Finding a PCB manufacturer could prove to be a time-consuming and risky task. A web search returns many search results with no easy way to compare the various PCB companies. 

When choosing a PCB manufacturer, there are a number of factors to consider such as quality, capabilities, customer service, price, customer satisfaction, and trustworthiness. 

The good news is that we have done a lot of the research and analysis for you.

2022-Top-10-PCB-Manufacturers-l

As a start, we have compiled the table below, which shows some of the manufacturing capabilities and information about customer reviews for eight primary PCB manufacturers.

Criteria Advanced Circuits/4pcb.com Sunstone Circuits Bay Area Circuits allpcb.com jlcpcb.com pcbgogo.com pcbway.com Camptech
# of Google reviews 6 9 3 12 reviews on Trustpilot 151 Facebook reviews 17 reviews on Trustpilot 57 reviews on Trustpilot 10
Avg. review rating (out of 5) 3.2 4.2 5 3.2 4.5 3.6 3.8 4.6
Extensiveness/depth of the information offered in reviews Poor Fair Fair Good Good Good Good Good
Overall do the reviews seem trustworthy No Yes Yes Yes Yes Yes Yes Yes
Controlled impedance Yes Yes Yes Yes Yes Yes Yes Yes
Minimum hole size 0.1 mm .15 mm .08 mm 0.2 mm 0.2 mm .15 mm 0.1 mm 0.05 mm
Trace width/Trace Spacing 3 mil 3 mil 3 mil/3 mil 4 mil 5 mil/5mil 3 mil/3 mil 3 mil/3 mil 3 mil/3 mil
Aspect ratio 12:1 15:1 12:1 20:1 12:1
Routing tolerance ± .15 mm ± .08 mm ± 0.15 mm ± 0.2 mm ± 0.2 mm ± .15 mm
Min. SMT Pitch 0.25 mm .1mm 0.4 mm .15 mm
Blind & Buried vias Yes Yes Yes Yes No Yes Yes Yes
Via in pad Yes No Yes Yes Yes
Stacked micro-vias Yes Yes Yes No Yes Yes Yes
Flexible PCB No No No Yes No Yes Yes Yes
Location U.S U.S U.S China China China China Canada
Overall score based on fabrication capabilities, quality & customer service reviews (10 being highest) 6 6.5 7 7 7 8 8 9
Advanced Circuits/4pcb.com Sunstone Circuits Bay Area Circuits allpcb.com jlcpcb.com/ pcbgogo.com pcbway.com Camptech

Camptech Circuits

For over 40 years, electronics manufacturers have trusted and relied on Camptech II Circuits’ expertise and production capabilities to manufacture their printed circuit boards. Whether your PCB is a simple one layer design or you require a multilayer board with controlled impedance and stacked microvias built, you can depend on us to manufacture your circuit boards with affordable pricing.

Camptech’s PCB Manufacturing Capabilities


Delivery


  • 2 to 10 days for prototypes
  • 5 days to 4 weeks for production

PCB Types


Silkscreen


  • White
  • Black
  • Yellow
  • Custom Colors

Components locations and other markings on a PCB are identified using a silkscreen legend.

PCB silkscreen legend

Soldermask


  • Solder mask registration tolerance – up to +/-0.002”
  • Minimum width of solder mask bridge: 4mil (Green), 5mil (other color); 8 mil on copper area

Soldermask colors

  • Green
  • Red
  • Blue
  • Black
  • White
  • Yellow
  • Custom colors
  • Peelable Mask

Soldermask types

  • Liquid Photo Imageable (LPI)
  • Laser Direct Imaging (LDI)

Aspect Ratio


  • 12:1
  • The Aspect Ratio is defined as the scale of board thickness compared to the diameter of the drilled via. If you have a board with a 0.24″ thickness and a via with a 0.02″ diameter, the aspect ratio is 12:1. The higher this ratio, the increased plating that will be around a via compared to inside the via.

    PCB aspect ratio

     

    Laminate Materials


    Blind/Buried Vias


    • Minimum epoxy filled via hole diameter – 4 mil
    • Maximum aspect ratio for filled vias – 10:1
    • Epoxy fill types – conductive & non-conductive

    A blind via is a connection from an outer layer of a board to one or more inner layers without exiting out the opposite side of the board.

    Blind, buried, through-hole PCB vias

    Plugged Vias


    • Solder mask
    • Non-Conductive Epoxy
    • Finished hole size for via filled with resin: 4mil to 22.5 mil>

    Routing Tolerance


    • ± 5 mil

    Inner Layer Copper

    Inner copper layer  Minimum trace/space
    0.5 oz. 0.003”
    1 oz. 0.00375”
    2 oz. 0.005”
    3 oz. 0.009”
    4 oz. 0.012”

     

     

    Scoring Tolerance


    • ± 10 mil

    Outer Layer Copper

    Outer copper layer Minimum trace/space
    0.5 oz. 0.003”
    1 oz. 0.0045”
    2 oz. 0.007”
    3 oz. 0.009”
    4 oz. 0.014”
    5 oz to 20 oz. Please contact us

     

    Stacked Microvias


    • Yes

    Number of Layers


    A PCB is made up of layers of copper foil and insulating material, laminated to the substrate.

    Pad (Ring)


    • Min pad size for laser drilling – 10 mil (4 mil laser via)
    • Min pad size for mechanical drilling – 16 mil  (8 mil drilling)
    • Min BGA pad size – 7 mil

    Traces


    • Minimum trace width – 3 mil
    • Minimum trace spacing – 3 mil

    Controlled Impedance & Simulations


    •  ± 10% tolerance

    Hole Sizes


    Minimum mechanical hole size

    • 6 mil

    Laser hole size

    • Minimum 4 mil, maximum – 6 mil

    PCB drill hole size

    Minimum SMT Pitch


    • 5 mil

    Layer to Layer Registration


    • ± 3 mil

    Via in Pad


    • Yes

    Min. Dielectric Thickness


    • 2 mil

    Other Services


    • Panelization
    • Profiling
    • Routing
    • V-Scoring
    • Edge-Plating
    • Control Depth Holes
    • Countersink Holes
    • Castellation Holes

    Don't Take Risks When Ordering Your PCBs

    Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.

    This company is MIL-PRF-31032, MIL-PRF-55110G, AS9100C, ISO 9001:2008 Certified, IPC 6012 Class 2, 3 and 3A Qualified, and ITAR Registered. They operate divisions in Aurora, CO, Tempe, AZ, and Maple Grove, MN.

    Advanced Circuits offers printed circuit board manufacturing with two options: Standard & Custom Spec.  Choosing between the two options will depend on your PCB design requirements and specifications.

    Here are some highlights of their service:

    • Lead Time: Same Day – 4 Weeks
    • Layer Count: 0 – 40 Layers
    • Cu Weight: Up to 20 oz.
    • Trace/Space: Down to .0025” 
    • Via-In-Pad 
    • Blind & Buried Vias
    • Laser Direct Imaging
    • Oversized Boards
    • Stacked Microvias
    • Down To .3mm Pitch
    • Cavity Boards
    • Buried Chip Resistors
    • Laser-Drilled Microvias

    Advanced Circuits’ PCB Manufacturing Capabilities


    Specification Standard Custom
    Layer Count 0 – 10 Layers 0 – 40 Layers
    Turn Time Same Day – 5 Day Same Day – 4 Weeks
    Quantity Req. 1 – 10000+ 1 – 10000+
    Materials FR-4 FR-4/Rogers/Polyimide/Aluminum Clad/High-Temp. FR4 & others
    Plating Finish Lead-Free HAL* Electrolytic Hard Gold/Soft Gold/ENIG/Nickel/Immersion Silver
    OSP/Leaded & Lead-Free HAL
    Cert. / Qualifications IPC Class 2 – A600 IPC6012 Class 2-3A / IPC6018 Class 3  MIL-PRF-31032 / MIL-PRF-55110 / ISO
    9001:2008 / AS9100C
    Board Thickness .031″ / .062″ / .093″ / .125″ Full Range Available
    Copper  Weight 1 oz. Inner / Up to 2 oz. Outer 0.5 – 4 oz. Inner / 1 – 20 oz. Outer
    Trace/Space 5 / 5 Mils Down to 2.75 / 3 Mils
    Solder Mask (LPI) Green Various Color Options
    Legend White Various Color Options
    Min. Hole Size 0.010″ 0.004″
    Hole Tolerance +/- 0.005″ +/- 0.003″ (Upon Request)
    Route Tolerance +/- 0.010″ +/- 0.005″ (Upon Request)
    Slots/Cutouts/Edges Non-Plated Only Plated / Non-Plated
    Plated Holes Plated / Non-Plated Plated / Non-Plated
    UL Markings/Dates Yes** Yes**
    Lead-Free Markings Yes Yes
    Gold Fingers Yes Yes
    Fiducials Yes Yes
    Scoring Yes Yes
    ITAR Yes Yes
    Castellated Holes X Yes
    Controlled Dielectric X Yes
    Controlled Impedance X Yes
    Counter Sinks X Yes
    Counter Bores X Yes
    Blind/Buried Vias X Yes
    Microvias X Yes
    Mask Plugged Vias X Yes
    Via-in-Pad X Yes
    Etch Back X Yes
    Tetra Etch X Yes
    Cover Coat X Yes
    Cavity Process X Yes
    Laser Rout X Yes
    LPI Legend X Yes
    Edge Mill X Yes
    Unique  Serialization X Yes
    Back Drilling X Yes
    Controlled Depth Drill X Yes

    Don't Take Risks When Ordering Your PCBs

    Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.

    Sunstone Circuits

    Based in Mulino, Oregan, Sunstone Circuits offers PCB fabrication services.

    Here is the list of their manufacturing capabilities:

    Sunstone Circuits’ PCB Manufacturing Capabilities


    Drill Capabilities
    Smallest Drill Size 0.005″
    Largest Drill Size 0.250″  +/- 0.002″
        *Note: Holes > 0.250″ are considered cutouts
    Positional Tolerance
    Control Depth Tolerance +/- 0.0005″
    Microvia Yes
    Blind / Buried Via Yes
    Min. Pad Size (via) via + 0.006″
    Min. Pad Size (component) hole + 0.010″
    Route Capabilities
    Board Size Tolerances (Rout) +/- 0.003″
    Board Size Tolerance (Laser) +/- 0.001″
    V-Score Web Thickness +/- 0.002″
    V-Score Line Width +/- 0.002″
    Etch Tolerances
    Trace width (of design) +/- 0.0005″
    Minimum Trace Width 0.002″
    Surface Finish
    Tin / Lead Solder (HASL) Yes
    Immersion Silver Yes*
    ENIG Yes*
    Copper Only Yes*
    OSP Yes*
    ENIPIG Yes*
    Full Body Hard Gold Yes*
    Soft Bondable Gold Yes*
    Lead Free Solder Yes*
     *Denotes RoHS Compliant Finish
    Board Parameters
    Layer Count  0 – 36
    Board Thickness 0.003″ – 0.187
    Copper Weight (finished) 0.25 oz – 6 oz
    Materials
    FR-4 150 Tg (RoHS Compliant) Yes
    FR-4 170 Tg (RoHS Compliant) Yes
    Rogers RO 3000(R) Series No
    Rogers RO 4000(R) Series Yes
    Rogers RT/duroid(R) Series (5000 and 6000 Series) Yes
    Arlon Yes
    Polyflon Yes
    Taconic Yes
    Certifications
    UL Listed
    ITAR Registered
    Other Sunstone Capabilities
    Controlled Impedance
    Full-Service CAM Tooling

    Don't Take Risks When Ordering Your PCBs

    Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.

    Bay Area Circuits

    The company has been serving the advanced PCB manufacturing needs of design engineering firms in the commercial, industrial, and medical industries, contract assemblers, and original equipment manufacturers for over 40 years.

    Bay Area Circuits’ PCB Manufacturing Capabilities


    Standard Capability Advanced Capability
    Minimum Layer Count 1 1
    Maximum Layer Count 16 30
    Trace/Space 0.006″ 0.002″
    Finished Hole Size 0.010″ 0.004″
    Surface Finishes HASL, ENIG, Hard Gold, Soft Gold (see all below) ENEPIG, OSP, EPIG (see all below)
    Materials FR-4, High Temp FR-4, Isola, Rogers PTFE/Duroid, Polyimide, Flex
    Controlled Impedance +/- 10% +/- 5%
    Annular Ring 0.006″ 0.003″ Mechanical, 0.001″ Laser
    Outer Layers Finished Copper 1.5 oz to 2 oz 1 oz to 5 oz
    Inner Layers Finished Copper 0.5 oz to 2 oz 0.3 oz to 4 oz
    Soldermask Colors Green, Black, Blue, Red, White, Clear, Custom Yellow, Custom
    Silkscreen Colors Green, Black, Blue, Red, White, Clear, Custom Yellow, Custom
    Filled Vias Non-Conductive Fill Non-Conductive Fill or Conductive Fill
    Smallest Mechanical Drill Diameter 0.010″ 0.004″
    Smallest Laser Drill Diameter N/A 0.003″
    Blind Vias No Yes
    Buried Vias No Yes
    Aspect Ratio 10:01 15:01
    Plated Hole to Copper 0.008″ 0.005″
    Clearance – Copper to Edge of Board Outer Layer – 0.010″ Outer Layer – 0.005″
    Inner Layer – 0.015″ Inner Layer – 0.005″
    Minimum Panel Size 9″ x 12″ 8″ x 8″
    Maximum Panel Size 18″ x 24″ 24″ x 36″
    Plated Slots Routed Routed or Nibbled
    Non-Plated Slots Routed Routed or Nibbled
    Plating in Holes 0.0008″ 0.0015″
    Web (or Mask Width) 0.006″ 0.003″
    Soldermask Swell 0.003″ 0.001″
    Silkscreen Width 0.003″ 0.003″
    Inspection & Testing Criteria
    IPC Class 2 Yes Yes
    IPC Class 3 No Yes
    Netlist Generation and Netlist Compare Yes Yes
    Trace / Space
    Outer Layers (finished copper) 1 oz. Cu – Min .005″ Trace/Space 1 oz. Cu – Min .002″ Trace/Space
    2 oz. Cu – Min .008″ Trace/Space 2 oz. Cu – Min .006″ Trace/Space
    3 oz. Cu – Min .012″ Trace/Space 3 oz. Cu – Min .008″ Trace/Space
    4 oz. Cu – Min .014″ Trace/Space 4 oz. Cu – Min .012″ Trace/Space
    5 oz. Cu – Min .016″ Trace/Space
    Inner Layers
    0.3 oz Cu – Min .002″ Trace/Space 0.5 oz Cu – Min .003″ Trace/Space
    0.5 oz Cu – Min .005″ Trace/Space 1 oz. Cu – Min .005″ Trace/Space
    1 oz. Cu – Min .006″ Trace/Space 2 oz. Cu – Min .008″ Trace/Space
    2 oz. Cu – Min .012″ Trace/Space 3 oz. Cu – Min .0012″ Trace/Space
    4 oz. Cu – Min .016″ Trace/Space
    Drilling
    Min drilled diameter, final board thickness 0.031″ or less 0.008″ 0.004″
    Min drilled diameter, final board thickness between 0.031″ and 0.062″ 0.010″ 0.006″
    Min drilled diameter, final board thickness between 0.062″ and 0.093″ 0.012″ 0.010″
    Min drilled diameter, final board thickness between 0.093″ and 0.125″ 0.015″ 0.012″
    Min laser diameter, dielectric thickness less than or equal to 0.004″ N/A 0.003″
    Min laser diameter, dielectric thickness between 0.004″ and 0.005″ N/A 0.004″
    Min laser diameter, dielectric thickness between 0.005″ and 0.007″ N/A 0.005″
    Controlled depth blind vias No Yes, max 0.75:1 aspect ratio
    Pre-drilled core blind vias No Yes
    Sub-lamination blind vias No Yes
    Build-up technology No Up to 4-N-4, Any layer
    Buried vias No Yes
    Filled vias Non-Conductive fill Non-Conductive or Conductive fill
    Nibbling No Yes
    Largest hole 0.247″ plated, 0.250″ non-plated No maximum
    Slots Plated or non-plated, routed Plated or non-plated, routed or nibbled
    Plating in holes 0.0008″ 0.0015″
    Plated hole to copper 0.008″ 0.005″
    Surface Finish
    Hot Air Solder Level (HASL – Lead) Yes Yes
    Hot Air Solder Level (HASL – Lead-Free) Yes Yes
    Electroless Nickel Immersion Gold (ENIG) Yes Yes
    Immersion Silver Yes Yes
    Hard Gold Fingers with ENIG Yes Yes
    Hard Gold Fingers with HASL Yes Yes
    Yes Yes
    Electrolytic Soft Gold Yes Yes
    Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) No Yes
    Organic Surface Protectant (OSP) Yes Yes
    Bare Copper Yes Yes
    Electroless Palladium Immersion Gold (EPIG) No Yes
    Tin Nickel No Yes
    White Tin Yes Yes
    Carbon Ink No Yes
    Soldermask
    Colors Green, Black, Blue, Red, White, Clear, Custom Yellow, Custom
    Finish/Texture Semi-gloss, Matte Semi-gloss, Matte
    Tented Vias Yes Yes
    Soldermask Plugged Vias Yes Yes
    Soldermask Thickness over Copper 5 micron to 25 micron 5 micron to 25 micron
    Soldermask Web 5 mil 3 mil
    Soldermask Gap to Pad 4 mil 2 mil
    Copper Ring Under Mask-Defined Pad 3 mil 1 mil
    Peelable Soldermask No Yes
    LPI Soldermask Yes Yes
    Dry Film Soldermask No Yes
    Silkscreen
    Colors Green, Black, Blue, Red, White, Clear, Custom Yellow, Custom
    Minimum Legend Width 3 mil 3 mil
    Space between Silkscreen and Pad 5 mil 4 mil
    Controlled Impedance
    Layers 0-10 Layers 0-30 Layers
    Impedance Tolerance Single-ended +/- 10% Single-ended +/- 5%
    Impedance Tolerance Differential Pairs +/- 10% Differential Pairs +/- 5%
    Impedance Tolerance Coplanar Waveguide +/- 10% Coplanar Waveguide +/- 5%
    TDR Testing Yes, Included Yes, Included
    Board Thickness
    1-Layer or 2-Layer Min .015″ | Max .200″ Min .008″ | Max .250″
    4-Layer Min .020″ | Max .200″ Min .015″ | Max .250″
    6-Layer Min .031″ | Max .200″ Min .025″ | Max .250″
    8-Layer Min .047″ | Max .200″ Min .031″ | Max .250″
    10-Layer Min .062″ | Max .200″ Min .040″ | Max .250″
    12-Layer Min .062″ | Max .200″ Min .047″ | Max .250″
    14-Layer Min .062″ | Max .200″ Min .054″ | Max .250″
    16-Layer Min .062″ | Max .200″ Min .062″ | Max .250″
    CNC / Routing / Score / Mechanical Rules
    Router Bit Size 0.078″ Min 0.021″, Max. 0.078″
    Spacing for Tab Rout Array 0.100″
    Standard V- Score Angle 30° 20°, 30°, 45°, 60°
    V-Score Depth One third of board thickness (min 0.010″)
    Jump Score No Yes, overshoot up to 0.35″
    Scoring Direction Vertical and Horizontal Routed Scoring
    Bevel Angle 20, 30, 45, or 60 Degree Gold Finger Bevel Milling/Offset or Recessed Beveling
    Countersinks 60, 82, 90, 100 Degree Countersink ** 60, 82, 90, 100 Degree Countersink **
    Counterbores Yes Yes
    Edge Castellations No Castellated Edges Min .040″
    Plated Edges No Yes
    Cross Section Level 1 Level 1, Level 2, Level 3

    Don't Take Risks When Ordering Your PCBs

    Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.

    ALLPCB

    ALLPCB is a Chinese PCB fabricator established in 2015. ALLPCB serves enterprises related to consumer electronics, communication equipment, Industrial Control (ISC), electronic instruments and apparatus, intelligent hardware, Internet of Things (IoT) application and Industry 4.0 solutions, etc.

    ALLPCB’s PCB Manufacturing Capabilities


    Technical index Mass Batch Small batch Sample
    Base Material FR4 Normal Tg Shengyi S1141, KB6160,Huazhen H140(not suitable for lead free process )
    Middle Tg For HDI, multi layers: SY S1000H、ITEQIT158、HuazhengH150; TU-662;
    High Tg For thick copper、high layer:SY S1000-2;  ITEQIT180A; HuazhengH170;ISOLA:FR408R; 370HR; TU-752;
    Halogen Free Middle Tg :SY S1150G、HuazhengH150HF、H160HF;high Tg:  SY S1165
    High CTI CTI≥600 SY S1600、Huazheng H1600HF、H1600A;
    High Frequency Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000
    High Speed SY S7439;TU-862HF、TU-872SLK;ISOLA:I-Speed、I-Tera@MT40;Huazheng:H175、H180、H380
    Flex Material Base Glue-free:Dupont AK  XingyangW-type, Panosonic RF-775;
    Coverlay SY SF305C、Xingyang Q-type
    Special PP No flow PP:       VT-447LF,Taiguang 370BL   Arlon 49N
    Ceramic filled adhesive sheet:   Rogers4450F
    PTFE adhesive sheet:    Arlon6700、Taconic FR-27/FR-28
    Double-sided coatingPI:  xingyang N-1010TF-mb
    Metal Base Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase
    Special High heat resistance rigidity PI: Tenghui VT-901、Arlon 85N,SY S260(Tg250)
    High thermal conductivity material:92ML
    Pure ceramic material:alumina ceramic、Aluminum nitride ceramics
    BT material:   Taiwan Nanya NGP-200WT
    Layers FR4 24 36 64
    Rigid&Flex /(Flex) 16(12) 20(12) 24(16)
    High Frequency Mixed Lamination 12 18 24
    100% PTFE 4 12 18
    HDI 2 steps 3 steps 4 steps
    Delivery Size
    (mm)
    Max(mm) 460*560 460*560 550*900
    Min(mm) 20*20 10*10 5*10
    Width / Gap Inner(mil) 0.5OZ base copper:  3/3      1.0OZ base copper:  4/4     2.0OZ base copper:  5/6
    3.0OZ base copper:  7/9      4.0OZ base copper: 8/12     5.0OZ base copper: 10/15
    6.0OZ base copper: 12/18     10 OZ base copper: 18/24    12 OZ base copper: 20/28
    Outer(mil) 1/3OZ base copper:  3/3     0.5OZ base copper:  4/4     1.0OZ base copper:  5/5
    2.0OZ base copper:  6/8     3.0OZ base copper: 7/10     4.0OZ base copper: 8/13
    5.0OZ base copper: 10/16    6.0OZ base copper: 12/18    10 OZ base copper: 18/24
    12 OZ base copper: 20/28    15 OZ base copper: 24/32
    Line Width Tolerance >5.0 mil ±20% ±20% ±1.0mil
    ≤5.0 mil ±1.0mil ±1.0mil ±1.0mil
    Copper Thickness Inner layer(OZ) 4 6 12
    Out layer(OZ) 4 6 15
    Board thickness(mm) 0.5-5.0 0.4-6.5 0.4-11.5
    Final Board Thickness >1.0 mm ±10% ±8% ±8%
    ≤1.0 mm ±0.1mm ±0.1mm ±0.1mm
    Board thickness/drill bit 10:1 12:1 13:1
    Contour Bevel edge 20~60 degree;±5degree
    Bow and twist ≤0.75% ≤0.75% ≤0.5%

    Drill & Hole

    Technical index Mass Batch Small batch Sample
    Drilling Min laser (mm) 0.1 0.1 0.1
    Min CNC(mm) 0.2 0.15 0.15
    Max CNC drill bit(mm) 6.5 6.5 6.5
    Min Half Hole(mm) 0.5 0.4 0.4
    PTH Hole (mm) Normal ±0.1 ±0.075 ±0.075
    Pressing Hole ±0.05 ±0.05 ±0.05
    Hole Angle (conical) Width of upper diameter≤6.5mm:800、900、1000、1100;Width of upper diameter≥6.5mm:900;
    Precision of Depth-control Drilling(mm) ±0.10 ±0.075 ±0.05
    Number of blind CNC holes of one side ≤2 ≤3 ≤4
    Minimum via hole spacing (different network, military, medical, automobile )mm 0.50 0.45 0.40
    Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm 0.4 0.35 0.3
    The minimum hole wall spacing of the over hole (the same network mm) 0.20 0.2 0.15
    Minimum hole wall spacing (mm) for device holes 0.80 0.70 0.70
    The minimum distance from via hole to the inner copper or line 0.2 0.18 ≤10L: 0.15
    >10L: 0.18
    The min distance from Device hole to inner copper or line 0.3 0.27 0.25
    Welding Ring
    (mil)
    Via hole 4(HDI 3mil) 3.5(HDI 3mil) 3
    Component hole 8 6 6
    Final Board Thickness >1.0 mm ±10% ±8% ±8%
    ≤1.0 mm ±0.1mm ±0.1mm ±0.1mm
    CNC contour tolerance(mm) ±0.15 ±0.10 ±0.10
    V-CUT Tolerance of residual thickness(mm)
    (mm)
    ±0.15 ±0.10 ±0.10
    Routing slot(mm) ±0.15 ±0.10 ±0.10
    Precision of controlled deep milling(mm) ±0.15 ±0.10 ±0.10

    Solder Mask

    Technical index Mass Batch Small batch Sample
    Solder Dam (mil) (solder mask) 5 4 4
    (hybrid) 6 5 5

    Surface Treatments

    Technical index Mass Batch Small batch Sample
    Surface Treatments Immersion gold Ni thickness
    (micro inch)
    118-236 118-236 118-236
    Max gold (uinch) 3 3 6
    Hard gold(Au thick) Gold finger
    (uinch)
    15 30 60
    NiPdAu NI
    (uinch)
    118-236
    PA
    (uinch)
    2-5
    Au
    (uinch)
    1-5
    Graph electric gold NI
    (uinch)
    120-400
    AU
    (uinch)
    1-3
    Immersion tin Tin
    (um)
    0.8-1.2
    Immersion Ag Ag
    (uinch)
    6-10
    OSP thick
    (um)
    0.2-0.5
    HAL/HAL LF BGApad(mm) ≥0.3×0.3
    thickness
    (mm)
    0.6≤H≤3.0
    Board thickness vs hole diameter Press hole≤3:1
    Tin(um) 2.0-40.0

    Rigid & Flex

    Technical index Mass Batch Small batch Sample
    Rigid & Flex Maximum dielectric thickness of flex Glue –free 25um Glue-free 75um Glue-free75um
    Flex part width(mm) ≥10 ≥5 ≥2
    Max delivery size (mm) 200×400 200×500 400 ×550
    distance of via hole to edge of Rigid&flex(mm) ≥1.2 ≥1.0 ≥0.8
    (mm)distance of components hole to the edge of R&F ≥1.5 ≥1.2 ≥1.0
    Rigid & Flex Structure The outer layer structure of the flex part, the PI reinforcement structure and the separation structure Aluminum based rigid flex , rigid flex HDI, combination, electromagnetic shielding film

    Special Tech

    Technical index Mass Batch Small batch Sample
    Special Tech Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination Buried magnetic core PCB Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB,  buried riveting nut PCB, embedded components PCB

    Don't Take Risks When Ordering Your PCBs

    Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.

    JLCPCB

    JLCPCB is a Chinese PCB fabricator established in 2006.

    JLCPCB’s PCB Manufacturing Capabilities


    Features Capability Notes
    Layer count 1,2,4,6 layers The number of copper layers in the board.
    Controlled Impedance 4/6 layer, default layer stack-up Controlled Impedance PCB Layer StackupJLCPCB Impedance Calculator
    Material FR-4 FR-4 Standard Tg 130-140/ Tg 155
    Dielectric constant 4.5(double-side PCB)

    7628 structure 4.6

    2313 structure 4.05

    2116 structure 4.25

    Max. Dimension 400x500mm The maximum dimension JLCPCB can accept
    Dimension Tolerance ±0.2mm ±0.2mm for CNC routing, and ±0.4mm for V-scoring
    Board Thickness 0.4/0.6/0.8/1.0/1.2/1.6/2.0mm The thickness of finished board.

    Thickness Tolerance

    ( Thickness≥1.0mm)

    ± 10% e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%)

    Thickness Tolerance

    ( Thickness<1.0mm)

    ± 0.1mm e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1).
    Finished Outer Layer Copper 1 oz/2 oz (35um/75um) Finished copper weight of outer layer is 1oz or 2oz.
    Finished Inner Layer Copper 0.5 oz (17um) Finished copper weight of inner layer is 0.5oz only.

    Drill/Hole Size

    Features Capability Notes
    Drill Hole Size (Mechanical) 0.20mm- 6.30mm Min. drill size is 0.20mm. Max. drill size is 6.30mm.
    Drill Hole Size Tolerance +0.13/-0.08mm e.g. for the 0.6mm hole size, the finished hole size between 0.52mm to 0.73mm is acceptable.
    Blind/Buried Vias Don’t support Currently we don’t support Blind/Buried Vias, only make through holes.
    Min. Via hole size 0.2mm For Single&Double Layer PCB, the minimum via hole size is 0.3mm;For Multi Layer PCB, the minimum via hole size is 0.2mm
    Min. Via diameter 0.45mm For Single&Double Layer PCB, the minimum Via diameter is 0.6mm;For Multi Layer PCB, the minimum via diameter is 0.45mm.
    PTH hole Size 0.20mm – 6.35mm The annular ring size will be enlarged to 0.15mm in production.
    Pad Size 0.70mm- 6.35mm The pad hole size will be enlarged 0.15mm in production.
    Min. Non-plated holes 0.50mm The minimum NPTH dimension is 0.50mm, Please add the NPTH in the mechanical layer or keep out layer.
    Min. Plated Slots 0.65mm The minimum plated slot width is 0.65mm, which is drawn with a pad.
    Min. Non-Plated Slots 1.0mm The minimum Non-Plated Slot Width is 1.0mm, please draw the slot outline in the mechanical layer(GML or GKO)
    Min. Castellated Holes 0.60mm The minimum diameter of castellated holes is 0.60mm.
    Hole size Tolerance (Plated) +0.13mm/-0.08mm e.g. for the 1.00mm Plated hole, the finished hole size between 0.92mm to 1.13mm is acceptable.
    Hole size Tolerance (Non-Plated) ±0.2mm e.g. for the 1.00mm Non-Plated hole, the finished hole size between 0.80mm to 1.20mm is acceptable.
    Rectangle Hole/Slot Don’t support We don’t make rectangle hole/slot,the rectangle hole/slot will be made as round or oval hole/slot by default.

    Minimum Annular Ring

    Minimum annular ring PTH
    1oz Copper 0.13mm 0.3mm
    2oz Copper 0.2mm 0.3mm

    Minimum clearance

    Features Capabilities
    Hole to hole clearance(Different nets) 0.5mm
    Via to Via clearance(Same nets) 0.254mm
    Pad to Pad clearance(Pad without hole, Different nets) 0.127mm
    Pad to Pad clearance(Pad with hole, Different nets) 0.5mm
    Via to Track 0.254mm
    PTH to Track 0.33mm
    NPTH to Track 0.254mm
    Pad to Track 0.2m

    Minimum trace width and spacing

    Copper weight Min. Trace width Min. Spacing
    H/HOZ (Inner layer) 5mil (0.127mm) 5mil (0.127mm)
    1oz (Outer layer) 1/2 layers: 5mil (0.127mm)
    4/6 layers: 3.5mil(0.09mm)
    1/2 layers: 5mil (0.127mm)
    4/6 layers: 3.5mil(0.09mm)
    2oz (Outer layer) 8mil (0.2mm) 8mil (0.2mm)

    BGA

    Layer count Min. BGA Pad Dimensions Min. Distance Between BGA
    1/2 layers 0.4 mm 0.127mm
    4/6 layers 0.25 mm 0.127mm

    Solder Mask

    Features Capabilities Notes
    Solder mask opening/ expansion 0.05mm The solder mask should have a minimum of a 0.05 mm “growth/mask opening” around the pad to allow for any mis-registration.
    Solder bridge

    0.2mm(green)

    0.254mm(other colors)

    To have solder mask bridge, the spacing between copper pads edge must be 0.2mm (8mils) or more.
    Solder mask color green, red, yellow, blue, white, and black. We use LPI (Liquid Photo Imageable) solder mask. It is the most common type of mask used today.
    Solder mask dielectric constant 3.8
    Solder mask thickness 10-15UM

    Legend

    Features Capabilities Notes
    Minimum Line Width 6 mil (0.153mm) Characters width less than 6mil(0.153mm) will be unidentifiable.
    Minimum text height 32 mil (0.8mm) Characters height less than 32mil(0.8mm) will be unidentifiable.
    Character width to height ratio 1:6 The preferred ratio of width to height is 1:6.
    Pad To Silkscreen 0.15mm The Minimum Distance Between Pad and Silkscreen is 0.15mm.

    Board Outlines

    Features Capabilities Notes
    Trace to Outline 0.2mm Ships as individual board(Rounting):Trace to Outline≥0.2mm
    Trace to V-cut line 0.4mm Ship as panel with V-scoring: Trace to V-cut line≥0.4mm

    Panelization

    Features Capabilities Notes
    Panelization without space 0mm The space between boards is 0mm.
    Panelization with space 2mm Make sure the space between boards should be ≥2mm,otherwise it will be hard to process for rounding.
    Panelized Round board ≥20mmx20mm

    The single round board size should be≥20mmx20mm.

    Panelize with stamp holes and add tooling strips on four board edges

    Panelized castellated holes board Panelize with stamp holes and add tooling strips on four board edges

    The distance between castellated hole and board corner should be larger than 4mm.

    Recommended diameter of stamp hole is 0.5mm-0.8mm;

    Recommended distance between the two stamp holes is 0.2-0.3mm

    Min. Width of Breakaway Tab 4mm The minimum width of breakaway tab is 4mm. For breakaway with mouse-bites, the minimum width is 5mm.
    Min. Edge Rails 4mm If choosing panel by JLCPCB, we will add 5mm edge rails on both sides by default.

    Don't Take Risks When Ordering Your PCBs

    Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.

    PCBgogo

    Operating since 2017, PCBgogo is PCB and PCB assembly manufacturer in China.

    PCBgogo’s PCB Manufacturing Capabilities


    No. Item Manufacturing Capabilities 
    1 Material FR-4 (Fiberglass)
    2 Number of Layers

    1 Layer, 2 Layers, 4 Layers, 6 Layer, 8 Layers,

    10 Layers

    3 TG Grade TG130~140, TG150~160, TG170~180
    4 Max PCB Size

    1 layer & 2 layers: 1200*300mm or 600*500mm

    Multi-layers: 600*500mm

    5 Min PCB Size 5mm*5mm
    6 Board Size Tolerance(Outline)

    ±0.2mm(CNC routing)

    ±0.5mm(V-scoring)

    7 Surface Finish HASL with lead, HASL lead free, Immersion gold(ENIG), OSP, Hard gold, ENEPIG, Immersion silver (Ag), None
    8 Board Thickness

    1 Layer/2 Layers: 0.2~2.4mm

    4 Layers: 0.4~2.4mm

    6 Layers: 0.8~2.4mm

    8 Layers: 1.0~2.4mm

    10 Layers: 1.2~2.4mm

     

    Note: Customized PCB thickness and Layer stackup are acceptable.

    9 Board Thickness Tolerance

    Thickness≥1.0mm: ±10%

    Thickness<1.0mm: ±0.1mm

     

    Note: Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface.

    10 Outer Layer Copper Thickness

    1oz/2oz/3oz

    (35μm/70μm/105μm)

     

    Note:

    2oz

    PCB thickness≥1.2mm,

    Via size≥0.25mm,

    Min Track/Spacing≥0.15mm

     

    3oz

    PCB thickness≥2.0mm,

    Via size≥0.3mm,

    Min Track/Spacing≥0.2mm

    11 Inner Layer Copper Thickness

    1oz/1.5oz

    (35μm/50μm)

    12 Outer layer Min track/spacing ≥3mil
    13 Inner layer Min track/spacing ≥4mil
    14 Annual ring size ≥0.13mm
    15 Grid Line track/spacing ≥0.2mm
    16 Coil board Line track/spacing ≥0.2mm
    17 BGA pad size ≥0.2mm
    18 BGA Distance ≥0.12mm
    19 Board Outlines

    Track to Outline: ≥0.3mm

    Trace to V-cut line: ≥0.4mm

    20 Finished Hole Size Tolerance ±0.08mm
    21 Finished Hole Diameter(CNC)

    0.2mm~6.3mm

     

    1. PCB Thickness=2.0mm, Min

    hole size is 0.3mm

    2. PCB Thickness=2.4mm, Min

    hole size is 0.4mm

    3. Copper Thickness=2OZ, Min

    hole size is 0.25mm

    4. Copper Thickness=3OZ, Min

    hole size is 0.3mm

    22 TH Via Distance

    Equipotential: 0.15mm

    Isoelectric: 0.25mm

    23 Plated Slot Size

    ≥0.5mm

     

    Note:

    L:W=2.5: 1 (Should be 2.5:1 or

    higher. If it is less than this, the holes may be misaligned.)  If you can’t draw a long hole in your design, you can draw a continuous round hole and it will be regarded as a long hole. Also, it is okay to draw the oblong hole in Profile Layer instead of  Drilling Layer.

    24 Castellated Holes ≥0.6mm
    25 Non-Plated Holes ≥0.8mm
    26 NPTH to Copper Line ≥0.2mm
    27 Soldermask Green, Red, Yellow, White, Black, Blue, Purple, Matte Green,Matte Black,None
    28 Soldermask Thickness 20~30um
    29 Soldermask Bridge

    Green: ≥0.1mm

    Others: ≥0.15mm

    30 Soldermask to soldering pad distance ≥0.05mm
    31 Silkscreen White, Black, Yellow, None
    32 Minimum Character Width(Legend)

    ≥0.15mm

     

    Note: Characters of less than 0.15mm wide will be too narrow to be identifiable.

    33 Minimum Character Height (Legend)

    ≥0.75mm

     

    Note: Characters of less than 0.8mm high will be too small to be recognizable.

    34 Character Width to Height Ratio (Legend) 1: 5 (In PCB silkscreen legends processing, 1:5 is the most suitable ratio)
    35 Silkscreen to Soldermask Distance ≥0.1mm
    36 V-cut Line

    ≥75mm

     

    Note:

    PCB thickness≥0.6mm

    Details refer to right side

    picture

    37 V-cut Line Distance ≥3.5mm
    38 Distance betwen Board to Board 0.8mm
    39 Stamp-hole Width

    2.0mm

     

    Note: PCB size and thickness are subject to review by PCBGOGO.

    40 Tab-route Width

    ≥1.6mm

     

    Note: PCB size and thickness are subject to review by PCBGOGO.

    41 Edge Rail

    ≥3.5mm

     

    Note: If choosing panel by PCBGOGO, we will add 5mm edge rails on both sides by default.

    42 Gold Finger

    Bevelling Angle: 30~45°

    Depth: ≥1mm

    Length: 45mm~280mm

     

    Note: Board thickness≥1.2mm

    43 Special Specification

    Impedance control

    Custom Layer Stackup

    Interstitial Via Hole(IVH)

    Via in pad

    Via filled with resin

    Countersinks/Counterbores

    Carbon Mask

    Halogen-Free

    Z-axis milling

    Edge Plating

    Others

    Don't Take Risks When Ordering Your PCBs

    Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.

    PCBWay

    PCBWay is a PCB manufacturer and SMT Assemblers in China.

    PCBgogo’s PCB Manufacturing Capabilities


    Items Spec.
    Number of Layers General PCB board 2-40
    Buried IC yes
    HDI(buried and blind vias) HDI(5+N+5)
    staggered and stacked vias
    Materials FR4(shengyi) yes
    High Tg Tg-220
    EHalongen Free yes
    High Frequency yes
    Maximum board size 20*35inch(508*889mm)
    Board thickness 0.21-6.0mm
    Minimum track line 2mil-inner 2mil-outer
    Minimum Spacing line 2mil-inner 2mil-outer
    Outer layer copper thickness 7oz
    Inner layer copper thickness 7oz
    Min. finished hole size(Mechanical) 0.15mm yes
    Min. finished hole size(laser hole) 0.076mm yes
    Aspect ratio 12:1
    Solder Mask Types and brand NAYA(LP_4G) yes
    Tamura(TT19G) yes
    TAIYO(PSR2200) yes
    Solder Mask Color green;blue;red;white;black yes
    Impedance Control Tolerance ±10%,50Ω and below:±5Ω yes
    Plug via hole Min.size can be plugged: 0.1mm
    Max.size can be plugged: 0.7mm
    Min. annular ring can be kept 3mil
    Min. distance between the IC pads
    can keep SM bridge
    8mil
    Min. SM bridge for green soldermask 3mil
    Min. SM bridge for black soldermask 4mil
    Surface Treatment HASL yes
    ENIG yes
    OSP yes
    LEAD FREE HASL yes
    GOLD PLATING yes
    IMMERSION Ag yes
    IMMERSION Sn yes
    V-Cut CNC V-cut, degree 20304560
    V-cut by hand, degree 20304560
    Outline Profile CNC
    Chamfer The angle typeof the chamfer: 203045
    Min. distance of jumping chamfer: 5mm
    Tolerance of the dimension size ±0.1mm
    Tolerance of the board thickness 0.21-1.0 ±0.1
    1.0-2.5 ±7%
    2.5-6.3 ±6%
    Tolerance of the finished hole size 0-0.3mm ±0.08mm
    0.31-0.8mm ±0.08mm
    0.81-1.60mm ±0.05mm
    1.61-2.49mm ±0.75mm
    2.5-6.0mm +0.15/-1mm
    >6.0mm +0.3/-1mm
    Certificates(copies are needed) UL yes
    ISO9001 yes
    ISO14000 yes
    ROHS yes
    TS16949 yes
    Technotronix is a PCB manufacturer based in Anaheim, California, with over 40 years of experience in providing advanced PCB manufacturing services using latest PCB technology and machinery.

    TechnoTronix’s PCB Manufacturing Capabilities


    Capability Standard
    Layer Count Multilayer PCB up to 24 & 32 Layers
    Type Multilayer Rigid PCB
    Multilayer Flex PCB
    Multilayer Rigid-Flex PCB
    Alternative Finish Hot Air Solder Level (HASL)
    Electroless Nickel / Immersion Gold (ENIG)
    Silver
    Electroless Tin Lead
    Tin Nickle
    Organic (OSP)
    Hard Gold (edge contact)
    Carbon
    Peelable
    Custom Specified Finishes are also available!
    Testing protocols include

    Flying Probe test
    Functional testing for the specific design, and more.
    Impedance Test
    Solderability Test
    Electrical testing to ensure that there are no short circuits on the board.
    Thermal Shock Test
    Hole resistance test
    Automated Optical Inspection to check for aspects such as missing pads, spacing violations and more.

     

     

    Rigid flex boards with the following specifications:

    Capability Standard
    Types of Rigid Flex PCB Single Sided Rigid Flex Boards
    Double Sided Rigid Flex PCBs
    Multilayer Rigid Flex circuit boards
    Layer Count 2 – 24 multilayerss
    Materials Polyimide
    FR4
    Copper Thickness 9 µm
    12 µm
    18 µm
    35 µm
    Min. Line / Spacing 125 µm / 125 µm
    Smallest Drill 0.28 mm
    Surfaces Immersion Ni/Au
    OSP
    Plated Ni/Au
    Immersion Tin
    Stiffener Material FR4
    Steel
    Aluminum
    Min. Annular Ring 150 µm
    Min. Solder mask Dam 100 µm
    Drill to copper – Outer layers 8 mil
    Drill to copper – Inner layers 10 mil
    Minimum Pitch 0.5 mm
    Copper Thickness 0.5 oz. – 4 oz.
    Copper to Board Edge 0.007″
    Minimum Hole Size 0.004″
    Coverlay Opening 0.003″
    With offices in San Mateo and San Diego, California, San Francisco Circuits has been providing advanced printed circuit board (PCB) fabrication, assembly, and services worldwide since 2005.

    San Francisco Circuit’s PCB Manufacturing Capabilities


    Specifications Standard Technology Advanced Technology
    Number of Layers

    1 – 12

    14 – 40

    Quick Turn Times

    up to 24 hours for bare board fabrication or assembly (1-6 layers)
    up to 48 hours for fabrication and assembly (1-6 layers)
    3 to 7 days (6 to 16 layers, some advanced technologies)

     

     

     

     

     

     

    Board Material

    Rigid PCB Materials

    FR4

    FR406

    370HR

    VT-47

    FR408

    Arlon

    CEM

    Megtron 6

    Astra MT77

    Tachyon 100G

    Nelco 4000
    Rogers 3000 Series
    Rogers 4000 Series
    Rogers 5000 Series
    Rogers 6000 Series

    Taconic TLY

    Polyimide

     

    MCPCB, Aluminum Core & Copper Core Materials

    Aluminum Core

    Copper Core

    Ventec VT-4A1/VT-4A2

    Aismalibar Fastherm

    Aismalibar Flextherm

     

    Flex PCB Materials

    Kapton

    Shin-Etsu – Epoxy
    Adhesive System

    Rogers – Epoxy
    Adhesive System

    Dupont FR – FR Acrylic
    Adhesive System

    Dupont LF – LF Acrylic
    Adhesive System

    Adhesiveless Base Materials

    Aluminum Core

    Ventec VT-4A1/VT-4A2

    Aismalibar Fastherm

    Aismalibar Flextherm

    Copper Core

    Nelco 4000

    Rogers 3000
    Rogers 4000
    Rogers 5000
    Rogers 6000 Series

    Taconic TLY

    Polyimide

    Minimum Board Thickness

    2 layer – 0.010″

    4 layer – 0.020″

    6 layer – 0.020″

    8 layer – 0.062″

    10 layer – 0.062″

    12 layer – 0.062″

    2 layer – 0.005″

    4 layer – 0.010″

    6 layer – 0.031″

    8 layer – 0.040″

    Maximum Board Thickness

    2 layer – 0.125″

    3-12 layer – 0.200″

    0.250″ – 0.500″

    Maximum Board Size

    16″ x 22″

    12″ x 21″

     

    10″ x 16″

    16″ x 22″

    12″ x 21″

     

    Copper Thickness

    0.5 oz – 3 oz 

    4 oz – 10 oz

    Hole Aspect Ratio

    7 : 1

    15 : 1

    Minimum Hole Size

    0.008″

    0.004″

    Minimum Trace/Space

    0.006″/0.006″

    0.002″/0.002″

    Minimum
    Drill-to-Copper

    0.010″

    0.005″

    Minimum Pitch

    1 mm

    0.3 mm

    Final Finish

    HASL (Solder)

    Lead Free Solder

    Copper

    Gold

    Gold Fingers

    White Tin

    ENEPIG

    ENIG

    HASL

    Gold (ENIG/Hard/Soft)

    Selective Gold

    Immersion Silver

    OSP

    White Tin

    ENEPIG

    Solder Mask

    LPI:

    Green

    Black

    Red

    Blue

    Yellow

    White

    Clear

    LPI:

    Green

    Black

    Red

    Blue

    Yellow

    White

    Clear

    Mix-and-match

    Wet Mask

    Dry Film

    Coverlay

    FR Coverlay

    LF Coverlay

    Shin-Etsu

    Flexible Soldermask

    Silk Screen

    White

    Black

    Yellow

    White

    Black

    Yellow

    Green

    Red

    Blue

    PCB Fabrication

    Scoring

    Route & Retain

    Jump Scoring

    Route & Retain

    Milling

    Additional Features

    Plated Slots

    Non-plated Slots

    Controlled Dielectric

    Covered Vias

    Counter Sinks

    Counter Bores

    Dual Access Flex

    Suspended Leads

    Plated Edges

    Plated Milling

    Plated Counter Bores & Counter Sinks

    Edge Castellation

    Controlled Impedance

    Silver Filled Vias

    Non-Conductive Filled Vias

     

    Quality Standards

    IPC 6012 Class 2

    Electrical Testing

    100% Netlist Testing

    TDR Testing

    Milspec 31032

    Milspec 55110

    Milspec 50884

    IPC 6012 Class 3

    100% Netlist Testing

    TDR Testing

    Special Technology

     

    Blind & Buried Vias

    Laser Drilled Vias

    Mechanically Drilled Micro Vias

    Metal Core Boards

    Burn-in Boards

    Rigid-Flex Boards

    Flex Boards

    RF PCBs

    Don't Take Risks When Ordering Your PCBs

    Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.