Finding a reputable and capable manufacturer for your printed circuit boards could be a time consuming and risky process. An internet search provides you with hundreds of results, listing companies in North America and China.
So, how do you choose? The primary selection factor for many people is the cost. Any company which offers the lowest cost wins their business. Quality, technical expertise, and after-sales support are often overlooked or ignored when buying cheap PCBs is the driving factor. This might be okay for very simple PCB designs. For PCBs with increasing design complexity and the demand for superior quality introduces qualitative search criteria.
To assist you with your search, we have assembled this list of PCB manufacturers displaying an overview of their capabilities and services.
1. Camptech Circuits
With over 40 years of experience, Camptech II Circuits Inc. offers PCB Fabrication and PCB Assembly services. At our 25,000 sq. foot facility, we support all build quantities, from prototypes to small to medium, and high volume production. Generally, our lead time is about 2 weeks, and expedited delivery is available. We work hard every day with a dedication to delivering the highest quality product with an emphasis on providing exceptional value and customer experience. Our products are used in high-tech applications including communications, computer application, industrial control, satellite broadcast, and auto industries. Our team of highly trained and skilled staff is committed and determined to Deliver Above Your Expectations.
Capabilities
Delivery
- 4 to 10 days for prototypes
- 5 days to 4 weeks for production
Legend (Silkscreen)
- White
- Black
- Yellow
- Custom Colors
Min. Line Width
- 3 mil
Min. SMT Pitch
- 5 mil
Minimum Laser Hole
- 2 mil
NC Scored Dimension
- +/- 10 mil
Outer Copper Thickness (finished)
- 1 oz. to 20 oz.
Blind/Buried Vias
- Yes
Aspect Ratio
- 12:01
Electrical Test
- Flying Probe
- Test Fixture
Surface Finish
- HASL
- Lead-Free HASL
- ENIG
- ENEPIG
- Immersion Silver
- Immersion Tin
- OSP
- Hard Gold
Number of Layers
- 1 to 30 Layers Rigid PCBs
- 1 to 10 Layer Flexible PCBs
Board Types
- Rigid
- Flex
- Rigid-Flex
- Metal Core
- Hybrid
Min. Spacing
- 3 mil
Min. Mechanical Hole Size
- 6 mil
NC Routed Dimension
- +/- 5 mil
Hole to Hole Location
- +/- 1 mil
Stack Micro-Vias
- Yes
Via in Pad
- Yes
Plugged Vias
- Solder mask
- Non-Conductive Epoxy
Solder Mask Colors
- Green
- Red
- Blue
- Black
- White
- Yellow
- Custom colors
- Peelable Mask
Other Services
- Panelization
- Profiling
- Routing
- V-Scoring
- Edge-Plating
- Control Depth Holes
- Countersink Holes
- Castellation Holes
2. Advanced Circuits
This company is MIL-PRF-31032, MIL-PRF-55110G, AS9100C, ISO 9001:2008 Certified, IPC 6012 Class 2, 3 and 3A Qualified, and ITAR Registered. They operate divisions in Aurora, CO, Tempe, AZ, and Maple Grove, MN.
Advanced Circuits offers printed circuit board manufacturing with two options: Standard & Custom Spec. Choosing between the two options will depend on your PCB design requirements and specifications.
Here are some highlights of their service:
- Lead Time: Same Day – 4 Weeks
- Layer Count: 0 – 40 Layers
- Cu Weight: Up to 20 oz.
- Trace/Space: Down to .0025”
- Via-In-Pad
- Blind & Buried Vias
- Laser Direct Imaging
- Oversized Boards
- Stacked Microvias
- Down To .3mm Pitch
- Cavity Boards
- Buried Chip Resistors
- Laser-Drilled Microvias
Capabilities
| Specification | Standard | Custom |
| Layer Count | 0 – 10 Layers | 0 – 40 Layers |
| Turn Time | Same Day – 5 Day | Same Day – 4 Weeks |
| Quantity Req. | 1 – 10000+ | 1 – 10000+ |
| Materials | FR-4 | FR-4/Rogers/Polyimide/Aluminum Clad/High-Temp. FR4 & others |
| Plating Finish | Lead-Free HAL* | Electrolytic Hard Gold/Soft Gold/ENIG/Nickel/Immersion Silver |
| OSP/Leaded & Lead-Free HAL | ||
| Cert. / Qualifications | IPC Class 2 – A600 | IPC6012 Class 2-3A / IPC6018 Class 3 MIL-PRF-31032 / MIL-PRF-55110 / ISO |
| 9001:2008 / AS9100C | ||
| Board Thickness | .031″ / .062″ / .093″ / .125″ | Full Range Available |
| Copper Weight | 1 oz. Inner / Up to 2 oz. Outer | 0.5 – 4 oz. Inner / 1 – 20 oz. Outer |
| Trace/Space | 5 / 5 Mils | Down to 2.75 / 3 Mils |
| Solder Mask (LPI) | Green | Various Color Options |
| Legend | White | Various Color Options |
| Min. Hole Size | 0.010″ | 0.004″ |
| Hole Tolerance | +/- 0.005″ | +/- 0.003″ (Upon Request) |
| Route Tolerance | +/- 0.010″ | +/- 0.005″ (Upon Request) |
| Slots/Cutouts/Edges | Non-Plated Only | Plated / Non-Plated |
| Plated Holes | Plated / Non-Plated | Plated / Non-Plated |
| UL Markings/Dates | Yes** | Yes** |
| Lead-Free Markings | Yes | Yes |
| Gold Fingers | Yes | Yes |
| Fiducials | Yes | Yes |
| Scoring | Yes | Yes |
| ITAR | Yes | Yes |
| Castellated Holes | X | Yes |
| Controlled Dielectric | X | Yes |
| Controlled Impedance | X | Yes |
| Counter Sinks | X | Yes |
| Counter Bores | X | Yes |
| Blind/Buried Vias | X | Yes |
| Microvias | X | Yes |
| Mask Plugged Vias | X | Yes |
| Via-in-Pad | X | Yes |
| Etch Back | X | Yes |
| Tetra Etch | X | Yes |
| Cover Coat | X | Yes |
| Cavity Process | X | Yes |
| Laser Rout | X | Yes |
| LPI Legend | X | Yes |
| Edge Mill | X | Yes |
| Unique Serialization | X | Yes |
| Back Drilling | X | Yes |
| Controlled Depth Drill | X | Yes |
3. Sunstone Circuits
Based in Mulino, Oregan, Sunstone Circuits offers PCB fabrication services.
Here is the list of their manufacturing capabilities:
Capabilities
| Drill Capabilities | |
| Smallest Drill Size | 0.005″ |
| Largest Drill Size | 0.250″ +/- 0.002″ |
| *Note: Holes > 0.250″ are considered cutouts | |
| Positional Tolerance | |
| Control Depth Tolerance | +/- 0.0005″ |
| Microvia | Yes |
| Blind / Buried Via | Yes |
| Min. Pad Size (via) | via + 0.006″ |
| Min. Pad Size (component) | hole + 0.010″ |
| Route Capabilities | |
| Board Size Tolerances (Rout) | +/- 0.003″ |
| Board Size Tolerance (Laser) | +/- 0.001″ |
| V-Score Web Thickness | +/- 0.002″ |
| V-Score Line Width | +/- 0.002″ |
| Etch Tolerances | |
| Trace width (of design) | +/- 0.0005″ |
| Minimum Trace Width | 0.002″ |
| Surface Finish | |
| Tin / Lead Solder (HASL) | Yes |
| Immersion Silver | Yes* |
| ENIG | Yes* |
| Copper Only | Yes* |
| OSP | Yes* |
| ENIPIG | Yes* |
| Full Body Hard Gold | Yes* |
| Soft Bondable Gold | Yes* |
| Lead Free Solder | Yes* |
| *Denotes RoHS Compliant Finish | |
| Board Parameters | |
| Layer Count | 0 – 36 |
| Board Thickness | 0.003″ – 0.187 |
| Copper Weight (finished) | 0.25 oz – 6 oz |
| Materials | |
| FR-4 150 Tg (RoHS Compliant) | Yes |
| FR-4 170 Tg (RoHS Compliant) | Yes |
| Rogers RO 3000(R) Series | No |
| Rogers RO 4000(R) Series | Yes |
| Rogers RT/duroid(R) Series (5000 and 6000 Series) | Yes |
| Arlon | Yes |
| Polyflon | Yes |
| Taconic | Yes |
| Certifications | |
| UL Listed | |
| ITAR Registered | |
| Other Sunstone Capabilities | |
| Controlled Impedance | |
| Full Service CAM Tooling |
4. Bay Area Circuits
The company has been serving the advanced PCB manufacturing needs of design engineering firms in the commercial, industrial, and medical industries, contract assemblers, and original equipment manufacturers for over 40 years.
| Standard Capability | Advanced Capability | |
| Overview | ||
| Minimum Layer Count | 1 | 1 |
| Maximum Layer Count | 16 | 30 |
| Trace/Space | 0.006″ | 0.002″ |
| Finished Hole Size | 0.010″ | 0.004″ |
| Surface Finishes | HASL, ENIG, Hard Gold, Soft Gold (see all below) | ENEPIG, OSP, EPIG (see all below) |
| Materials | FR-4, High Temp FR-4, Isola, Rogers | PTFE/Duroid, Polyimide, Flex |
| Controlled Impedance | +/- 10% | +/- 5% |
| Annular Ring | 0.006″ | 0.003″ Mechanical, 0.001″ Laser |
| Outer Layers Finished Copper | 1.5 oz to 2 oz | 1 oz to 5 oz |
| Inner Layers Finished Copper | 0.5 oz to 2 oz | 0.3 oz to 4 oz |
| Soldermask Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Silkscreen Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Filled Vias | Non-Conductive Fill | Non-Conductive Fill or Conductive Fill |
| Smallest Mechanical Drill Diameter | 0.010″ | 0.004″ |
| Smallest Laser Drill Diameter | N/A | 0.003″ |
| Blind Vias | No | Yes |
| Buried Vias | No | Yes |
| Aspect Ratio | 10:01 | 15:01 |
| Plated Hole to Copper | 0.008″ | 0.005″ |
| Clearance – Copper to Edge of Board | Outer Layer – 0.010″ | Outer Layer – 0.005″ |
| Inner Layer – 0.015″ | Inner Layer – 0.005″ | |
| Minimum Panel Size | 9″ x 12″ | 8″ x 8″ |
| Maximum Panel Size | 18″ x 24″ | 24″ x 36″ |
| Plated Slots | Routed | Routed or Nibbled |
| Non-Plated Slots | Routed | Routed or Nibbled |
| Plating in Holes | 0.0008″ | 0.0015″ |
| Web (or Mask Width) | 0.006″ | 0.003″ |
| Soldermask Swell | 0.003″ | 0.001″ |
| Silkscreen Width | 0.003″ | 0.003″ |
| Inspection & Testing Criteria | ||
| IPC Class 2 | Yes | Yes |
| IPC Class 3 | No | Yes |
| Netlist Generation and Netlist Compare | Yes | Yes |
| Trace / Space | ||
| Outer Layers (finished copper) | 1 oz. Cu – Min .005″ Trace/Space | 1 oz. Cu – Min .002″ Trace/Space |
| 2 oz. Cu – Min .008″ Trace/Space | 2 oz. Cu – Min .006″ Trace/Space | |
| 3 oz. Cu – Min .012″ Trace/Space | 3 oz. Cu – Min .008″ Trace/Space | |
| 4 oz. Cu – Min .014″ Trace/Space | 4 oz. Cu – Min .012″ Trace/Space | |
| 5 oz. Cu – Min .016″ Trace/Space | ||
| Inner Layers | ||
| 0.3 oz Cu – Min .002″ Trace/Space | 0.5 oz Cu – Min .003″ Trace/Space | |
| 0.5 oz Cu – Min .005″ Trace/Space | 1 oz. Cu – Min .005″ Trace/Space | |
| 1 oz. Cu – Min .006″ Trace/Space | 2 oz. Cu – Min .008″ Trace/Space | |
| 2 oz. Cu – Min .012″ Trace/Space | 3 oz. Cu – Min .0012″ Trace/Space | |
| 4 oz. Cu – Min .016″ Trace/Space | ||
| Drilling | ||
| Min drilled diameter, final board thickness 0.031″ or less | 0.008″ | 0.004″ |
| Min drilled diameter, final board thickness between 0.031″ and 0.062″ | 0.010″ | 0.006″ |
| Min drilled diameter, final board thickness between 0.062″ and 0.093″ | 0.012″ | 0.010″ |
| Min drilled diameter, final board thickness between 0.093″ and 0.125″ | 0.015″ | 0.012″ |
| Min laser diameter, dielectric thickness less than or equal to 0.004″ | N/A | 0.003″ |
| Min laser diameter, dielectric thickness between 0.004″ and 0.005″ | N/A | 0.004″ |
| Min laser diameter, dielectric thickness between 0.005″ and 0.007″ | N/A | 0.005″ |
| Controlled depth blind vias | No | Yes, max 0.75:1 aspect ratio |
| Pre-drilled core blind vias | No | Yes |
| Sublamination blind vias | No | Yes |
| Build-up technology | No | Up to 4-N-4, Any layer |
| Buried vias | No | Yes |
| Filled vias | Non-Conductive fill | Non-Conductive or Conductive fill |
| Nibbling | No | Yes |
| Largest hole | 0.247″ plated, 0.250″ non-plated | No maximum |
| Slots | Plated or non-plated, routed | Plated or non-plated, routed or nibbled |
| Plating in holes | 0.0008″ | 0.0015″ |
| Plated hole to copper | 0.008″ | 0.005″ |
| Surface Finish | ||
| Hot Air Solder Level (HASL – Lead) | Yes | Yes |
| Hot Air Solder Level (HASL – Lead-Free) | Yes | Yes |
| Electroless Nickel Immersion Gold (ENIG) | Yes | Yes |
| Immersion Silver | Yes | Yes |
| Hard Gold Fingers with ENIG | Yes | Yes |
| Hard Gold Fingers with HASL | Yes | Yes |
| Yes | Yes | |
| Electrolytic Soft Gold | Yes | Yes |
| Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) | No | Yes |
| Organic Surface Protectant (OSP) | Yes | Yes |
| Bare Copper | Yes | Yes |
| Electroless Palladium Immersion Gold (EPIG) | No | Yes |
| Tin Nickel | No | Yes |
| White Tin | Yes | Yes |
| Carbon Ink | No | Yes |
| Soldermask | ||
| Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Finish/Texture | Semi-gloss, Matte | Semi-gloss, Matte |
| Tented Vias | Yes | Yes |
| Soldermask Plugged Vias | Yes | Yes |
| Soldermask Thickness over Copper | 5 micron to 25 micron | 5 micron to 25 micron |
| Soldermask Web | 5 mil | 3 mil |
| Soldermask Gap to Pad | 4 mil | 2 mil |
| Copper Ring Under Mask-Defined Pad | 3 mil | 1 mil |
| Peelable Soldermask | No | Yes |
| LPI Soldermask | Yes | Yes |
| Dry Film Soldermask | No | Yes |
| Silkscreen | ||
| Colors | Green, Black, Blue, Red, White, Clear, Custom | Yellow, Custom |
| Minimum Legend Width | 3 mil | 3 mil |
| Space between Silkscreen and Pad | 5 mil | 4 mil |
| Controlled Impedance | ||
| Layers | 0-10 Layers | 0-30 Layers |
| Impedance Tolerance | Single-ended +/- 10% | Single-ended +/- 5% |
| Impedance Tolerance | Differential Pairs +/- 10% | Differential Pairs +/- 5% |
| Impedance Tolerance | Coplanar Waveguide +/- 10% | Coplanar Waveguide +/- 5% |
| TDR Testing | Yes, Included | Yes, Included |
| Board Thickness | ||
| 1-Layer or 2-Layer | Min .015″ | Max .200″ | Min .008″ | Max .250″ |
| 4-Layer | Min .020″ | Max .200″ | Min .015″ | Max .250″ |
| 6-Layer | Min .031″ | Max .200″ | Min .025″ | Max .250″ |
| 8-Layer | Min .047″ | Max .200″ | Min .031″ | Max .250″ |
| 10-Layer | Min .062″ | Max .200″ | Min .040″ | Max .250″ |
| 12-Layer | Min .062″ | Max .200″ | Min .047″ | Max .250″ |
| 14-Layer | Min .062″ | Max .200″ | Min .054″ | Max .250″ |
| 16-Layer | Min .062″ | Max .200″ | Min .062″ | Max .250″ |
| CNC / Routing / Score / Mechanical Rules | ||
| Router Bit Size | 0.078″ | Min 0.021″, Max. 0.078″ |
| Spacing for Tab Rout Array | 0.100″ | |
| Standard V- Score Angle | 30° | 20°, 30°, 45°, 60° |
| V-Score Depth | One third of board thickness (min 0.010″) | |
| Jump Score | No | Yes, overshoot up to 0.35″ |
| Scoring Direction | Vertical and Horizontal | Routed Scoring |
| Bevel Angle | 20, 30, 45, or 60 Degree Gold Finger Bevel | Milling/Offset or Recessed Beveling |
| Countersinks | 60, 82, 90, 100 Degree Countersink ** | 60, 82, 90, 100 Degree Countersink ** |
| Counterbores | Yes | Yes |
| Edge Castellations | No | Castellated Edges Min .040″ |
| Plated Edges | No | Yes |
| Cross Section | Level 1 | Level 1, Level 2, Level 3 |
5. Sierra Circuits
Specializing in quick turn PCBs and medium production runs, Sierra’s primary focus is delivering the highest quality product in the shortest amount of time. What makes this possible is that Sierra is the actual manufacturer and assembler of PCBs.
PCB Attributes
| PRODUCT FEATURES | STANDARD | ADVANCED | MICRO |
| Min Layer Count | 1 | 1 | 1 |
| Max Layer Count | 30 | 30 | 30 |
| Min Board Thickness | .010” | .005” | .005″ |
| Max Board Thickness | .250” | .250” | .250″ |
| Min Core Thickness | .004” | .002” | .002″ |
| Min Dielectric | .004” | .003” | .002″ |
| Min Starting Copper Foil Weight | 9 microns | 9 microns | 5 micron |
| Max Finished Copper Thickness (O/L) | 4 oz | 6 oz | 1 oz |
| Max Finished Copper Thickness (I/L) | 4 oz | 4 oz | 0.5 oz |
| Min Panel Size | 12” x 18” | 12” x 18” | 12″ x 18″ |
| Max Panel Size | 18” x 24” | 21” x 29” | 12″ x 18″ |
| Smallest Mechanical Drill Diameter | .0059” | .0059” | .0059″ |
| Smallest Laser Drill Diameter | .005″ | .004″ | .004″ |
| Min Finished Hole Size | .004” | .002” | .002″ |
| Max Through Hole Aspect Ratio (depending on board thickness and finish hole) | 10:1 | 10:1 | > 10:1 |
| Max Laser Via Aspect Ratio | .75:1 | .75:1 | .75:1 |
| Blind Via Finished Hole Size | .004” | Plated Shut | Plated shut |
| Buried Via Finished Hole Size | .004” | .002” | .002″ |
| Min Trace and Space | .004” | .003” | 0.002″ |
| Min Pad Size for Test | .005” | .005” | .005″ |
| Process Pad Diameter | D + .012” (1-mil Annular Ring) | D + .008” (Tangency) | D + .008” (Tangency) |
| Stacked Vias | Yes | Yes | Yes |
| Min Wire Bond Pad Size | > .006” | .004” | 0.004″ |
| Controlled Impedance Tolerance | 10% | 5% | 5% |
| Solder Mask Registration | .002” | .001” | .001″ |
| Solder Mask Feature Tolerance | .0015” | .001” | .001” |
| Solder Mask Min Dam Size (based on green soldermask color) | .005” | .004” | .004″ |
| Min Diameter Route Cutter Available | .024” | .021” | .021″ |
| Routed Part Size Tolerance | .005” | .003” | 0.003″ |
| Laser Hole Location Tolerance | .0005” | .0005” | .0005″ |
| Laser Routed Part Size Tolerance ( can only be done with panels < .032” thick) | .002” | .002” | .001″ |
| Bow and Twist Tolerance | Per IPC Spec | Per IPC Spec | Per IPC Spec |
| Thickness Tolerance (based on board thickness) | 10% | 5% | 5% |
| Sequential Laminations | 3 or less Lamination Cycles | 4 Lamination Cycles | 5 Lamination cycles |
| Buried Vias | Yes | Yes | Yes |
| Blind Vias | Yes | Yes | Yes |
| Conductive Filled Vias | Yes | Yes | Yes – Cu plate shut |
| Non Conductive Filled Vias | Yes | Yes | Yes |
Surface finishes
| PRODUCT FEATURES | STANDARD | ADVANCED | MICRO |
| HASL (Vertical or Horizontal) | Yes | Yes | No |
| Lead Free HASL | Yes | Yes | No |
| OSP (Shikoku F2) | Yes | Yes | Yes |
| OSP (Entek) | Yes | Yes | Yes |
| ENIG (Electroless Nickel/Immersion Gold) | Yes | Yes | Yes |
| Immersion Silver | Yes | Yes | No |
| Electrolytic Soft Gold | Yes | Yes | Yes |
| Electrolytic Hard Gold | Yes | Yes | Yes |
| Selective Gold |
PCB Fabrication
| PRODUCT FEATURES | STANDARD | ADVANCED | MICRO |
| Routed Array | Yes | Yes | Yes |
| V Score, Edge to Copper | .01” | .007” | .007″ |
| V Score Angles | 35°, 45°, 60° | 35°, 45°, 60° | 35°, 45°, 60° |
| Countersink | Yes | Yes | Yes |
| Counterbore | Yes | Yes | Yes |
| Bevel | Yes | Yes | Yes |
| Milling | +/- .003” | +/- .002” | +/- .001” |
| Edge Castellation | Yes | Yes | Yes |
| Edge Plating | Yes | Yes | Yes |
| Heatsinks | No | Yes | No |