Finding a PCB manufacturer could prove to be a time-consuming and risky task. A web search returns many search results with no easy way to compare the various PCB companies.
When choosing a PCB manufacturer, there are a number of factors to consider such as quality, capabilities, customer service, price, customer satisfaction, and trustworthiness.
The good news is that we have done a lot of the research and analysis for you.
Here is our list of the top 10 PCB manufacturers
As a start, we have compiled the table below, which shows some of the manufacturing capabilities and information about customer reviews for eight primary PCB manufacturers.
| Criteria | Advanced Circuits/4pcb.com | Sunstone Circuits | Bay Area Circuits | allpcb.com | jlcpcb.com | pcbgogo.com | pcbway.com | Camptech |
| # of Google reviews | 6 | 9 | 3 | 12 reviews on Trustpilot | 151 Facebook reviews | 17 reviews on Trustpilot | 57 reviews on Trustpilot | 10 |
| Avg. review rating (out of 5) | 3.2 | 4.2 | 5 | 3.2 | 4.5 | 3.6 | 3.8 | 4.6 |
| Extensiveness/depth of the information offered in reviews | Poor | Fair | Fair | Good | Good | Good | Good | Good |
| Overall do the reviews seem trustworthy | No | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Controlled impedance | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Minimum hole size | 0.1 mm | .15 mm | .08 mm | 0.2 mm | 0.2 mm | .15 mm | 0.1 mm | 0.05 mm |
| Trace width/Trace Spacing | 3 mil | 3 mil | 3 mil/3 mil | 4 mil | 5 mil/5mil | 3 mil/3 mil | 3 mil/3 mil | 3 mil/3 mil |
| Aspect ratio | 12:1 | 15:1 | 12:1 | 20:1 | 12:1 | |||
| Routing tolerance | ± .15 mm | ± .08 mm | ± 0.15 mm | ± 0.2 mm | ± 0.2 mm | ± .15 mm | ||
| Min. SMT Pitch | 0.25 mm | .1mm | 0.4 mm | .15 mm | ||||
| Blind & Buried vias | Yes | Yes | Yes | Yes | No | Yes | Yes | Yes |
| Via in pad | Yes | No | Yes | Yes | Yes | |||
| Stacked micro-vias | Yes | Yes | Yes | No | Yes | Yes | Yes | |
| Flexible PCB | No | No | No | Yes | No | Yes | Yes | Yes |
| Location | U.S | U.S | U.S | China | China | China | China | Canada |
| Overall score based on fabrication capabilities, quality & customer service reviews (10 being highest) | 6 | 6.5 | 7 | 7 | 7 | 8 | 8 | 9 |
| Advanced Circuits/4pcb.com | Sunstone Circuits | Bay Area Circuits | allpcb.com | jlcpcb.com/ | pcbgogo.com | pcbway.com | Camptech |
Camptech Circuits
For over 40 years, electronics manufacturers have trusted and relied on Camptech II Circuits’ expertise and production capabilities to manufacture their printed circuit boards. Whether your PCB is a simple one layer design or you require a multilayer board with controlled impedance and stacked microvias built, you can depend on us to manufacture your circuit boards with affordable pricing.
Camptech’s PCB Manufacturing Capabilities
Delivery
- 2 to 10 days for prototypes
- 5 days to 4 weeks for production
PCB Types
- Rigid
- Flex
- Rigid-Flex
- Metal Core
- Hybrid
Silkscreen
- White
- Black
- Yellow
- Custom Colors
Components locations and other markings on a PCB are identified using a silkscreen legend.
Soldermask
- Solder mask registration tolerance – up to +/-0.002”
- Minimum width of solder mask bridge: 4mil (Green), 5mil (other color); 8 mil on copper area
Soldermask colors
- Green
- Red
- Blue
- Black
- White
- Yellow
- Custom colors
- Peelable Mask
Soldermask types
- Liquid Photo Imageable (LPI)
- Laser Direct Imaging (LDI)
Surface Finishes
Aspect Ratio
The Aspect Ratio is defined as the scale of board thickness compared to the diameter of the drilled via. If you have a board with a 0.24″ thickness and a via with a 0.02″ diameter, the aspect ratio is 12:1. The higher this ratio, the increased plating that will be around a via compared to inside the via.
Laminate Materials
- FR4
- High TG FR4
- Rogers
- Arlon
- Aluminum Base
- Polyimide
- Ceramic
- Taconic
- Megtron, etc.
Blind/Buried Vias
- Minimum epoxy filled via hole diameter – 4 mil
- Maximum aspect ratio for filled vias – 10:1
- Epoxy fill types – conductive & non-conductive
A blind via is a connection from an outer layer of a board to one or more inner layers without exiting out the opposite side of the board.
Plugged Vias
- Solder mask
- Non-Conductive Epoxy
- Finished hole size for via filled with resin: 4mil to 22.5 mil>
Routing Tolerance
- ± 5 mil
Inner Layer Copper
| Inner copper layer | Minimum trace/space |
| 0.5 oz. | 0.003” |
| 1 oz. | 0.00375” |
| 2 oz. | 0.005” |
| 3 oz. | 0.009” |
| 4 oz. | 0.012” |
Scoring Tolerance
- ± 10 mil
Outer Layer Copper
| Outer copper layer | Minimum trace/space |
| 0.5 oz. | 0.003” |
| 1 oz. | 0.0045” |
| 2 oz. | 0.007” |
| 3 oz. | 0.009” |
| 4 oz. | 0.014” |
| 5 oz to 20 oz. | Please contact us |
Stacked Microvias
- Yes
Number of Layers
- 1 to 30 Layers Rigid PCBs
- 1 to 10 Layer Flexible PCBs
A PCB is made up of layers of copper foil and insulating material, laminated to the substrate.
Pad (Ring)
- Min pad size for laser drilling – 10 mil (4 mil laser via)
- Min pad size for mechanical drilling – 16 mil (8 mil drilling)
- Min BGA pad size – 7 mil
Traces
- Minimum trace width – 3 mil
- Minimum trace spacing – 3 mil
Controlled Impedance & Simulations
- ± 10% tolerance
Hole Sizes
Minimum mechanical hole size
- 6 mil
Laser hole size
- Minimum 4 mil, maximum – 6 mil
Minimum SMT Pitch
- 5 mil
Layer to Layer Registration
- ± 3 mil
Via in Pad
- Yes
Electrical Test
Min. Dielectric Thickness
- 2 mil
Other Services
- Panelization
- Profiling
- Routing
- V-Scoring
- Edge-Plating
- Control Depth Holes
- Countersink Holes
- Castellation Holes
Don't Take Risks When Ordering Your PCBs
Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.
Advanced Circuits offers printed circuit board manufacturing with two options: Standard & Custom Spec. Choosing between the two options will depend on your PCB design requirements and specifications.
Here are some highlights of their service:
- Lead Time: Same Day – 4 Weeks
- Layer Count: 0 – 40 Layers
- Cu Weight: Up to 20 oz.
- Trace/Space: Down to .0025”
- Via-In-Pad
- Blind & Buried Vias
- Laser Direct Imaging
- Oversized Boards
- Stacked Microvias
- Down To .3mm Pitch
- Cavity Boards
- Buried Chip Resistors
- Laser-Drilled Microvias
Advanced Circuits’ PCB Manufacturing Capabilities
| Specification | Standard | Custom |
| Layer Count | 0 – 10 Layers | 0 – 40 Layers |
| Turn Time | Same Day – 5 Day | Same Day – 4 Weeks |
| Quantity Req. | 1 – 10000+ | 1 – 10000+ |
| Materials | FR-4 | FR-4/Rogers/Polyimide/Aluminum Clad/High-Temp. FR4 & others |
| Plating Finish | Lead-Free HAL* | Electrolytic Hard Gold/Soft Gold/ENIG/Nickel/Immersion Silver |
| OSP/Leaded & Lead-Free HAL | ||
| Cert. / Qualifications | IPC Class 2 – A600 | IPC6012 Class 2-3A / IPC6018 Class 3 MIL-PRF-31032 / MIL-PRF-55110 / ISO |
| 9001:2008 / AS9100C | ||
| Board Thickness | .031″ / .062″ / .093″ / .125″ | Full Range Available |
| Copper Weight | 1 oz. Inner / Up to 2 oz. Outer | 0.5 – 4 oz. Inner / 1 – 20 oz. Outer |
| Trace/Space | 5 / 5 Mils | Down to 2.75 / 3 Mils |
| Solder Mask (LPI) | Green | Various Color Options |
| Legend | White | Various Color Options |
| Min. Hole Size | 0.010″ | 0.004″ |
| Hole Tolerance | +/- 0.005″ | +/- 0.003″ (Upon Request) |
| Route Tolerance | +/- 0.010″ | +/- 0.005″ (Upon Request) |
| Slots/Cutouts/Edges | Non-Plated Only | Plated / Non-Plated |
| Plated Holes | Plated / Non-Plated | Plated / Non-Plated |
| UL Markings/Dates | Yes** | Yes** |
| Lead-Free Markings | Yes | Yes |
| Gold Fingers | Yes | Yes |
| Fiducials | Yes | Yes |
| Scoring | Yes | Yes |
| ITAR | Yes | Yes |
| Castellated Holes | X | Yes |
| Controlled Dielectric | X | Yes |
| Controlled Impedance | X | Yes |
| Counter Sinks | X | Yes |
| Counter Bores | X | Yes |
| Blind/Buried Vias | X | Yes |
| Microvias | X | Yes |
| Mask Plugged Vias | X | Yes |
| Via-in-Pad | X | Yes |
| Etch Back | X | Yes |
| Tetra Etch | X | Yes |
| Cover Coat | X | Yes |
| Cavity Process | X | Yes |
| Laser Rout | X | Yes |
| LPI Legend | X | Yes |
| Edge Mill | X | Yes |
| Unique Serialization | X | Yes |
| Back Drilling | X | Yes |
| Controlled Depth Drill | X | Yes |
Don't Take Risks When Ordering Your PCBs
Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.
Sunstone Circuits
Based in Mulino, Oregan, Sunstone Circuits offers PCB fabrication services.
Here is the list of their manufacturing capabilities:
Sunstone Circuits’ PCB Manufacturing Capabilities
| Drill Capabilities | |
| Smallest Drill Size | 0.005″ |
| Largest Drill Size | 0.250″ +/- 0.002″ |
| *Note: Holes > 0.250″ are considered cutouts | |
| Positional Tolerance | |
| Control Depth Tolerance | +/- 0.0005″ |
| Microvia | Yes |
| Blind / Buried Via | Yes |
| Min. Pad Size (via) | via + 0.006″ |
| Min. Pad Size (component) | hole + 0.010″ |
| Route Capabilities | |
| Board Size Tolerances (Rout) | +/- 0.003″ |
| Board Size Tolerance (Laser) | +/- 0.001″ |
| V-Score Web Thickness | +/- 0.002″ |
| V-Score Line Width | +/- 0.002″ |
| Etch Tolerances | |
| Trace width (of design) | +/- 0.0005″ |
| Minimum Trace Width | 0.002″ |
| Surface Finish | |
| Tin / Lead Solder (HASL) | Yes |
| Immersion Silver | Yes* |
| ENIG | Yes* |
| Copper Only | Yes* |
| OSP | Yes* |
| ENIPIG | Yes* |
| Full Body Hard Gold | Yes* |
| Soft Bondable Gold | Yes* |
| Lead Free Solder | Yes* |
| *Denotes RoHS Compliant Finish | |
| Board Parameters | |
| Layer Count | 0 – 36 |
| Board Thickness | 0.003″ – 0.187 |
| Copper Weight (finished) | 0.25 oz – 6 oz |
| Materials | |
| FR-4 150 Tg (RoHS Compliant) | Yes |
| FR-4 170 Tg (RoHS Compliant) | Yes |
| Rogers RO 3000(R) Series | No |
| Rogers RO 4000(R) Series | Yes |
| Rogers RT/duroid(R) Series (5000 and 6000 Series) | Yes |
| Arlon | Yes |
| Polyflon | Yes |
| Taconic | Yes |
| Certifications | |
| UL Listed | |
| ITAR Registered | |
| Other Sunstone Capabilities | |
| Controlled Impedance | |
| Full-Service CAM Tooling |
Don't Take Risks When Ordering Your PCBs
Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.
Bay Area Circuits
Bay Area Circuits’ PCB Manufacturing Capabilities
| Standard Capability | Advanced Capability | |
| Minimum Layer Count | 1 | 1 |
| Maximum Layer Count | 16 | 30 |
| Trace/Space | 0.006″ | 0.002″ |
| Finished Hole Size | 0.010″ | 0.004″ |
| Surface Finishes | HASL, ENIG, Hard Gold, Soft Gold (see all below) | ENEPIG, OSP, EPIG (see all below) |
| Materials | FR-4, High Temp FR-4, Isola, Rogers | PTFE/Duroid, Polyimide, Flex |
| Controlled Impedance | +/- 10% | +/- 5% |
| Annular Ring | 0.006″ | 0.003″ Mechanical, 0.001″ Laser |
| Outer Layers Finished Copper | 1.5 oz to 2 oz | 1 oz to 5 oz |
| Inner Layers Finished Copper | 0.5 oz to 2 oz | 0.3 oz to 4 oz |
| Soldermask Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Silkscreen Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Filled Vias | Non-Conductive Fill | Non-Conductive Fill or Conductive Fill |
| Smallest Mechanical Drill Diameter | 0.010″ | 0.004″ |
| Smallest Laser Drill Diameter | N/A | 0.003″ |
| Blind Vias | No | Yes |
| Buried Vias | No | Yes |
| Aspect Ratio | 10:01 | 15:01 |
| Plated Hole to Copper | 0.008″ | 0.005″ |
| Clearance – Copper to Edge of Board | Outer Layer – 0.010″ | Outer Layer – 0.005″ |
| Inner Layer – 0.015″ | Inner Layer – 0.005″ | |
| Minimum Panel Size | 9″ x 12″ | 8″ x 8″ |
| Maximum Panel Size | 18″ x 24″ | 24″ x 36″ |
| Plated Slots | Routed | Routed or Nibbled |
| Non-Plated Slots | Routed | Routed or Nibbled |
| Plating in Holes | 0.0008″ | 0.0015″ |
| Web (or Mask Width) | 0.006″ | 0.003″ |
| Soldermask Swell | 0.003″ | 0.001″ |
| Silkscreen Width | 0.003″ | 0.003″ |
| Inspection & Testing Criteria | ||
| IPC Class 2 | Yes | Yes |
| IPC Class 3 | No | Yes |
| Netlist Generation and Netlist Compare | Yes | Yes |
| Trace / Space | ||
| Outer Layers (finished copper) | 1 oz. Cu – Min .005″ Trace/Space | 1 oz. Cu – Min .002″ Trace/Space |
| 2 oz. Cu – Min .008″ Trace/Space | 2 oz. Cu – Min .006″ Trace/Space | |
| 3 oz. Cu – Min .012″ Trace/Space | 3 oz. Cu – Min .008″ Trace/Space | |
| 4 oz. Cu – Min .014″ Trace/Space | 4 oz. Cu – Min .012″ Trace/Space | |
| 5 oz. Cu – Min .016″ Trace/Space | ||
| Inner Layers | ||
| 0.3 oz Cu – Min .002″ Trace/Space | 0.5 oz Cu – Min .003″ Trace/Space | |
| 0.5 oz Cu – Min .005″ Trace/Space | 1 oz. Cu – Min .005″ Trace/Space | |
| 1 oz. Cu – Min .006″ Trace/Space | 2 oz. Cu – Min .008″ Trace/Space | |
| 2 oz. Cu – Min .012″ Trace/Space | 3 oz. Cu – Min .0012″ Trace/Space | |
| 4 oz. Cu – Min .016″ Trace/Space | ||
| Drilling | ||
| Min drilled diameter, final board thickness 0.031″ or less | 0.008″ | 0.004″ |
| Min drilled diameter, final board thickness between 0.031″ and 0.062″ | 0.010″ | 0.006″ |
| Min drilled diameter, final board thickness between 0.062″ and 0.093″ | 0.012″ | 0.010″ |
| Min drilled diameter, final board thickness between 0.093″ and 0.125″ | 0.015″ | 0.012″ |
| Min laser diameter, dielectric thickness less than or equal to 0.004″ | N/A | 0.003″ |
| Min laser diameter, dielectric thickness between 0.004″ and 0.005″ | N/A | 0.004″ |
| Min laser diameter, dielectric thickness between 0.005″ and 0.007″ | N/A | 0.005″ |
| Controlled depth blind vias | No | Yes, max 0.75:1 aspect ratio |
| Pre-drilled core blind vias | No | Yes |
| Sub-lamination blind vias | No | Yes |
| Build-up technology | No | Up to 4-N-4, Any layer |
| Buried vias | No | Yes |
| Filled vias | Non-Conductive fill | Non-Conductive or Conductive fill |
| Nibbling | No | Yes |
| Largest hole | 0.247″ plated, 0.250″ non-plated | No maximum |
| Slots | Plated or non-plated, routed | Plated or non-plated, routed or nibbled |
| Plating in holes | 0.0008″ | 0.0015″ |
| Plated hole to copper | 0.008″ | 0.005″ |
| Surface Finish | ||
| Hot Air Solder Level (HASL – Lead) | Yes | Yes |
| Hot Air Solder Level (HASL – Lead-Free) | Yes | Yes |
| Electroless Nickel Immersion Gold (ENIG) | Yes | Yes |
| Immersion Silver | Yes | Yes |
| Hard Gold Fingers with ENIG | Yes | Yes |
| Hard Gold Fingers with HASL | Yes | Yes |
| Yes | Yes | |
| Electrolytic Soft Gold | Yes | Yes |
| Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) | No | Yes |
| Organic Surface Protectant (OSP) | Yes | Yes |
| Bare Copper | Yes | Yes |
| Electroless Palladium Immersion Gold (EPIG) | No | Yes |
| Tin Nickel | No | Yes |
| White Tin | Yes | Yes |
| Carbon Ink | No | Yes |
| Soldermask | ||
| Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Finish/Texture | Semi-gloss, Matte | Semi-gloss, Matte |
| Tented Vias | Yes | Yes |
| Soldermask Plugged Vias | Yes | Yes |
| Soldermask Thickness over Copper | 5 micron to 25 micron | 5 micron to 25 micron |
| Soldermask Web | 5 mil | 3 mil |
| Soldermask Gap to Pad | 4 mil | 2 mil |
| Copper Ring Under Mask-Defined Pad | 3 mil | 1 mil |
| Peelable Soldermask | No | Yes |
| LPI Soldermask | Yes | Yes |
| Dry Film Soldermask | No | Yes |
| Silkscreen | ||
| Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Minimum Legend Width | 3 mil | 3 mil |
| Space between Silkscreen and Pad | 5 mil | 4 mil |
| Controlled Impedance | ||
| Layers | 0-10 Layers | 0-30 Layers |
| Impedance Tolerance | Single-ended +/- 10% | Single-ended +/- 5% |
| Impedance Tolerance | Differential Pairs +/- 10% | Differential Pairs +/- 5% |
| Impedance Tolerance | Coplanar Waveguide +/- 10% | Coplanar Waveguide +/- 5% |
| TDR Testing | Yes, Included | Yes, Included |
| Board Thickness | ||
| 1-Layer or 2-Layer | Min .015″ | Max .200″ | Min .008″ | Max .250″ |
| 4-Layer | Min .020″ | Max .200″ | Min .015″ | Max .250″ |
| 6-Layer | Min .031″ | Max .200″ | Min .025″ | Max .250″ |
| 8-Layer | Min .047″ | Max .200″ | Min .031″ | Max .250″ |
| 10-Layer | Min .062″ | Max .200″ | Min .040″ | Max .250″ |
| 12-Layer | Min .062″ | Max .200″ | Min .047″ | Max .250″ |
| 14-Layer | Min .062″ | Max .200″ | Min .054″ | Max .250″ |
| 16-Layer | Min .062″ | Max .200″ | Min .062″ | Max .250″ |
| CNC / Routing / Score / Mechanical Rules | ||
| Router Bit Size | 0.078″ | Min 0.021″, Max. 0.078″ |
| Spacing for Tab Rout Array | 0.100″ | |
| Standard V- Score Angle | 30° | 20°, 30°, 45°, 60° |
| V-Score Depth | One third of board thickness (min 0.010″) | |
| Jump Score | No | Yes, overshoot up to 0.35″ |
| Scoring Direction | Vertical and Horizontal | Routed Scoring |
| Bevel Angle | 20, 30, 45, or 60 Degree Gold Finger Bevel | Milling/Offset or Recessed Beveling |
| Countersinks | 60, 82, 90, 100 Degree Countersink ** | 60, 82, 90, 100 Degree Countersink ** |
| Counterbores | Yes | Yes |
| Edge Castellations | No | Castellated Edges Min .040″ |
| Plated Edges | No | Yes |
| Cross Section | Level 1 | Level 1, Level 2, Level 3 |
Don't Take Risks When Ordering Your PCBs
Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.
ALLPCB
ALLPCB’s PCB Manufacturing Capabilities
| Technical index | Mass Batch | Small batch | Sample | |||
|---|---|---|---|---|---|---|
| Base Material | FR4 | Normal Tg | Shengyi S1141, KB6160,Huazhen H140（not suitable for lead free process ） | |||
| Middle Tg | For HDI, multi layers： SY S1000H、ITEQIT158、HuazhengH150; TU-662； | |||||
| High Tg | For thick copper、high layer：SY S1000-2; ITEQIT180A; HuazhengH170;ISOLA：FR408R; 370HR； TU-752； | |||||
| Halogen Free | Middle Tg ：SY S1150G、HuazhengH150HF、H160HF；high Tg: SY S1165 | |||||
| High CTI | CTI≥600 SY S1600、Huazheng H1600HF、H1600A； | |||||
| High Frequency | Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000 | |||||
| High Speed | SY S7439；TU-862HF、TU-872SLK；ISOLA:I-Speed、I-Tera@MT40；Huazheng：H175、H180、H380 | |||||
| Flex Material | Base | Glue-free：Dupont AK XingyangW-type, Panosonic RF-775； | ||||
| Coverlay | SY SF305C、Xingyang Q-type | |||||
| Special PP | No flow PP： VT-447LF，Taiguang 370BL Arlon 49N Ceramic filled adhesive sheet: Rogers4450F PTFE adhesive sheet： Arlon6700、Taconic FR-27/FR-28 Double-sided coatingPI： xingyang N-1010TF-mb |
|||||
| Metal Base | Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase | |||||
| Special | High heat resistance rigidity PI： Tenghui VT-901、Arlon 85N，SY S260（Tg250） High thermal conductivity material：92ML Pure ceramic material：alumina ceramic、Aluminum nitride ceramics BT material： Taiwan Nanya NGP-200WT |
|||||
| Layers | FR4 | 24 | 36 | 64 | ||
| Rigid&Flex /（Flex） | 16（12） | 20（12） | 24（16） | |||
| High Frequency Mixed Lamination | 12 | 18 | 24 | |||
| 100% PTFE | 4 | 12 | 18 | |||
| HDI | 2 steps | 3 steps | 4 steps | |||
| Delivery Size (mm) |
Max(mm) | 460*560 | 460*560 | 550*900 | ||
| Min(mm) | 20*20 | 10*10 | 5*10 | |||
| Width / Gap | Inner（mil） | 0.5OZ base copper： 3/3 1.0OZ base copper： 4/4 2.0OZ base copper： 5/6 3.0OZ base copper： 7/9 4.0OZ base copper： 8/12 5.0OZ base copper： 10/15 6.0OZ base copper： 12/18 10 OZ base copper： 18/24 12 OZ base copper： 20/28 |
||||
| Outer（mil） | 1/3OZ base copper： 3/3 0.5OZ base copper： 4/4 1.0OZ base copper： 5/5 2.0OZ base copper： 6/8 3.0OZ base copper： 7/10 4.0OZ base copper： 8/13 5.0OZ base copper： 10/16 6.0OZ base copper： 12/18 10 OZ base copper： 18/24 12 OZ base copper： 20/28 15 OZ base copper： 24/32 |
|||||
| Line Width Tolerance | ＞5.0 mil | ±20% | ±20% | ±1.0mil | ||
| ≤5.0 mil | ±1.0mil | ±1.0mil | ±1.0mil | |||
| Copper Thickness | Inner layer（OZ） | 4 | 6 | 12 | ||
| Out layer（OZ） | 4 | 6 | 15 | |||
| Board thickness（mm） | 0.5-5.0 | 0.4-6.5 | 0.4-11.5 | |||
| Final Board Thickness | ＞1.0 mm | ±10% | ±8% | ±8% | ||
| ≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | |||
| Board thickness/drill bit | 10:1 | 12:1 | 13:1 | |||
| Contour | Bevel edge | 20～60 degree；±5degree | ||||
| Bow and twist | ≤0.75% | ≤0.75% | ≤0.5% | |||
Drill & Hole
| Technical index | Mass Batch | Small batch | Sample | |||
|---|---|---|---|---|---|---|
| Drilling | Min laser （mm） | 0.1 | 0.1 | 0.1 | ||
| Min CNC（mm） | 0.2 | 0.15 | 0.15 | |||
| Max CNC drill bit（mm） | 6.5 | 6.5 | 6.5 | |||
| Min Half Hole(mm) | 0.5 | 0.4 | 0.4 | |||
| PTH Hole (mm) | Normal | ±0.1 | ±0.075 | ±0.075 | ||
| Pressing Hole | ±0.05 | ±0.05 | ±0.05 | |||
| Hole Angle (conical) | Width of upper diameter≤6.5mm：800、900、1000、1100；Width of upper diameter≥6.5mm：900； | |||||
| Precision of Depth-control Drilling（mm） | ±0.10 | ±0.075 | ±0.05 | |||
| Number of blind CNC holes of one side | ≤2 | ≤3 | ≤4 | |||
| Minimum via hole spacing (different network, military, medical, automobile )mm | 0.50 | 0.45 | 0.40 | |||
| Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm | 0.4 | 0.35 | 0.3 | |||
| The minimum hole wall spacing of the over hole (the same network mm) | 0.20 | 0.2 | 0.15 | |||
| Minimum hole wall spacing (mm) for device holes | 0.80 | 0.70 | 0.70 | |||
| The minimum distance from via hole to the inner copper or line | 0.2 | 0.18 | ≤10L: 0.15 >10L: 0.18 |
|||
| The min distance from Device hole to inner copper or line | 0.3 | 0.27 | 0.25 | |||
| Welding Ring (mil) |
Via hole | 4（HDI 3mil） | 3.5（HDI 3mil） | 3 | ||
| Component hole | 8 | 6 | 6 | |||
| Final Board Thickness | ＞1.0 mm | ±10% | ±8% | ±8% | ||
| ≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | |||
| CNC | contour tolerance（mm） | ±0.15 | ±0.10 | ±0.10 | ||
| V-CUT Tolerance of residual thickness(mm) （mm） |
±0.15 | ±0.10 | ±0.10 | |||
| Routing slot（mm） | ±0.15 | ±0.10 | ±0.10 | |||
| Precision of controlled deep milling（mm） | ±0.15 | ±0.10 | ±0.10 | |||
Solder Mask
| Technical index | Mass Batch | Small batch | Sample | |||
|---|---|---|---|---|---|---|
| Solder Dam (mil) | （solder mask） | 5 | 4 | 4 | ||
| （hybrid） | 6 | 5 | 5 | |||
Surface Treatments
| Technical index | Mass Batch | Small batch | Sample | |||
|---|---|---|---|---|---|---|
| Surface Treatments | Immersion gold | Ni thickness (micro inch) |
118-236 | 118-236 | 118-236 | |
| Max gold (uinch) | 3 | 3 | 6 | |||
| Hard gold(Au thick) | Gold finger (uinch) |
15 | 30 | 60 | ||
| NiPdAu | NI (uinch) |
118-236 | ||||
| PA (uinch) |
2-5 | |||||
| Au (uinch) |
1-5 | |||||
| Graph electric gold | NI (uinch) |
120-400 | ||||
| AU (uinch) |
1-3 | |||||
| Immersion tin | Tin (um) |
0.8-1.2 | ||||
| Immersion Ag | Ag (uinch) |
6-10 | ||||
| OSP | thick (um) |
0.2-0.5 | ||||
| HAL/HAL LF | BGApad(mm) | ≥0.3×0.3 | ||||
| thickness （mm） |
0.6≤H≤3.0 | |||||
| Board thickness vs hole diameter | Press hole≤3:1 | |||||
| Tin（um） | 2.0-40.0 | |||||
Rigid & Flex
| Technical index | Mass Batch | Small batch | Sample | |||
|---|---|---|---|---|---|---|
| Rigid & Flex | Maximum dielectric thickness of flex | Glue –free 25um | Glue-free 75um | Glue-free75um | ||
| Flex part width(mm) | ≥10 | ≥5 | ≥2 | |||
| Max delivery size (mm) | 200×400 | 200×500 | 400 ×550 | |||
| distance of via hole to edge of Rigid&flex(mm) | ≥1.2 | ≥1.0 | ≥0.8 | |||
| (mm)distance of components hole to the edge of R&F | ≥1.5 | ≥1.2 | ≥1.0 | |||
| Rigid & Flex | Structure | The outer layer structure of the flex part, the PI reinforcement structure and the separation structure | Aluminum based rigid flex , rigid flex HDI, combination, electromagnetic shielding film | |||
Special Tech
| Technical index | Mass Batch | Small batch | Sample | |||
|---|---|---|---|---|---|---|
| Special Tech | Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination | Buried magnetic core PCB | Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB | |||
Don't Take Risks When Ordering Your PCBs
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JLCPCB
JLCPCB’s PCB Manufacturing Capabilities
| Features | Capability | Notes |
|---|---|---|
| Layer count | 1,2,4,6 layers | The number of copper layers in the board. |
| Controlled Impedance | 4/6 layer, default layer stack-up | Controlled Impedance PCB Layer StackupJLCPCB Impedance Calculator |
| Material | FR-4 | FR-4 Standard Tg 130-140/ Tg 155 |
| Dielectric constant | 4.5(double-side PCB) |
7628 structure 4.6 2313 structure 4.05 2116 structure 4.25 |
| Max. Dimension | 400x500mm | The maximum dimension JLCPCB can accept |
| Dimension Tolerance | ±0.2mm | ±0.2mm for CNC routing, and ±0.4mm for V-scoring |
| Board Thickness | 0.4/0.6/0.8/1.0/1.2/1.6/2.0mm | The thickness of finished board. |
|
Thickness Tolerance ( Thickness≥1.0mm) |
± 10% | e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%) |
|
Thickness Tolerance ( Thickness<1.0mm) |
± 0.1mm | e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1). |
| Finished Outer Layer Copper | 1 oz/2 oz (35um/75um) | Finished copper weight of outer layer is 1oz or 2oz. |
| Finished Inner Layer Copper | 0.5 oz (17um) | Finished copper weight of inner layer is 0.5oz only. |
Drill/Hole Size
| Features | Capability | Notes |
|---|---|---|
| Drill Hole Size (Mechanical) | 0.20mm- 6.30mm | Min. drill size is 0.20mm. Max. drill size is 6.30mm. |
| Drill Hole Size Tolerance | +0.13/-0.08mm | e.g. for the 0.6mm hole size, the finished hole size between 0.52mm to 0.73mm is acceptable. |
| Blind/Buried Vias | Don’t support | Currently we don’t support Blind/Buried Vias, only make through holes. |
| Min. Via hole size | 0.2mm | For Single&Double Layer PCB, the minimum via hole size is 0.3mm;For Multi Layer PCB, the minimum via hole size is 0.2mm |
| Min. Via diameter | 0.45mm | For Single&Double Layer PCB, the minimum Via diameter is 0.6mm;For Multi Layer PCB, the minimum via diameter is 0.45mm. |
| PTH hole Size | 0.20mm – 6.35mm | The annular ring size will be enlarged to 0.15mm in production. |
| Pad Size | 0.70mm- 6.35mm | The pad hole size will be enlarged 0.15mm in production. |
| Min. Non-plated holes | 0.50mm | The minimum NPTH dimension is 0.50mm, Please add the NPTH in the mechanical layer or keep out layer. |
| Min. Plated Slots | 0.65mm | The minimum plated slot width is 0.65mm, which is drawn with a pad. |
| Min. Non-Plated Slots | 1.0mm | The minimum Non-Plated Slot Width is 1.0mm, please draw the slot outline in the mechanical layer(GML or GKO) |
| Min. Castellated Holes | 0.60mm | The minimum diameter of castellated holes is 0.60mm. |
| Hole size Tolerance (Plated) | +0.13mm/-0.08mm | e.g. for the 1.00mm Plated hole, the finished hole size between 0.92mm to 1.13mm is acceptable. |
| Hole size Tolerance (Non-Plated) | ±0.2mm | e.g. for the 1.00mm Non-Plated hole, the finished hole size between 0.80mm to 1.20mm is acceptable. |
| Rectangle Hole/Slot | Don’t support | We don’t make rectangle hole/slot,the rectangle hole/slot will be made as round or oval hole/slot by default. |
Minimum Annular Ring
| Minimum annular ring | PTH | |
|---|---|---|
| 1oz Copper | 0.13mm | 0.3mm |
| 2oz Copper | 0.2mm | 0.3mm |
Minimum clearance
| Features | Capabilities |
|---|---|
| Hole to hole clearance(Different nets) | 0.5mm |
| Via to Via clearance(Same nets) | 0.254mm |
| Pad to Pad clearance(Pad without hole, Different nets) | 0.127mm |
| Pad to Pad clearance(Pad with hole, Different nets) | 0.5mm |
| Via to Track | 0.254mm |
| PTH to Track | 0.33mm |
| NPTH to Track | 0.254mm |
| Pad to Track | 0.2m |
Minimum trace width and spacing
| Copper weight | Min. Trace width | Min. Spacing |
|---|---|---|
| H/HOZ (Inner layer) | 5mil (0.127mm) | 5mil (0.127mm) |
| 1oz (Outer layer) | 1/2 layers: 5mil (0.127mm) 4/6 layers: 3.5mil(0.09mm) |
1/2 layers: 5mil (0.127mm) 4/6 layers: 3.5mil(0.09mm) |
| 2oz (Outer layer) | 8mil (0.2mm) | 8mil (0.2mm) |
BGA
| Layer count | Min. BGA Pad Dimensions | Min. Distance Between BGA |
|---|---|---|
| 1/2 layers | 0.4 mm | 0.127mm |
| 4/6 layers | 0.25 mm | 0.127mm |
Solder Mask
| Features | Capabilities | Notes |
|---|---|---|
| Solder mask opening/ expansion | 0.05mm | The solder mask should have a minimum of a 0.05 mm “growth/mask opening” around the pad to allow for any mis-registration. |
| Solder bridge |
0.2mm(green) 0.254mm(other colors) |
To have solder mask bridge, the spacing between copper pads edge must be 0.2mm (8mils) or more. |
| Solder mask color | green, red, yellow, blue, white, and black. | We use LPI (Liquid Photo Imageable) solder mask. It is the most common type of mask used today. |
| Solder mask dielectric constant | 3.8 | |
| Solder mask thickness | 10-15UM |
Legend
| Features | Capabilities | Notes |
|---|---|---|
| Minimum Line Width | 6 mil (0.153mm) | Characters width less than 6mil(0.153mm) will be unidentifiable. |
| Minimum text height | 32 mil (0.8mm) | Characters height less than 32mil(0.8mm) will be unidentifiable. |
| Character width to height ratio | 1:6 | The preferred ratio of width to height is 1:6. |
| Pad To Silkscreen | 0.15mm | The Minimum Distance Between Pad and Silkscreen is 0.15mm. |
Board Outlines
| Features | Capabilities | Notes |
|---|---|---|
| Trace to Outline | 0.2mm | Ships as individual board(Rounting):Trace to Outline≥0.2mm |
| Trace to V-cut line | 0.4mm | Ship as panel with V-scoring: Trace to V-cut line≥0.4mm |
Panelization
| Features | Capabilities | Notes |
|---|---|---|
| Panelization without space | 0mm | The space between boards is 0mm. |
| Panelization with space | 2mm | Make sure the space between boards should be ≥2mm,otherwise it will be hard to process for rounding. |
| Panelized Round board | ≥20mmx20mm |
The single round board size should be≥20mmx20mm. Panelize with stamp holes and add tooling strips on four board edges |
| Panelized castellated holes board | Panelize with stamp holes and add tooling strips on four board edges |
The distance between castellated hole and board corner should be larger than 4mm. Recommended diameter of stamp hole is 0.5mm-0.8mm; Recommended distance between the two stamp holes is 0.2-0.3mm |
| Min. Width of Breakaway Tab | 4mm | The minimum width of breakaway tab is 4mm. For breakaway with mouse-bites, the minimum width is 5mm. |
| Min. Edge Rails | 4mm | If choosing panel by JLCPCB, we will add 5mm edge rails on both sides by default. |
Don't Take Risks When Ordering Your PCBs
Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.
PCBgogo
PCBgogo’s PCB Manufacturing Capabilities
| No. | Item | Manufacturing Capabilities |
|---|---|---|
| 1 | Material | FR-4 (Fiberglass) |
| 2 | Number of Layers |
1 Layer, 2 Layers, 4 Layers, 6 Layer, 8 Layers, 10 Layers |
| 3 | TG Grade | TG130~140, TG150~160, TG170~180 |
| 4 | Max PCB Size |
1 layer & 2 layers: 1200*300mm or 600*500mm Multi-layers: 600*500mm |
| 5 | Min PCB Size | 5mm*5mm |
| 6 | Board Size Tolerance(Outline) |
±0.2mm(CNC routing) ±0.5mm(V-scoring) |
| 7 | Surface Finish | HASL with lead, HASL lead free, Immersion gold(ENIG), OSP, Hard gold, ENEPIG, Immersion silver (Ag), None |
| 8 | Board Thickness |
1 Layer/2 Layers: 0.2~2.4mm 4 Layers: 0.4~2.4mm 6 Layers: 0.8~2.4mm 8 Layers: 1.0~2.4mm 10 Layers: 1.2~2.4mm
Note: Customized PCB thickness and Layer stackup are acceptable. |
| 9 | Board Thickness Tolerance |
Thickness≥1.0mm: ±10% Thickness<1.0mm: ±0.1mm
Note: Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface. |
| 10 | Outer Layer Copper Thickness |
1oz/2oz/3oz (35μm/70μm/105μm)
Note: 2oz PCB thickness≥1.2mm, Via size≥0.25mm, Min Track/Spacing≥0.15mm
3oz PCB thickness≥2.0mm, Via size≥0.3mm, Min Track/Spacing≥0.2mm |
| 11 | Inner Layer Copper Thickness |
1oz/1.5oz (35μm/50μm) |
| 12 | Outer layer Min track/spacing | ≥3mil |
| 13 | Inner layer Min track/spacing | ≥4mil |
| 14 | Annual ring size | ≥0.13mm |
| 15 | Grid Line track/spacing | ≥0.2mm |
| 16 | Coil board Line track/spacing | ≥0.2mm |
| 17 | BGA pad size | ≥0.2mm |
| 18 | BGA Distance | ≥0.12mm |
| 19 | Board Outlines |
Track to Outline: ≥0.3mm Trace to V-cut line: ≥0.4mm |
| 20 | Finished Hole Size Tolerance | ±0.08mm |
| 21 | Finished Hole Diameter(CNC) |
0.2mm~6.3mm
1. PCB Thickness=2.0mm, Min hole size is 0.3mm 2. PCB Thickness=2.4mm, Min hole size is 0.4mm 3. Copper Thickness=2OZ, Min hole size is 0.25mm 4. Copper Thickness=3OZ, Min hole size is 0.3mm |
| 22 | TH Via Distance |
Equipotential: 0.15mm Isoelectric: 0.25mm |
| 23 | Plated Slot Size |
≥0.5mm
Note: L:W=2.5: 1 (Should be 2.5:1 or higher. If it is less than this, the holes may be misaligned.) If you can’t draw a long hole in your design, you can draw a continuous round hole and it will be regarded as a long hole. Also, it is okay to draw the oblong hole in Profile Layer instead of Drilling Layer. |
| 24 | Castellated Holes | ≥0.6mm |
| 25 | Non-Plated Holes | ≥0.8mm |
| 26 | NPTH to Copper Line | ≥0.2mm |
| 27 | Soldermask | Green, Red, Yellow, White, Black, Blue, Purple, Matte Green,Matte Black,None |
| 28 | Soldermask Thickness | 20~30um |
| 29 | Soldermask Bridge |
Green: ≥0.1mm Others: ≥0.15mm |
| 30 | Soldermask to soldering pad distance | ≥0.05mm |
| 31 | Silkscreen | White, Black, Yellow, None |
| 32 | Minimum Character Width(Legend) |
≥0.15mm
Note: Characters of less than 0.15mm wide will be too narrow to be identifiable. |
| 33 | Minimum Character Height (Legend) |
≥0.75mm
Note: Characters of less than 0.8mm high will be too small to be recognizable. |
| 34 | Character Width to Height Ratio (Legend) | 1: 5 (In PCB silkscreen legends processing, 1:5 is the most suitable ratio) |
| 35 | Silkscreen to Soldermask Distance | ≥0.1mm |
| 36 | V-cut Line |
≥75mm
Note: PCB thickness≥0.6mm Details refer to right side picture |
| 37 | V-cut Line Distance | ≥3.5mm |
| 38 | Distance betwen Board to Board | ≥0.8mm |
| 39 | Stamp-hole Width |
≥2.0mm
Note: PCB size and thickness are subject to review by PCBGOGO. |
| 40 | Tab-route Width |
≥1.6mm
Note: PCB size and thickness are subject to review by PCBGOGO. |
| 41 | Edge Rail |
≥3.5mm
Note: If choosing panel by PCBGOGO, we will add 5mm edge rails on both sides by default. |
| 42 | Gold Finger |
Bevelling Angle: 30～45° Depth: ≥1mm Length: 45mm～280mm
Note: Board thickness≥1.2mm |
| 43 | Special Specification |
Impedance control Custom Layer Stackup Interstitial Via Hole(IVH) Via in pad Via filled with resin Countersinks/Counterbores Carbon Mask Halogen-Free Z-axis milling Edge Plating Others |
Don't Take Risks When Ordering Your PCBs
Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.
PCBWay
PCBgogo’s PCB Manufacturing Capabilities
| Items | Spec. | |
|---|---|---|
| Number of Layers | General PCB board | 2-40 |
| Buried IC | yes | |
| HDI（buried and blind vias) | HDI(5+N+5) staggered and stacked vias |
|
| Materials | FR4(shengyi) | yes |
| High Tg | Tg-220 | |
| EHalongen Free | yes | |
| High Frequency | yes | |
| Maximum board size | 20*35inch(508*889mm) | |
| Board thickness | 0.21-6.0mm | |
| Minimum track line | 2mil-inner 2mil-outer | |
| Minimum Spacing line | 2mil-inner 2mil-outer | |
| Outer layer copper thickness | 7oz | |
| Inner layer copper thickness | 7oz | |
| Min. finished hole size(Mechanical) | 0.15mm | yes |
| Min. finished hole size(laser hole) | 0.076mm | yes |
| Aspect ratio | 12:1 | |
| Solder Mask Types and brand | NAYA(LP_4G) | yes |
| Tamura(TT19G) | yes | |
| TAIYO(PSR2200) | yes | |
| Solder Mask Color | green;blue;red;white;black | yes |
| Impedance Control Tolerance | ±10%,50Ω and below:±5Ω | yes |
| Plug via hole | Min.size can be plugged: | 0.1mm |
| Max.size can be plugged: | 0.7mm | |
| Min. annular ring can be kept | 3mil | |
| Min. distance between the IC pads can keep SM bridge |
8mil | |
| Min. SM bridge for green soldermask | 3mil | |
| Min. SM bridge for black soldermask | 4mil | |
| Surface Treatment | HASL | yes |
| ENIG | yes | |
| OSP | yes | |
| LEAD FREE HASL | yes | |
| GOLD PLATING | yes | |
| IMMERSION Ag | yes | |
| IMMERSION Sn | yes | |
| V-Cut | CNC V-cut, degree | 20304560 |
| V-cut by hand, degree | 20304560 | |
| Outline Profile | CNC | |
| Chamfer | The angle typeof the chamfer: | 203045 |
| Min. distance of jumping chamfer: | 5mm | |
| Tolerance of the dimension size | ±0.1mm | |
| Tolerance of the board thickness | 0.21-1.0 | ±0.1 |
| 1.0-2.5 | ±7% | |
| 2.5-6.3 | ±6% | |
| Tolerance of the finished hole size | 0-0.3mm | ±0.08mm |
| 0.31-0.8mm | ±0.08mm | |
| 0.81-1.60mm | ±0.05mm | |
| 1.61-2.49mm | ±0.75mm | |
| 2.5-6.0mm | +0.15/-1mm | |
| >6.0mm | +0.3/-1mm | |
| Certificates(copies are needed) | UL | yes |
| ISO9001 | yes | |
| ISO14000 | yes | |
| ROHS | yes | |
| TS16949 | yes | |
TechnoTronix’s PCB Manufacturing Capabilities
| Capability | Standard |
|---|---|
| Layer Count | Multilayer PCB up to 24 & 32 Layers |
| Type | Multilayer Rigid PCB Multilayer Flex PCB Multilayer Rigid-Flex PCB |
| Alternative Finish | Hot Air Solder Level (HASL) Electroless Nickel / Immersion Gold (ENIG) Silver Electroless Tin Lead Tin Nickle Organic (OSP) Hard Gold (edge contact) Carbon Peelable Custom Specified Finishes are also available! |
| Testing protocols include |
Flying Probe test
|
Rigid flex boards with the following specifications:
| Capability | Standard |
|---|---|
| Types of Rigid Flex PCB | Single Sided Rigid Flex Boards Double Sided Rigid Flex PCBs Multilayer Rigid Flex circuit boards |
| Layer Count | 2 – 24 multilayerss |
| Materials | Polyimide FR4 |
| Copper Thickness | 9 µm 12 µm 18 µm 35 µm |
| Min. Line / Spacing | 125 µm / 125 µm |
| Smallest Drill | 0.28 mm |
| Surfaces | Immersion Ni/Au OSP Plated Ni/Au Immersion Tin |
| Stiffener Material | FR4 Steel Aluminum |
| Min. Annular Ring | 150 µm |
| Min. Solder mask Dam | 100 µm |
| Drill to copper – Outer layers | 8 mil |
| Drill to copper – Inner layers | 10 mil |
| Minimum Pitch | 0.5 mm |
| Copper Thickness | 0.5 oz. – 4 oz. |
| Copper to Board Edge | 0.007″ |
| Minimum Hole Size | 0.004″ |
| Coverlay Opening | 0.003″ |
San Francisco Circuit’s PCB Manufacturing Capabilities
| Specifications | Standard Technology | Advanced Technology |
|---|---|---|
| Number of Layers |
1 – 12 |
14 – 40 |
| Quick Turn Times |
up to 24 hours for bare board fabrication or assembly (1-6 layers) |
|
|
Board Material |
Rigid PCB Materials FR4 FR406 370HR VT-47 FR408 Arlon CEM Megtron 6 Astra MT77 Tachyon 100G Nelco 4000 Taconic TLY Polyimide
MCPCB, Aluminum Core & Copper Core Materials Aluminum Core Copper Core Ventec VT-4A1/VT-4A2 Aismalibar Fastherm Aismalibar Flextherm
Flex PCB Materials Kapton Shin-Etsu – Epoxy Rogers – Epoxy Dupont FR – FR Acrylic Dupont LF – LF Acrylic Adhesiveless Base Materials |
Aluminum Core Ventec VT-4A1/VT-4A2 Aismalibar Fastherm Aismalibar Flextherm Copper Core Nelco 4000 Rogers 3000 Taconic TLY Polyimide |
| Minimum Board Thickness |
2 layer – 0.010″ 4 layer – 0.020″ 6 layer – 0.020″ 8 layer – 0.062″ 10 layer – 0.062″ 12 layer – 0.062″ |
2 layer – 0.005″ 4 layer – 0.010″ 6 layer – 0.031″ 8 layer – 0.040″ |
| Maximum Board Thickness |
2 layer – 0.125″ 3-12 layer – 0.200″ |
0.250″ – 0.500″ |
| Maximum Board Size |
16″ x 22″ 12″ x 21″
|
10″ x 16″ 16″ x 22″ 12″ x 21″
|
| Copper Thickness |
0.5 oz – 3 oz |
4 oz – 10 oz |
| Hole Aspect Ratio |
7 : 1 |
15 : 1 |
| Minimum Hole Size |
0.008″ |
0.004″ |
| Minimum Trace/Space |
0.006″/0.006″ |
0.002″/0.002″ |
| Minimum Drill-to-Copper |
0.010″ |
0.005″ |
| Minimum Pitch |
1 mm |
0.3 mm |
| Final Finish |
HASL (Solder) Lead Free Solder Copper Gold Gold Fingers White Tin ENEPIG ENIG |
HASL Gold (ENIG/Hard/Soft) Selective Gold Immersion Silver OSP White Tin ENEPIG |
| Solder Mask |
LPI: Green Black Red Blue Yellow White Clear |
LPI: Green Black Red Blue Yellow White Clear Mix-and-match Wet Mask Dry Film |
| Coverlay |
FR Coverlay LF Coverlay Shin-Etsu Flexible Soldermask |
|
| Silk Screen |
White Black Yellow |
White Black Yellow Green Red Blue |
| PCB Fabrication |
Scoring Route & Retain |
Jump Scoring Route & Retain Milling |
| Additional Features |
Plated Slots Non-plated Slots Controlled Dielectric Covered Vias Counter Sinks Counter Bores Dual Access Flex Suspended Leads |
Plated Edges Plated Milling Plated Counter Bores & Counter Sinks Edge Castellation Controlled Impedance Silver Filled Vias Non-Conductive Filled Vias
|
| Quality Standards |
IPC 6012 Class 2 Electrical Testing 100% Netlist Testing TDR Testing |
Milspec 31032 Milspec 55110 Milspec 50884 IPC 6012 Class 3 100% Netlist Testing TDR Testing |
| Special Technology |
|
Blind & Buried Vias Laser Drilled Vias Mechanically Drilled Micro Vias |
Don't Take Risks When Ordering Your PCBs
Camptech takes the risk out of ordering PCBs. Big on capabilities. Small in price. Exceptional quality.