb.com | Sunstone Circuits | Bay Area Circuits | allpcb.com | jlcpcb.com | pcbgogo.com | pcbway.com | Camptech |
| # of Google reviews | 6 | 9 | 3 | 12 reviews on Trustpilot | 151 Facebook reviews | 17 reviews on Trustpilot | 57 reviews on Trustpilot | 10 |
| Avg. review rating (out of 5) | 3.2 | 4.2 | 5 | 3.2 | 4.5 | 3.6 | 3.8 | 4.6 |
| Extensiveness/depth of the information offered in reviews | Poor | Fair | Fair | Good | Good | Good | Good | Good |
| Overall do the reviews seem trustworthy | No | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Controlled impedance | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Minimum hole size | 0.1 mm | .15 mm | .08 mm | 0.2 mm | 0.2 mm | .15 mm | 0.1 mm | 0.05 mm |
| Trace width/Trace Spacing | 3 mil | 3 mil | 3 mil/3 mil | 4 mil | 5 mil/5mil | 3 mil/3 mil | 3 mil/3 mil | 3 mil/3 mil |
| Aspect ratio | 12:1 | 15:1 | 12:1 | 20:1 | 12:1 | |||
| Routing tolerance | ± .15 mm | ± .08 mm | ± 0.15 mm | ± 0.2 mm | ± 0.2 mm | ± .15 mm | ||
| Min. SMT Pitch | 0.25 mm | .1mm | 0.4 mm | .15 mm | ||||
| Blind & Buried vias | Yes | Yes | Yes | Yes | No | Yes | Yes | Yes |
| Via in pad | Yes | No | Yes | Yes | Yes | |||
| Stacked micro-vias | Yes | Yes | Yes | No | Yes | Yes | Yes | |
| Flexible PCB | No | No | No | Yes | No | Yes | Yes | Yes |
| Location | U.S | U.S | U.S | China | China | China | China | Canada |
| Overall score based on fabrication capabilities, quality & customer service reviews (10 being highest) | 6 | 6.5 | 7 | 7 | 7 | 8 | 8 | 9 |
| Advanced Circuits/4pcb.com | Sunstone Circuits | Bay Area Circuits | allpcb.com | jlcpcb.com/ | pcbgogo.com | pcbway.com | Camptech |
Camptech Circuits
For over 40 years, electronics manufacturers have trusted and relied on Camptech II Circuits’ expertise and production capabilities to manufacture their printed circuit boards. Whether your PCB is a simple one layer design or you require a multilayer board with controlled impedance and stacked microvias built, you can depend on us to manufacture your circuit boards with affordable pricing.
Camptech’s PCB Manufacturing Capabilities
Delivery
- 2 to 10 days for prototypes
- 5 days to 4 weeks for production
PCB Types
- Rigid
- Flex
- Rigid-Flex
- Metal Core
- Hybrid
Silkscreen
- White
- Black
- Yellow
- Custom Colors
Components locations and other markings on a PCB are identified using a silkscreen legend.
Soldermask
- Solder mask registration tolerance – up to +/-0.002”
- Minimum width of solder mask bridge: 4mil (Green), 5mil (other color); 8 mil on copper area
Soldermask colors
- Green
- Red
- Blue
- Black
- White
- Yellow
- Custom colors
- Peelable Mask
Soldermask types
- Liquid Photo Imageable (LPI)
- Laser Direct Imaging (LDI)
Surface Finishes
Aspect Ratio
The Aspect Ratio is defined as the scale of board thickness compared to the diameter of the drilled via. If you have a board with a 0.24″ thickness and a via with a 0.02″ diameter, the aspect ratio is 12:1. The higher this ratio, the increased plating that will be around a via compared to inside the via.
Laminate Materials
- FR4
- High TG FR4
- Rogers
- Arlon
- Aluminum Base
- Polyimide
- Ceramic
- Taconic
- Megtron, etc.
Blind/Buried Vias
- Minimum epoxy filled via hole diameter – 4 mil
- Maximum aspect ratio for filled vias – 10:1
- Epoxy fill types – conductive & non-conductive
A blind via is a connection from an outer layer of a board to one or more inner layers without exiting out the opposite side of the board.
Plugged Vias
- Solder mask
- Non-Conductive Epoxy
- Finished hole size for via filled with resin: 4mil to 22.5 mil>
Routing Tolerance
- ± 5 mil
Inner Layer Copper
| Inner copper layer | Minimum trace/space |
| 0.5 oz. | 0.003” |
| 1 oz. | 0.00375” |
| 2 oz. | 0.005” |
| 3 oz. | 0.009” |
| 4 oz. | 0.012” |
Scoring Tolerance
- ± 10 mil
Outer Layer Copper
| Outer copper layer | Minimum trace/space |
| 0.5 oz. | 0.003” |
| 1 oz. | 0.0045” |
| 2 oz. | 0.007” |
| 3 oz. | 0.009” |
| 4 oz. | 0.014” |
| 5 oz to 20 oz. | Please contact us |
Stacked Microvias
- Yes
Number of Layers
- 1 to 30 Layers Rigid PCBs
- 1 to 10 Layer Flexible PCBs
A PCB is made up of layers of copper foil and insulating material, laminated to the substrate.
Pad (Ring)
- Min pad size for laser drilling – 10 mil (4 mil laser via)
- Min pad size for mechanical drilling – 16 mil (8 mil drilling)
- Min BGA pad size – 7 mil
Traces
- Minimum trace width – 3 mil
- Minimum trace spacing – 3 mil
Controlled Impedance & Simulations
- ± 10% tolerance
Hole Sizes
Minimum mechanical hole size
- 6 mil
Laser hole size
- Minimum 4 mil, maximum – 6 mil
Minimum SMT Pitch
- 5 mil
Layer to Layer Registration
- ± 3 mil
Other Services
- Panelization
- Profiling
- Routing
- V-Scoring
- Edge-Plating
- Control Depth Holes
- Countersink Holes
- Castellation Holes
Advanced Circuits offers printed circuit board manufacturing with two options: Standard & Custom Spec. Choosing between the two options will depend on your PCB design requirements and specifications.
Here are some highlights of their service:
- Lead Time: Same Day – 4 Weeks
- Layer Count: 0 – 40 Layers
- Cu Weight: Up to 20 oz.
- Trace/Space: Down to .0025”
- Via-In-Pad
- Blind & Buried Vias
- Laser Direct Imaging
- Oversized Boards
- Stacked Microvias
- Down To .3mm Pitch
- Cavity Boards
- Buried Chip Resistors
- Laser-Drilled Microvias
Advanced Circuits’ PCB Manufacturing Capabilities
| Specification | Standard | Custom |
| Layer Count | 0 – 10 Layers | 0 – 40 Layers |
| Turn Time | Same Day – 5 Day | Same Day – 4 Weeks |
| Quantity Req. | 1 – 10000+ | 1 – 10000+ |
| Materials | FR-4 | FR-4/Rogers/Polyimide/Aluminum Clad/High-Temp. FR4 & others |
| Plating Finish | Lead-Free HAL* | Electrolytic Hard Gold/Soft Gold/ENIG/Nickel/Immersion Silver |
| OSP/Leaded & Lead-Free HAL | ||
| Cert. / Qualifications | IPC Class 2 – A600 | IPC6012 Class 2-3A / IPC6018 Class 3 MIL-PRF-31032 / MIL-PRF-55110 / ISO |
| 9001:2008 / AS9100C | ||
| Board Thickness | .031″ / .062″ / .093″ / .125″ | Full Range Available |
| Copper Weight | 1 oz. Inner / Up to 2 oz. Outer | 0.5 – 4 oz. Inner / 1 – 20 oz. Outer |
| Trace/Space | 5 / 5 Mils | Down to 2.75 / 3 Mils |
| Solder Mask (LPI) | Green | Various Color Options |
| Legend | White | Various Color Options |
| Min. Hole Size | 0.010″ | 0.004″ |
| Hole Tolerance | +/- 0.005″ | +/- 0.003″ (Upon Request) |
| Route Tolerance | +/- 0.010″ | +/- 0.005″ (Upon Request) |
| Slots/Cutouts/Edges | Non-Plated Only | Plated / Non-Plated |
| Plated Holes | Plated / Non-Plated | Plated / Non-Plated |
| UL Markings/Dates | Yes** | Yes** |
| Lead-Free Markings | Yes | Yes |
| Gold Fingers | Yes | Yes |
| Fiducials | Yes | Yes |
| Scoring | Yes | Yes |
| ITAR | Yes | Yes |
| Castellated Holes | X | Yes |
| Controlled Dielectric | X | Yes |
| Controlled Impedance | X | Yes |
| Counter Sinks | X | Yes |
| Counter Bores | X | Yes |
| Blind/Buried Vias | X | Yes |
| Microvias | X | Yes |
| Mask Plugged Vias | X | Yes |
| Via-in-Pad | X | Yes |
| Etch Back | X | Yes |
| Tetra Etch | X | Yes |
| Cover Coat | X | Yes |
| Cavity Process | X | Yes |
| Laser Rout | X | Yes |
| LPI Legend | X | Yes |
| Edge Mill | X | Yes |
| Unique Serialization | X | Yes |
| Back Drilling | X | Yes |
| Controlled Depth Drill | X | Yes |
Sunstone Circuits
Based in Mulino, Oregan, Sunstone Circuits offers PCB fabrication services.
Here is the list of their manufacturing capabilities:
Sunstone Circuits’ PCB Manufacturing Capabilities
| Drill Capabilities | |
| Smallest Drill Size | 0.005″ |
| Largest Drill Size | 0.250″ +/- 0.002″ |
| *Note: Holes > 0.250″ are considered cutouts | |
| Positional Tolerance | |
| Control Depth Tolerance | +/- 0.0005″ |
| Microvia | Yes |
| Blind / Buried Via | Yes |
| Min. Pad Size (via) | via + 0.006″ |
| Min. Pad Size (component) | hole + 0.010″ |
| Route Capabilities | |
| Board Size Tolerances (Rout) | +/- 0.003″ |
| Board Size Tolerance (Laser) | +/- 0.001″ |
| V-Score Web Thickness | +/- 0.002″ |
| V-Score Line Width | +/- 0.002″ |
| Etch Tolerances | |
| Trace width (of design) | +/- 0.0005″ |
| Minimum Trace Width | 0.002″ |
| Surface Finish | |
| Tin / Lead Solder (HASL) | Yes |
| Immersion Silver | Yes* |
| ENIG | Yes* |
| Copper Only | Yes* |
| OSP | Yes* |
| ENIPIG | Yes* |
| Full Body Hard Gold | Yes* |
| Soft Bondable Gold | Yes* |
| Lead Free Solder | Yes* |
| *Denotes RoHS Compliant Finish | |
| Board Parameters | |
| Layer Count | 0 – 36 |
| Board Thickness | 0.003″ – 0.187 |
| Copper Weight (finished) | 0.25 oz – 6 oz |
| Materials | |
| FR-4 150 Tg (RoHS Compliant) | Yes |
| FR-4 170 Tg (RoHS Compliant) | Yes |
| Rogers RO 3000(R) Series | No |
| Rogers RO 4000(R) Series | Yes |
| Rogers RT/duroid(R) Series (5000 and 6000 Series) | Yes |
| Arlon | Yes |
| Polyflon | Yes |
| Taconic | Yes |
| Certifications | |
| UL Listed | |
| ITAR Registered | |
| Other Sunstone Capabilities | |
| Controlled Impedance | |
| Full-Service CAM Tooling |
Bay Area Circuits
Bay Area Circuits’ PCB Manufacturing Capabilities
| Standard Capability | Advanced Capability | |
| Minimum Layer Count | 1 | 1 |
| Maximum Layer Count | 16 | 30 |
| Trace/Space | 0.006″ | 0.002″ |
| Finished Hole Size | 0.010″ | 0.004″ |
| Surface Finishes | HASL, ENIG, Hard Gold, Soft Gold (see all below) | ENEPIG, OSP, EPIG (see all below) |
| Materials | FR-4, High Temp FR-4, Isola, Rogers | PTFE/Duroid, Polyimide, Flex |
| Controlled Impedance | +/- 10% | +/- 5% |
| Annular Ring | 0.006″ | 0.003″ Mechanical, 0.001″ Laser |
| Outer Layers Finished Copper | 1.5 oz to 2 oz | 1 oz to 5 oz |
| Inner Layers Finished Copper | 0.5 oz to 2 oz | 0.3 oz to 4 oz |
| Soldermask Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Silkscreen Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Filled Vias | Non-Conductive Fill | Non-Conductive Fill or Conductive Fill |
| Smallest Mechanical Drill Diameter | 0.010″ | 0.004″ |
| Smallest Laser Drill Diameter | N/A | 0.003″ |
| Blind Vias | No | Yes |
| Buried Vias | No | Yes |
| Aspect Ratio | 10:01 | 15:01 |
| Plated Hole to Copper | 0.008″ | 0.005″ |
| Clearance – Copper to Edge of Board | Outer Layer – 0.010″ | Outer Layer – 0.005″ |
| Inner Layer – 0.015″ | Inner Layer – 0.005″ | |
| Minimum Panel Size | 9″ x 12″ | 8″ x 8″ |
| Maximum Panel Size | 18″ x 24″ | 24″ x 36″ |
| Plated Slots | Routed | Routed or Nibbled |
| Non-Plated Slots | Routed | Routed or Nibbled |
| Plating in Holes | 0.0008″ | 0.0015″ |
| Web (or Mask Width) | 0.006″ | 0.003″ |
| Soldermask Swell | 0.003″ | 0.001″ |
| Silkscreen Width | 0.003″ | 0.003″ |
| Inspection & Testing Criteria | ||
| IPC Class 2 | Yes | Yes |
| IPC Class 3 | No | Yes |
| Netlist Generation and Netlist Compare | Yes | Yes |
| Trace / Space | ||
| Outer Layers (finished copper) | 1 oz. Cu – Min .005″ Trace/Space | 1 oz. Cu – Min .002″ Trace/Space |
| 2 oz. Cu – Min .008″ Trace/Space | 2 oz. Cu – Min .006″ Trace/Space | |
| 3 oz. Cu – Min .012″ Trace/Space | 3 oz. Cu – Min .008″ Trace/Space | |
| 4 oz. Cu – Min .014″ Trace/Space | 4 oz. Cu – Min .012″ Trace/Space | |
| 5 oz. Cu – Min .016″ Trace/Space | ||
| Inner Layers | ||
| 0.3 oz Cu – Min .002″ Trace/Space | 0.5 oz Cu – Min .003″ Trace/Space | |
| 0.5 oz Cu – Min .005″ Trace/Space | 1 oz. Cu – Min .005″ Trace/Space | |
| 1 oz. Cu – Min .006″ Trace/Space | 2 oz. Cu – Min .008″ Trace/Space | |
| 2 oz. Cu – Min .012″ Trace/Space | 3 oz. Cu – Min .0012″ Trace/Space | |
| 4 oz. Cu – Min .016″ Trace/Space | ||
| Drilling | ||
| Min drilled diameter, final board thickness 0.031″ or less | 0.008″ | 0.004″ |
| Min drilled diameter, final board thickness between 0.031″ and 0.062″ | 0.010″ | 0.006″ |
| Min drilled diameter, final board thickness between 0.062″ and 0.093″ | 0.012″ | 0.010″ |
| Min drilled diameter, final board thickness between 0.093″ and 0.125″ | 0.015″ | 0.012″ |
| Min laser diameter, dielectric thickness less than or equal to 0.004″ | N/A | 0.003″ |
| Min laser diameter, dielectric thickness between 0.004″ and 0.005″ | N/A | 0.004″ |
| Min laser diameter, dielectric thickness between 0.005″ and 0.007″ | N/A | 0.005″ |
| Controlled depth blind vias | No | Yes, max 0.75:1 aspect ratio |
| Pre-drilled core blind vias | No | Yes |
| Sub-lamination blind vias | No | Yes |
| Build-up technology | No | Up to 4-N-4, Any layer |
| Buried vias | No | Yes |
| Filled vias | Non-Conductive fill | Non-Conductive or Conductive fill |
| Nibbling | No | Yes |
| Largest hole | 0.247″ plated, 0.250″ non-plated | No maximum |
| Slots | Plated or non-plated, routed | Plated or non-plated, routed or nibbled |
| Plating in holes | 0.0008″ | 0.0015″ |
| Plated hole to copper | 0.008″ | 0.005″ |
| Surface Finish | ||
| Hot Air Solder Level (HASL – Lead) | Yes | Yes |
| Hot Air Solder Level (HASL – Lead-Free) | Yes | Yes |
| Electroless Nickel Immersion Gold (ENIG) | Yes | Yes |
| Immersion Silver | Yes | Yes |
| Hard Gold Fingers with ENIG | Yes | Yes |
| Hard Gold Fingers with HASL | Yes | Yes |
| Yes | Yes | |
| Electrolytic Soft Gold | Yes | Yes |
| Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) | No | Yes |
| Organic Surface Protectant (OSP) | Yes | Yes |
| Bare Copper | Yes | Yes |
| Electroless Palladium Immersion Gold (EPIG) | No | Yes |
| Tin Nickel | No | Yes |
| White Tin | Yes | Yes |
| Carbon Ink | No | Yes |
| Soldermask | ||
| Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Finish/Texture | Semi-gloss, Matte | Semi-gloss, Matte |
| Tented Vias | Yes | Yes |
| Soldermask Plugged Vias | Yes | Yes |
| Soldermask Thickness over Copper | 5 micron to 25 micron | 5 micron to 25 micron |
| Soldermask Web | 5 mil | 3 mil |
| Soldermask Gap to Pad | 4 mil | 2 mil |
| Copper Ring Under Mask-Defined Pad | 3 mil | 1 mil |
| Peelable Soldermask | No | Yes |
| LPI Soldermask | Yes | Yes |
| Dry Film Soldermask | No | Yes |
| Silkscreen | ||
| Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Minimum Legend Width | 3 mil | 3 mil |
| Space between Silkscreen and Pad | 5 mil | 4 mil |
| Controlled Impedance | ||
| Layers | 0-10 Layers | 0-30 Layers |
| Impedance Tolerance | Single-ended +/- 10% | Single-ended +/- 5% |
| Impedance Tolerance | Differential Pairs +/- 10% | Differential Pairs +/- 5% |
| Impedance Tolerance | Coplanar Waveguide +/- 10% | Coplanar Waveguide +/- 5% |
| TDR Testing | Yes, Included | Yes, Included |
| Board Thickness | ||
| 1-Layer or 2-Layer | Min .015″ | Max .200″ | Min .008″ | Max .250″ |
| 4-Layer | Min .020″ | Max .200″ | Min .015″ | Max .250″ |
| 6-Layer | Min .031″ | Max .200″ | Min .025″ | Max .250″ |
| 8-Layer | Min .047″ | Max .200″ | Min .031″ | Max .250″ |
| 10-Layer | Min .062″ | Max .200″ | Min .040″ | Max .250″ |
| 12-Layer | Min .062″ | Max .200″ | Min .047″ | Max .250″ |
| 14-Layer | Min .062″ | Max .200″ | Min .054″ | Max .250″ |
| 16-Layer | Min .062″ | Max .200″ | Min .062″ | Max .250″ |
| CNC / Routing / Score / Mechanical Rules | ||
| Router Bit Size | 0.078″ | Min 0.021″, Max. 0.078″ |
| Spacing for Tab Rout Array | 0.100″ | |
| Standard V- Score Angle | 30° | 20°, 30°, 45°, 60° |
| V-Score Depth | One third of board thickness (min 0.010″) | |
| Jump Score | No | Yes, overshoot up to 0.35″ |
| Scoring Direction | Vertical and Horizontal | Routed Scoring |
| Bevel Angle | 20, 30, 45, or 60 Degree Gold Finger Bevel | Milling/Offset or Recessed Beveling |
| Countersinks | 60, 82, 90, 100 Degree Countersink ** | 60, 82, 90, 100 Degree Countersink ** |
| Counterbores | Yes | Yes |
| Edge Castellations | No | Castellated Edges Min .040″ |
| Plated Edges | No | Yes |
| Cross Section | Level 1 | Level 1, Level 2, Level 3 |
ALLPCB
ALLPCB’s PCB Manufacturing Capabilities
| Technical index | Mass Batch | Small batch | Sample | |||
|---|---|---|---|---|---|---|
| Base Material | FR4 | Normal Tg | Shengyi S1141, KB6160,Huazhen H140（not suitable for lead free process ） | |||
| Middle Tg | For HDI, multi layers： SY S1000H、ITEQIT158、HuazhengH150; TU-662； | |||||
| High Tg | For thick copper、high layer：SY S1000-2; ITEQIT180A; HuazhengH170;ISOLA：FR408R; 370HR； TU-752； | |||||
| Halogen Free | Middle Tg ：SY S1150G、HuazhengH150HF、H160HF；high Tg: SY S1165 | |||||
| High CTI | CTI≥600 SY S1600、Huazheng H1600HF、H1600A； | |||||
| High Frequency | Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000 | |||||
| High Speed | SY S7439；TU-862HF、TU-872SLK；ISOLA:I-Speed、I-Tera@MT40；Huazheng：H175、H180、H380 | |||||
| Flex Material | Base | Glue-free：Dupont AK XingyangW-type, Panosonic RF-775； | ||||
| Coverlay | SY SF305C、Xingyang Q-type | |||||
| Special PP | No flow PP： VT-447LF，Taiguang 370BL Arlon 49N Ceramic filled adhesive sheet: Rogers4450F PTFE adhesive sheet： Arlon6700、Taconic FR-27/FR-28 Double-sided coatingPI： xingyang N-1010TF-mb | |||||
| Metal Base | Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase | |||||
| Special | High heat resistance rigidity PI： Tenghui VT-901、Arlon 85N，SY S260（Tg250） High thermal conductivity material：92ML Pure ceramic material：alumina ceramic、Aluminum nitride ceramics BT material： Taiwan Nanya NGP-200WT | |||||
| Layers | FR4 | 24 | 36 | 64 | ||
| Rigid&Flex /（Flex） | 16（12） | 20（12） | 24（16） | |||
| High Frequency Mixed Lamination | 12 | 18 | 24 | |||
| 100% PTFE | 4 | 12 | 18 | |||
| HDI | 2 steps | 3 steps | 4 steps | |||
| Delivery Size (mm) | Max(mm) | 460*560 | 460*560 | 550*900 | ||
| Min(mm) | 20*20 | 10*10 | 5*10 | |||
| Width / Gap | Inner（mil） | 0.5OZ base copper： 3/3 1.0OZ base copper： 4/4 2.0OZ base copper： 5/6 3.0OZ base copper： 7/9 4.0OZ base copper： 8/12 5.0OZ base copper： 10/15 6.0OZ base copper： 12/18 10 OZ base copper： 18/24 12 OZ base copper： 20/28 | ||||
| Outer（mil） | 1/3OZ base copper： 3/3 0.5OZ base copper： 4/4 1.0OZ base copper： 5/5 2.0OZ base copper： 6/8 3.0OZ base copper： 7/10 4.0OZ base copper： 8/13 5.0OZ base copper： 10/16 6.0OZ base copper： 12/18 10 OZ base copper： 18/24 12 OZ base copper： 20/28 15 OZ base copper： 24/32 | |||||
| Line Width Tolerance | ＞5.0 mil | ±20% | ±20% | ±1.0mil | ||
| ≤5.0 mil | ±1.0mil | ±1.0mil | ±1.0mil | |||
| Copper Thickness | Inner layer（OZ） | 4 | 6 | 12 | ||
| Out layer（OZ） | 4 | 6 | 15 | |||
| Board thickness（mm） | 0.5-5.0 | 0.4-6.5 | 0.4-11.5 | |||
| Final Board Thickness | ＞1.0 mm | ±10% | ±8% | ±8% | ||
| ≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | |||
| Board thickness/drill bit | 10:1 | 12:1 | 13:1 | |||
| Contour | Bevel edge | 20～60 degree；±5degree | ||||
| Bow and twist | ≤0.75% | ≤0.75% | ≤0.5% | |||
Drill & Hole
| Technical index | Mass Batch | Small batch | Sample | |||
|---|---|---|---|---|---|---|
| Drilling | Min laser （mm） | 0.1 | 0.1 | 0.1 | ||
| Min CNC（mm） | 0.2 | 0.15 | 0.15 | |||
| Max CNC drill bit（mm） | 6.5 | 6.5 | 6.5 | |||
| Min Half Hole(mm) | 0.5 | 0.4 | 0.4 | |||
| PTH Hole (mm) | Normal | ±0.1 | ±0.075 | ±0.075 | ||
| Pressing Hole | ±0.05 | ±0.05 | ±0.05 | |||
| Hole Angle (conical) | Width of upper diameter≤6.5mm：800、900、1000、1100；Width of upper diameter≥6.5mm：900； | |||||
| Precision of Depth-control Drilling（mm） | ±0.10 | ±0.075 | ±0.05 | |||
| Number of blind CNC holes of one side | ≤2 | ≤3 | ≤4 | |||
| Minimum via hole spacing (different network, military, medical, automobile )mm | 0.50 | 0.45 | 0.40 | |||
| Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm | 0.4 | 0.35 | 0.3 | |||
| The minimum hole wall spacing of the over hole (the same network mm) | 0.20 | 0.2 | 0.15 | |||
| Minimum hole wall spacing (mm) for device holes | 0.80 | 0.70 | 0.70 | |||
| The minimum distance from via hole to the inner copper or line | 0.2 | 0.18 | ≤10L: 0.15 >10L: 0.18 | |||
| The min distance from Device hole to inner copper or line | 0.3 | 0.27 | 0.25 | |||
| Welding Ring (mil) | Via hole | 4（HDI 3mil） | 3.5（HDI 3mil） | 3 | ||
| Component hole | 8 | 6 | 6 | |||
| Final Board Thickness | ＞1.0 mm | ±10% | ±8% | ±8% | ||
| ≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | |||
| CNC | contour tolerance（mm） | ±0.15 | ±0.10 | ±0.10 | ||
| V-CUT Tolerance of residual thickness(mm) （mm） | ±0.15 | ±0.10 | ±0.10 | |||
| Routing slot（mm） | ±0.15 | ±0.10 | ±0.10 | |||
| Precision of controlled deep milling（mm） | ±0.15 | ±0.10 | ±0.10 | |||
Solder Mask
| Technical index | Mass Batch | Small batch | Sample | |||
|---|---|---|---|---|---|---|
| Solder Dam (mil) | （solder mask） | 5 | 4 | 4 | ||
| （hybrid） | 6 | 5 | 5 | |||
Surface Treatments
| Technical index | Mass Batch | Small batch | Sample | |||
|---|---|---|---|---|---|---|
| Surface Treatments | Immersion gold | Ni thickness (micro inch) | 118-236 | 118-236 | 118-236 | |
| Max gold (uinch) | 3 | 3 | 6 | |||
| Hard gold(Au thick) | Gold finger (uinch) | 15 | 30 | 60 | ||
| NiPdAu | NI (uinch) | 118-236 | ||||
| PA (uinch) | 2-5 | |||||
| Au (uinch) | 1-5 | |||||
| Graph electric gold | NI (uinch) | 120-400 | ||||
| AU (uinch) | 1-3 | |||||
| Immersion tin | Tin (um) | 0.8-1.2 | ||||
| Immersion Ag | Ag (uinch) | 6-10 | ||||
| OSP | thick (um) | 0.2-0.5 | ||||
| HAL/HAL LF | BGApad(mm) | ≥0.3×0.3 | ||||
| thickness （mm） | 0.6≤H≤3.0 | |||||
| Board thickness vs hole diameter | Press hole≤3:1 | |||||
| Tin（um） | 2.0-40.0 | |||||
Rigid & Flex
| Technical index | Mass Batch | Small batch | Sample | |||
|---|---|---|---|---|---|---|
| Rigid & Flex | Maximum dielectric thickness of flex | Glue –free 25um | Glue-free 75um | Glue-free75um | ||
| Flex part width(mm) | ≥10 | ≥5 | ≥2 | |||
| Max delivery size (mm) | 200×400 | 200×500 | 400 ×550 | |||
| distance of via hole to edge of Rigid&flex(mm) | ≥1.2 | ≥1.0 | ≥0.8 | |||
| (mm)distance of components hole to the edge of R&F | ≥1.5 | ≥1.2 | ≥1.0 | |||
| Rigid & Flex | Structure | The outer layer structure of the flex part, the PI reinforcement structure and the separation structure | Aluminum based rigid flex , rigid flex HDI, combination, electromagnetic shielding film | |||
Special Tech
| Technical index | Mass Batch | Small batch | Sample | |||
|---|---|---|---|---|---|---|
| Special Tech | Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination | Buried magnetic core PCB | Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB | |||
JLCPCB
JLCPCB’s PCB Manufacturing Capabilities
| Features | Capability | Notes |
|---|---|---|
| Layer count | 1,2,4,6 layers | The number of copper layers in the board. |
| Controlled Impedance | 4/6 layer, default layer stack-up | Controlled Impedance PCB Layer StackupJLCPCB Impedance Calculator |
| Material | FR-4 | FR-4 Standard Tg 130-140/ Tg 155 |
| Dielectric constant | 4.5(double-side PCB) | 7628 structure 4.6 2313 structure 4.05 2116 structure 4.25 |
| Max. Dimension | 400x500mm | The maximum dimension JLCPCB can accept |
| Dimension Tolerance | ±0.2mm | ±0.2mm for CNC routing, and ±0.4mm for V-scoring |
| Board Thickness | 0.4/0.6/0.8/1.0/1.2/1.6/2.0mm | The thickness of finished board. |
Thickness Tolerance ( Thickness≥1.0mm) | ± 10% | e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%) |
Thickness Tolerance ( Thickness<1.0mm) | ± 0.1mm | e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1). |
| Finished Outer Layer Copper | 1 oz/2 oz (35um/75um) | Finished copper weight of outer layer is 1oz or 2oz. |
| Finished Inner Layer Copper | 0.5 oz (17um) | Finished copper weight of inner layer is 0.5oz only. |
Drill/Hole Size
| Features | Capability | Notes |
|---|---|---|
| Drill Hole Size (Mechanical) | 0.20mm- 6.30mm | Min. drill size is 0.20mm. Max. drill size is 6.30mm. |
| Drill Hole Size Tolerance | +0.13/-0.08mm | e.g. for the 0.6mm hole size, the finished hole size between 0.52mm to 0.73mm is acceptable. |
| Blind/Buried Vias | Don’t support | Currently we don’t support Blind/Buried Vias, only make through holes. |
| Min. Via hole size | 0.2mm | For Single&Double Layer PCB, the minimum via hole size is 0.3mm;For Multi Layer PCB, the minimum via hole size is 0.2mm |
| Min. Via diameter | 0.45mm | For Single&Double Layer PCB, the minimum Via diameter is 0.6mm;For Multi Layer PCB, the minimum via diameter is 0.45mm. |
| PTH hole Size | 0.20mm – 6.35mm | The annular ring size will be enlarged to 0.15mm in production. |
| Pad Size | 0.70mm- 6.35mm | The pad hole size will be enlarged 0.15mm in production. |
| Min. Non-plated holes | 0.50mm | The minimum NPTH dimension is 0.50mm, Please add the NPTH in the mechanical layer or keep out layer. |
| Min. Plated Slots | 0.65mm | The minimum plated slot width is 0.65mm, which is drawn with a pad. |
| Min. Non-Plated Slots | 1.0mm | The minimum Non-Plated Slot Width is 1.0mm, please draw the slot outline in the mechanical layer(GML or GKO) |
| Min. Castellated Holes | 0.60mm | The minimum diameter of castellated holes is 0.60mm. |
| Hole size Tolerance (Plated) | +0.13mm/-0.08mm | e.g. for the 1.00mm Plated hole, the finished hole size between 0.92mm to 1.13mm is acceptable. |
| Hole size Tolerance (Non-Plated) | ±0.2mm | e.g. for the 1.00mm Non-Plated hole, the finished hole size between 0.80mm to 1.20mm is acceptable. |
| Rectangle Hole/Slot | Don’t support | We don’t make rectangle hole/slot,the rectangle hole/slot will be made as round or oval hole/slot by default. |
Minimum Annular Ring
| Minimum annular ring | PTH | |
|---|---|---|
| 1oz Copper | 0.13mm | 0.3mm |
| 2oz Copper | 0.2mm | 0.3mm |
Minimum clearance
| Features | Capabilities |
|---|---|
| Hole to hole clearance(Different nets) | 0.5mm |
| Via to Via clearance(Same nets) | 0.254mm |
| Pad to Pad clearance(Pad without hole, Different nets) | 0.127mm |
| Pad to Pad clearance(Pad with hole, Different nets) | 0.5mm |
| Via to Track | 0.254mm |
| PTH to Track | 0.33mm |
| NPTH to Track | 0.254mm |
| Pad to Track | 0.2m |
Minimum trace width and spacing
| Copper weight | Min. Trace width | Min. Spacing |
|---|---|---|
| H/HOZ (Inner layer) | 5mil (0.127mm) | 5mil (0.127mm) |
| 1oz (Outer layer) | 1/2 layers: 5mil (0.127mm) 4/6 layers: 3.5mil(0.09mm) | 1/2 layers: 5mil (0.127mm) 4/6 layers: 3.5mil(0.09mm) |
| 2oz (Outer layer) | 8mil (0.2mm) | 8mil (0.2mm) |
BGA
| Layer count | Min. BGA Pad Dimensions | Min. Distance Between BGA |
|---|---|---|
| 1/2 layers | 0.4 mm | 0.127mm |
| 4/6 layers | 0.25 mm | 0.127mm |
Solder Mask
| Features | Capabilities | Notes |
|---|---|---|
| Solder mask opening/ expansion | 0.05mm | The solder mask should have a minimum of a 0.05 mm “growth/mask opening” around the pad to allow for any mis-registration. |
| Solder bridge | 0.2mm(green) 0.254mm(other colors) | To have solder mask bridge, the spacing between copper pads edge must be 0.2mm (8mils) or more. |
| Solder mask color | green, red, yellow, blue, white, and black. | We use LPI (Liquid Photo Imageable) solder mask. It is the most common type of mask used today. |
| Solder mask dielectric constant | 3.8 | |
| Solder mask thickness | 10-15UM |
Legend
| Features | Capabilities | Notes |
|---|---|---|
| Minimum Line Width | 6 mil (0.153mm) | Characters width less than 6mil(0.153mm) will be unidentifiable. |
| Minimum text height | 32 mil (0.8mm) | Characters height less than 32mil(0.8mm) will be unidentifiable. |
| Character width to height ratio | 1:6 | The preferred ratio of width to height is 1:6. |
| Pad To Silkscreen | 0.15mm | The Minimum Distance Between Pad and Silkscreen is 0.15mm. |
Board Outlines
| Features | Capabilities | Notes |
|---|---|---|
| Trace to Outline | 0.2mm | Ships as individual board(Rounting):Trace to Outline≥0.2mm |
| Trace to V-cut line | 0.4mm | Ship as panel with V-scoring: Trace to V-cut line≥0.4mm |
Panelization
| Features | Capabilities | Notes |
|---|---|---|
| Panelization without space | 0mm | The space between boards is 0mm. |
| Panelization with space | 2mm | Make sure the space between boards should be ≥2mm,otherwise it will be hard to process for rounding. |
| Panelized Round board | ≥20mmx20mm | The single round board size should be≥20mmx20mm. Panelize with stamp holes and add tooling strips on four board edges |
| Panelized castellated holes board | Panelize with stamp holes and add tooling strips on four board edges | The distance between castellated hole and board corner should be larger than 4mm. Recommended diameter of stamp hole is 0.5mm-0.8mm; Recommended distance between the two stamp holes is 0.2-0.3mm |
| Min. Width of Breakaway Tab | 4mm | The minimum width of breakaway tab is 4mm. For breakaway with mouse-bites, the minimum width is 5mm. |
| Min. Edge Rails | 4mm | If choosing panel by JLCPCB, we will add 5mm edge rails on both sides by default. |
PCBgogo
PCBgogo’s PCB Manufacturing Capabilities
| No. | Item | Manufacturing Capabilities |
|---|---|---|
| 1 | Material | FR-4 (Fiberglass) |
| 2 | Number of Layers | 1 Layer, 2 Layers, 4 Layers, 6 Layer, 8 Layers, 10 Layers |
| 3 | TG Grade | TG130~140, TG150~160, TG170~180 |
| 4 | Max PCB Size | 1 layer & 2 layers: 1200*300mm or 600*500mm Multi-layers: 600*500mm |
| 5 | Min PCB Size | 5mm*5mm |
| 6 | Board Size Tolerance(Outline) | ±0.2mm(CNC routing) ±0.5mm(V-scoring) |
| 7 | Surface Finish | HASL with lead, HASL lead free, Immersion gold(ENIG), OSP, Hard gold, ENEPIG, Immersion silver (Ag), None |
| 8 | Board Thickness | 1 Layer/2 Layers: 0.2~2.4mm 4 Layers: 0.4~2.4mm 6 Layers: 0.8~2.4mm 8 Layers: 1.0~2.4mm 10 Layers: 1.2~2.4mm
Note: Customized PCB thickness and Layer stackup are acceptable. |
| 9 | Board Thickness Tolerance | Thickness≥1.0mm: ±10% Thickness<1.0mm: ±0.1mm
Note: Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface. |
| 10 | Outer Layer Copper Thickness | 1oz/2oz/3oz (35μm/70μm/105μm)
Note: 2oz PCB thickness≥1.2mm, Via size≥0.25mm, Min Track/Spacing≥0.15mm
3oz PCB thickness≥2.0mm, Via size≥0.3mm, Min Track/Spacing≥0.2mm |
| 11 | Inner Layer Copper Thickness | 1oz/1.5oz (35μm/50μm) |
| 12 | Outer layer Min track/spacing | ≥3mil |
| 13 | Inner layer Min track/spacing | ≥4mil |
| 14 | Annual ring size | ≥0.13mm |
| 15 | Grid Line track/spacing | ≥0.2mm |
| 16 | Coil board Line track/spacing | ≥0.2mm |
| 17 | BGA pad size | ≥0.2mm |
| 18 | BGA Distance | ≥0.12mm |
| 19 | Board Outlines | Track to Outline: ≥0.3mm Trace to V-cut line: ≥0.4mm |
| 20 | Finished Hole Size Tolerance | ±0.08mm |
| 21 | Finished Hole Diameter(CNC) | 0.2mm~6.3mm
1. PCB Thickness=2.0mm, Min hole size is 0.3mm 2. PCB Thickness=2.4mm, Min hole size is 0.4mm 3. Copper Thickness=2OZ, Min hole size is 0.25mm 4. Copper Thickness=3OZ, Min hole size is 0.3mm |
| 22 | TH Via Distance | Equipotential: 0.15mm Isoelectric: 0.25mm |
| 23 | Plated Slot Size | ≥0.5mm
Note: L:W=2.5: 1 (Should be 2.5:1 or higher. If it is less than this, the holes may be misaligned.) If you can’t draw a long hole in your design, you can draw a continuous round hole and it will be regarded as a long hole. Also, it is okay to draw the oblong hole in Profile Layer instead of Drilling Layer. |
| 24 | Castellated Holes | ≥0.6mm |
| 25 | Non-Plated Holes | ≥0.8mm |
| 26 | NPTH to Copper Line | ≥0.2mm |
| 27 | Soldermask | Green, Red, Yellow, White, Black, Blue, Purple, Matte Green,Matte Black,None |
| 28 | Soldermask Thickness | 20~30um |
| 29 | Soldermask Bridge | Green: ≥0.1mm Others: ≥0.15mm |
| 30 | Soldermask to soldering pad distance | ≥0.05mm |
| 31 | Silkscreen | White, Black, Yellow, None |
| 32 | Minimum Character Width(Legend) | ≥0.15mm
Note: Characters of less than 0.15mm wide will be too narrow to be identifiable. |
| 33 | Minimum Character Height (Legend) | ≥0.75mm
Note: Characters of less than 0.8mm high will be too small to be recognizable. |
| 34 | Character Width to Height Ratio (Legend) | 1: 5 (In PCB silkscreen legends processing, 1:5 is the most suitable ratio) |
| 35 | Silkscreen to Soldermask Distance | ≥0.1mm |
| 36 | V-cut Line | ≥75mm
Note: PCB thickness≥0.6mm Details refer to right side picture |
| 37 | V-cut Line Distance | ≥3.5mm |
| 38 | Distance betwen Board to Board | ≥0.8mm |
| 39 | Stamp-hole Width | ≥2.0mm
Note: PCB size and thickness are subject to review by PCBGOGO. |
| 40 | Tab-route Width | ≥1.6mm
Note: PCB size and thickness are subject to review by PCBGOGO. |
| 41 | Edge Rail | ≥3.5mm
Note: If choosing panel by PCBGOGO, we will add 5mm edge rails on both sides by default. |
| 42 | Gold Finger | Bevelling Angle: 30～45° Depth: ≥1mm Length: 45mm～280mm
Note: Board thickness≥1.2mm |
| 43 | Special Specification | Impedance control Custom Layer Stackup Interstitial Via Hole(IVH) Via in pad Via filled with resin Countersinks/Counterbores Carbon Mask Halogen-Free Z-axis milling Edge Plating Others |
PCBWay
PCBgogo’s PCB Manufacturing Capabilities
| Items | Spec. | |
|---|---|---|
| Number of Layers | General PCB board | 2-40 |
| Buried IC | yes | |
| HDI（buried and blind vias) | HDI(5+N+5) staggered and stacked vias | |
| Materials | FR4(shengyi) | yes |
| High Tg | Tg-220 | |
| EHalongen Free | yes | |
| High Frequency | yes | |
| Maximum board size | 20*35inch(508*889mm) | |
| Board thickness | 0.21-6.0mm | |
| Minimum track line | 2mil-inner 2mil-outer | |
| Minimum Spacing line | 2mil-inner 2mil-outer | |
| Outer layer copper thickness | 7oz | |
| Inner layer copper thickness | 7oz | |
| Min. finished hole size(Mechanical) | 0.15mm | yes |
| Min. finished hole size(laser hole) | 0.076mm | yes |
| Aspect ratio | 12:1 | |
| Solder Mask Types and brand | NAYA(LP_4G) | yes |
| Tamura(TT19G) | yes | |
| TAIYO(PSR2200) | yes | |
| Solder Mask Color | green;blue;red;white;black | yes |
| Impedance Control Tolerance | ±10%,50Ω and below:±5Ω | yes |
| Plug via hole | Min.size can be plugged: | 0.1mm |
| Max.size can be plugged: | 0.7mm | |
| Min. annular ring can be kept | 3mil | |
| Min. distance between the IC pads can keep SM bridge | 8mil | |
| Min. SM bridge for green soldermask | 3mil | |
| Min. SM bridge for black soldermask | 4mil | |
| Surface Treatment | HASL | yes |
| ENIG | yes | |
| OSP | yes | |
| LEAD FREE HASL | yes | |
| GOLD PLATING | yes | |
| IMMERSION Ag | yes | |
| IMMERSION Sn | yes | |
| V-Cut | CNC V-cut, degree | 20304560 |
| V-cut by hand, degree | 20304560 | |
| Outline Profile | CNC | |
| Chamfer | The angle typeof the chamfer: | 203045 |
| Min. distance of jumping chamfer: | 5mm | |
| Tolerance of the dimension size | ±0.1mm | |
| Tolerance of the board thickness | 0.21-1.0 | ±0.1 |
| 1.0-2.5 | ±7% | |
| 2.5-6.3 | ±6% | |
| Tolerance of the finished hole size | 0-0.3mm | ±0.08mm |
| 0.31-0.8mm | ±0.08mm | |
| 0.81-1.60mm | ±0.05mm | |
| 1.61-2.49mm | ±0.75mm | |
| 2.5-6.0mm | +0.15/-1mm | |
| >6.0mm | +0.3/-1mm | |
| Certificates(copies are needed) | UL | yes |
| ISO9001 | yes | |
| ISO14000 | yes | |
| ROHS | yes | |
| TS16949 | yes | |
TechnoTronix’s PCB Manufacturing Capabilities
| Capability | Standard |
|---|---|
| Layer Count | Multilayer PCB up to 24 & 32 Layers |
| Type | Multilayer Rigid PCB Multilayer Flex PCB Multilayer Rigid-Flex PCB |
| Alternative Finish | Hot Air Solder Level (HASL) Electroless Nickel / Immersion Gold (ENIG) Silver Electroless Tin Lead Tin Nickle Organic (OSP) Hard Gold (edge contact) Carbon Peelable Custom Specified Finishes are also available! |
| Testing protocols include | Flying Probe test
|
Rigid flex boards with the following specifications:
| Capability | Standard |
|---|---|
| Types of Rigid Flex PCB | Single Sided Rigid Flex Boards Double Sided Rigid Flex PCBs Multilayer Rigid Flex circuit boards |
| Layer Count | 2 – 24 multilayerss |
| Materials | Polyimide FR4 |
| Copper Thickness | 9 µm 12 µm 18 µm 35 µm |
| Min. Line / Spacing | 125 µm / 125 µm |
| Smallest Drill | 0.28 mm |
| Surfaces | Immersion Ni/Au OSP Plated Ni/Au Immersion Tin |
| Stiffener Material | FR4 Steel Aluminum |
| Min. Annular Ring | 150 µm |
| Min. Solder mask Dam | 100 µm |
| Drill to copper – Outer layers | 8 mil |
| Drill to copper – Inner layers | 10 mil |
| Minimum Pitch | 0.5 mm |
| Copper Thickness | 0.5 oz. – 4 oz. |
| Copper to Board Edge | 0.007″ |
| Minimum Hole Size | 0.004″ |
| Coverlay Opening | 0.003″ |
San Francisco Circuit’s PCB Manufacturing Capabilities
| Specifications | Standard Technology | Advanced Technology |
|---|---|---|
| Number of Layers | 1 – 12 | 14 – 40 |
| Quick Turn Times | up to 24 hours for bare board fabrication or assembly (1-6 layers) |
|
Board Material | Rigid PCB Materials FR4 FR406 370HR VT-47 FR408 Arlon CEM Megtron 6 Astra MT77 Tachyon 100G Nelco 4000 Taconic TLY Polyimide
MCPCB, Aluminum Core & Copper Core Materials Aluminum Core Copper Core Ventec VT-4A1/VT-4A2 Aismalibar Fastherm Aismalibar Flextherm
Flex PCB Materials Kapton Shin-Etsu – Epoxy Rogers – Epoxy Dupont FR – FR Acrylic Dupont LF – LF Acrylic Adhesiveless Base Materials | Aluminum Core Ventec VT-4A1/VT-4A2 Aismalibar Fastherm Aismalibar Flextherm Copper Core Nelco 4000 Rogers 3000 Taconic TLY Polyimide |
| Minimum Board Thickness | 2 layer – 0.010″ 4 layer – 0.020″ 6 layer – 0.020″ 8 layer – 0.062″ 10 layer – 0.062″ 12 layer – 0.062″ | 2 layer – 0.005″ 4 layer – 0.010″ 6 layer – 0.031″ 8 layer – 0.040″ |
| Maximum Board Thickness | 2 layer – 0.125″ 3-12 layer – 0.200″ | 0.250″ – 0.500″ |
| Maximum Board Size | 16″ x 22″ 12″ x 21″
| 10″ x 16″ 16″ x 22″ 12″ x 21″
|
| Copper Thickness | 0.5 oz – 3 oz | 4 oz – 10 oz |
| Hole Aspect Ratio | 7 : 1 | 15 : 1 |
| Minimum Hole Size | 0.008″ | 0.004″ |
| Minimum Trace/Space | 0.006″/0.006″ | 0.002″/0.002″ |
| Minimum Drill-to-Copper | 0.010″ | 0.005″ |
| Minimum Pitch | 1 mm | 0.3 mm |
| Final Finish | HASL (Solder) Lead Free Solder Copper Gold Gold Fingers White Tin ENEPIG ENIG | HASL Gold (ENIG/Hard/Soft) Selective Gold Immersion Silver OSP White Tin ENEPIG |
| Solder Mask | LPI: Green Black Red Blue Yellow White Clear | LPI: Green Black Red Blue Yellow White Clear Mix-and-match Wet Mask Dry Film |
| Coverlay | FR Coverlay LF Coverlay Shin-Etsu Flexible Soldermask | |
| Silk Screen | White Black Yellow | White Black Yellow Green Red Blue |
| PCB Fabrication | Scoring Route & Retain | Jump Scoring Route & Retain Milling |
| Additional Features | Plated Slots Non-plated Slots Controlled Dielectric Covered Vias Counter Sinks Counter Bores Dual Access Flex Suspended Leads | Plated Edges Plated Milling Plated Counter Bores & Counter Sinks Edge Castellation Controlled Impedance Silver Filled Vias Non-Conductive Filled Vias
|
| Quality Standards | IPC 6012 Class 2 Electrical Testing 100% Netlist Testing TDR Testing | Milspec 31032 Milspec 55110 Milspec 50884 IPC 6012 Class 3 100% Netlist Testing TDR Testing |
| Special Technology |
| Blind & Buried Vias Laser Drilled Vias Mechanically Drilled Micro Vias |