Finding a reputable and capable manufacturer for your printed circuit boards could be a time consuming and risky process. An internet search provides you with hundreds of results, listing companies in North America and China.

So, how do you choose? The primary selection factor for many people is the cost. Any company which offers the lowest cost wins their business. Quality, technical expertise, and after-sales support are often overlooked or ignored when buying cheap PCBs is the driving factor. This might be okay for very simple PCB designs. For PCBs with increasing design complexity and the demand for superior quality introduces qualitative search criteria.

To assist you with your search, we have assembled this list of PCB manufacturers displaying an overview of their capabilities and services.

Printed circuit board material selection guide

1. Camptech Circuits

Camptech-PCB Fabrication Guarantee

With over 40 years of experience, Camptech II Circuits Inc. offers PCB Fabrication and PCB Assembly services. At our 25,000 sq. foot facility, we support all build quantities, from prototypes to small to medium, and high volume production. Generally, our lead time is about 2 weeks, and expedited delivery is available. We work hard every day with a dedication to delivering the highest quality product with an emphasis on providing exceptional value and customer experience. Our products are used in high-tech applications including communications, computer application, industrial control, satellite broadcast, and auto industries. Our team of highly trained and skilled staff is committed and determined to Deliver Above Your Expectations.




  • 4 to 10 days for prototypes
  • 5 days to 4 weeks for production

Legend (Silkscreen)

  • White
  • Black
  • Yellow
  • Custom Colors

Min. Line Width

  • 3 mil

Min. SMT Pitch

  • 5 mil

Minimum Laser Hole

  • 2 mil

NC Scored Dimension

  • +/- 10 mil

Outer Copper Thickness (finished)

  • 1 oz. to 20 oz.

Blind/Buried Vias

  • Yes

Aspect Ratio

  • 12:01

Electrical Test

  • Flying Probe
  • Test Fixture


  • FR4
  • High TG FR4
  • Rogers
  • Arlon
  • Aluminum Base
  • Polyimide
  • Ceramic
  • Taconic
  • Megtron, etc.

Surface Finish

  • HASL
  • Lead-Free HASL
  • ENIG
  • Immersion Silver
  • Immersion Tin
  • OSP
  • Hard Gold

Number of Layers

  • 1 to 30 Layers Rigid PCBs
  • 1 to 10 Layer Flexible PCBs

Board Types

  • Rigid
  • Flex
  • Rigid-Flex
  • Metal Core
  • Hybrid

Min. Spacing

  • 3 mil

Min. Mechanical Hole Size

  • 6 mil

NC Routed Dimension

  • +/- 5 mil

Hole to Hole Location

  • +/- 1 mil

Stack Micro-Vias

  • Yes

Via in Pad

  • Yes

Controlled Impedance & Simulations

  • Yes

Plugged Vias

  • Solder mask
  • Non-Conductive Epoxy

Solder Mask Colors

  • Green
  • Red
  • Blue
  • Black
  • White
  • Yellow
  • Custom colors
  • Peelable Mask

Other Services

  • Panelization
  • Profiling
  • Routing
  • V-Scoring
  • Edge-Plating
  • Control Depth Holes
  • Countersink Holes
  • Castellation Holes

Your designs. Our capabilities. Outstanding PCBs.

Low-cost PCB fabrication with Guaranteed quality.

2. Advanced Circuits


This company is MIL-PRF-31032, MIL-PRF-55110G, AS9100C, ISO 9001:2008 Certified, IPC 6012 Class 2, 3 and 3A Qualified, and ITAR Registered. They operate divisions in Aurora, CO, Tempe, AZ, and Maple Grove, MN.

Advanced Circuits offers printed circuit board manufacturing with two options: Standard & Custom Spec.  Choosing between the two options will depend on your PCB design requirements and specifications.

Here are some highlights of their service:

  • Lead Time: Same Day – 4 Weeks
  • Layer Count: 0 – 40 Layers
  • Cu Weight: Up to 20 oz.
  • Trace/Space: Down to .0025” 
  • Via-In-Pad 
  • Blind & Buried Vias
  • Laser Direct Imaging
  • Oversized Boards
  • Stacked Microvias
  • Down To .3mm Pitch
  • Cavity Boards
  • Buried Chip Resistors
  • Laser-Drilled Microvias



Layer Count0 – 10 Layers0 – 40 Layers
Turn TimeSame Day – 5 DaySame Day – 4 Weeks
Quantity Req.1 – 10000+1 – 10000+
MaterialsFR-4FR-4/Rogers/Polyimide/Aluminum Clad/High-Temp. FR4 & others
Plating FinishLead-Free HAL*Electrolytic Hard Gold/Soft Gold/ENIG/Nickel/Immersion Silver
OSP/Leaded & Lead-Free HAL
Cert. / QualificationsIPC Class 2 – A600IPC6012 Class 2-3A / IPC6018 Class 3  MIL-PRF-31032 / MIL-PRF-55110 / ISO
9001:2008 / AS9100C
Board Thickness.031″ / .062″ / .093″ / .125″Full Range Available
Copper  Weight1 oz. Inner / Up to 2 oz. Outer0.5 – 4 oz. Inner / 1 – 20 oz. Outer
Trace/Space5 / 5 MilsDown to 2.75 / 3 Mils
Solder Mask (LPI)GreenVarious Color Options
LegendWhiteVarious Color Options
Min. Hole Size0.010″0.004″
Hole Tolerance+/- 0.005″+/- 0.003″ (Upon Request)
Route Tolerance+/- 0.010″+/- 0.005″ (Upon Request)
Slots/Cutouts/EdgesNon-Plated OnlyPlated / Non-Plated
Plated HolesPlated / Non-PlatedPlated / Non-Plated
UL Markings/DatesYes**Yes**
Lead-Free MarkingsYesYes
Gold FingersYesYes
Castellated HolesXYes
Controlled DielectricXYes
Controlled ImpedanceXYes
Counter SinksXYes
Counter BoresXYes
Blind/Buried ViasXYes
Mask Plugged ViasXYes
Etch BackXYes
Tetra EtchXYes
Cover CoatXYes
Cavity ProcessXYes
Laser RoutXYes
LPI LegendXYes
Edge MillXYes
Unique  SerializationXYes
Back DrillingXYes
Controlled Depth DrillXYes

Your designs. Our capabilities. Outstanding PCBs.

Low-cost PCB fabrication with Guaranteed quality.

3. Sunstone Circuits

Based in Mulino, Oregan, Sunstone Circuits offers PCB fabrication services.

Here is the list of their manufacturing capabilities:



Drill Capabilities
Smallest Drill Size0.005″
Largest Drill Size0.250″  +/- 0.002″
    *Note: Holes > 0.250″ are considered cutouts
Positional Tolerance
Control Depth Tolerance+/- 0.0005″
Blind / Buried ViaYes
Min. Pad Size (via)via + 0.006″
Min. Pad Size (component)hole + 0.010″
Route Capabilities
Board Size Tolerances (Rout)+/- 0.003″
Board Size Tolerance (Laser)+/- 0.001″
V-Score Web Thickness+/- 0.002″
V-Score Line Width+/- 0.002″
Etch Tolerances
Trace width (of design)+/- 0.0005″
Minimum Trace Width0.002″
Surface Finish
Tin / Lead Solder (HASL)Yes
Immersion SilverYes*
Copper OnlyYes*
Full Body Hard GoldYes*
Soft Bondable GoldYes*
Lead Free SolderYes*
 *Denotes RoHS Compliant Finish
Board Parameters
Layer Count 0 – 36
Board Thickness0.003″ – 0.187
Copper Weight (finished)0.25 oz – 6 oz
FR-4 150 Tg (RoHS Compliant)Yes
FR-4 170 Tg (RoHS Compliant)Yes
Rogers RO 3000(R) SeriesNo
Rogers RO 4000(R) SeriesYes
Rogers RT/duroid(R) Series (5000 and 6000 Series)Yes
UL Listed
ITAR Registered
Other Sunstone Capabilities
Controlled Impedance
Full Service CAM Tooling

Your designs. Our capabilities. Outstanding PCBs.

Low-cost PCB fabrication with Guaranteed quality.

4. Bay Area Circuits

The company has been serving the advanced PCB manufacturing needs of design engineering firms in the commercial, industrial, and medical industries, contract assemblers, and original equipment manufacturers for over 40 years.
Standard CapabilityAdvanced Capability
Minimum Layer Count11
Maximum Layer Count1630
Finished Hole Size0.010″0.004″
Surface FinishesHASL, ENIG, Hard Gold, Soft Gold (see all below)ENEPIG, OSP, EPIG (see all below)
MaterialsFR-4, High Temp FR-4, Isola, RogersPTFE/Duroid, Polyimide, Flex
Controlled Impedance+/- 10%+/- 5%
Annular Ring0.006″0.003″ Mechanical, 0.001″ Laser
Outer Layers Finished Copper1.5 oz to 2 oz1 oz to 5 oz
Inner Layers Finished Copper0.5 oz to 2 oz0.3 oz to 4 oz
Soldermask ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Silkscreen ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Filled ViasNon-Conductive FillNon-Conductive Fill or Conductive Fill
Smallest Mechanical Drill Diameter0.010″0.004″
Smallest Laser Drill DiameterN/A0.003″
Blind ViasNoYes
Buried ViasNoYes
Aspect Ratio10:0115:01
Plated Hole to Copper0.008″0.005″
Clearance – Copper to Edge of BoardOuter Layer – 0.010″Outer Layer – 0.005″
Inner Layer – 0.015″Inner Layer – 0.005″
Minimum Panel Size9″ x 12″8″ x 8″
Maximum Panel Size18″ x 24″24″ x 36″
Plated SlotsRoutedRouted or Nibbled
Non-Plated SlotsRoutedRouted or Nibbled
Plating in Holes0.0008″0.0015″
Web (or Mask Width)0.006″0.003″
Soldermask Swell0.003″0.001″
Silkscreen Width0.003″0.003″
Inspection & Testing Criteria
IPC Class 2YesYes
IPC Class 3NoYes
Netlist Generation and Netlist CompareYesYes
Trace / Space
Outer Layers (finished copper)1 oz. Cu – Min .005″ Trace/Space1 oz. Cu – Min .002″ Trace/Space
2 oz. Cu – Min .008″ Trace/Space2 oz. Cu – Min .006″ Trace/Space
3 oz. Cu – Min .012″ Trace/Space3 oz. Cu – Min .008″ Trace/Space
4 oz. Cu – Min .014″ Trace/Space4 oz. Cu – Min .012″ Trace/Space
5 oz. Cu – Min .016″ Trace/Space
Inner Layers
0.3 oz Cu – Min .002″ Trace/Space0.5 oz Cu – Min .003″ Trace/Space
0.5 oz Cu – Min .005″ Trace/Space1 oz. Cu – Min .005″ Trace/Space
1 oz. Cu – Min .006″ Trace/Space2 oz. Cu – Min .008″ Trace/Space
2 oz. Cu – Min .012″ Trace/Space3 oz. Cu – Min .0012″ Trace/Space
4 oz. Cu – Min .016″ Trace/Space
Min drilled diameter, final board thickness 0.031″ or less0.008″0.004″
Min drilled diameter, final board thickness between 0.031″ and 0.062″0.010″0.006″
Min drilled diameter, final board thickness between 0.062″ and 0.093″0.012″0.010″
Min drilled diameter, final board thickness between 0.093″ and 0.125″0.015″0.012″
Min laser diameter, dielectric thickness less than or equal to 0.004″N/A0.003″
Min laser diameter, dielectric thickness between 0.004″ and 0.005″N/A0.004″
Min laser diameter, dielectric thickness between 0.005″ and 0.007″N/A0.005″
Controlled depth blind viasNoYes, max 0.75:1 aspect ratio
Pre-drilled core blind viasNoYes
Sublamination blind viasNoYes
Build-up technologyNoUp to 4-N-4, Any layer
Buried viasNoYes
Filled viasNon-Conductive fillNon-Conductive or Conductive fill
Largest hole0.247″ plated, 0.250″ non-platedNo maximum
SlotsPlated or non-plated, routedPlated or non-plated, routed or nibbled
Plating in holes0.0008″0.0015″
Plated hole to copper0.008″0.005″
Surface Finish
Hot Air Solder Level (HASL – Lead)YesYes
Hot Air Solder Level (HASL – Lead-Free)YesYes
Electroless Nickel Immersion Gold (ENIG)YesYes
Immersion SilverYesYes
Hard Gold Fingers with ENIGYesYes
Hard Gold Fingers with HASLYesYes
Electrolytic Soft GoldYesYes
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)NoYes
Organic Surface Protectant (OSP)YesYes
Bare CopperYesYes
Electroless Palladium Immersion Gold (EPIG)NoYes
Tin NickelNoYes
White TinYesYes
Carbon InkNoYes
ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Finish/TextureSemi-gloss, MatteSemi-gloss, Matte
Tented ViasYesYes
Soldermask Plugged ViasYesYes
Soldermask Thickness over Copper5 micron to 25 micron5 micron to 25 micron
Soldermask Web5 mil3 mil
Soldermask Gap to Pad4 mil2 mil
Copper Ring Under Mask-Defined Pad3 mil1 mil
Peelable SoldermaskNoYes
LPI SoldermaskYesYes
Dry Film SoldermaskNoYes
ColorsGreen, Black, Blue, Red, White, Clear, CustomYellow, Custom
Minimum Legend Width3 mil3 mil
Space between Silkscreen and Pad5 mil4 mil
Controlled Impedance
Layers0-10 Layers0-30 Layers
Impedance ToleranceSingle-ended +/- 10%Single-ended +/- 5%
Impedance ToleranceDifferential Pairs +/- 10%Differential Pairs +/- 5%
Impedance ToleranceCoplanar Waveguide +/- 10%Coplanar Waveguide +/- 5%
TDR TestingYes, IncludedYes, Included
Board Thickness
1-Layer or 2-LayerMin .015″ | Max .200″Min .008″ | Max .250″
4-LayerMin .020″ | Max .200″Min .015″ | Max .250″
6-LayerMin .031″ | Max .200″Min .025″ | Max .250″
8-LayerMin .047″ | Max .200″Min .031″ | Max .250″
10-LayerMin .062″ | Max .200″Min .040″ | Max .250″
12-LayerMin .062″ | Max .200″Min .047″ | Max .250″
14-LayerMin .062″ | Max .200″Min .054″ | Max .250″
16-LayerMin .062″ | Max .200″Min .062″ | Max .250″
CNC / Routing / Score / Mechanical Rules
Router Bit Size0.078″Min 0.021″, Max. 0.078″
Spacing for Tab Rout Array0.100″
Standard V- Score Angle30°20°, 30°, 45°, 60°
V-Score DepthOne third of board thickness (min 0.010″)
Jump ScoreNoYes, overshoot up to 0.35″
Scoring DirectionVertical and HorizontalRouted Scoring
Bevel Angle20, 30, 45, or 60 Degree Gold Finger BevelMilling/Offset or Recessed Beveling
Countersinks60, 82, 90, 100 Degree Countersink **60, 82, 90, 100 Degree Countersink **
Edge CastellationsNoCastellated Edges Min .040″
Plated EdgesNoYes
Cross SectionLevel 1Level 1, Level 2, Level 3

Your designs. Our capabilities. Outstanding PCBs.

Low-cost PCB fabrication with Guaranteed quality.

5. Sierra Circuits

Specializing in quick turn PCBs and medium production runs, Sierra’s primary focus is delivering the highest quality product in the shortest amount of time. What makes this possible is that Sierra is the actual manufacturer and assembler of PCBs.

PCB Attributes

Min Layer Count111
Max Layer Count303030
Min Board Thickness.010”.005”.005″
Max Board Thickness.250”.250”.250″
Min Core Thickness.004”.002”.002″
Min Dielectric.004”.003”.002″
Min Starting Copper Foil Weight9 microns9 microns5 micron
Max Finished Copper Thickness (O/L)4 oz6 oz1 oz
Max Finished Copper Thickness (I/L)4 oz4 oz0.5 oz
Min Panel Size12” x 18”12” x 18”12″ x 18″
Max Panel Size18” x 24”21” x 29”12″ x 18″
Smallest Mechanical Drill Diameter.0059”.0059”.0059″
Smallest Laser Drill Diameter.005″.004″.004″
Min Finished Hole Size.004”.002”.002″
Max Through Hole Aspect Ratio (depending on board thickness and finish hole)10:110:1> 10:1
Max Laser Via Aspect Ratio.75:1.75:1.75:1
Blind Via Finished Hole Size.004”Plated ShutPlated shut
Buried Via Finished Hole Size.004”.002”.002″
Min Trace and Space.004”.003”0.002″
Min Pad Size for Test.005”.005”.005″
Process Pad DiameterD + .012” (1-mil Annular Ring)D + .008” (Tangency)D + .008” (Tangency)
Stacked ViasYesYesYes
Min Wire Bond Pad Size> .006”.004”0.004″
Controlled Impedance Tolerance10%5%5%
Solder Mask Registration.002”.001”.001″
Solder Mask Feature Tolerance.0015”.001”.001”
Solder Mask Min Dam Size (based on green soldermask color).005”.004”.004″
Min Diameter Route Cutter Available.024”.021”.021″
Routed Part Size Tolerance.005”.003”0.003″
Laser Hole Location Tolerance.0005”.0005”.0005″
Laser Routed Part Size Tolerance ( can only be done with panels < .032” thick).002”.002”.001″
Bow and Twist TolerancePer IPC SpecPer IPC SpecPer IPC Spec
Thickness Tolerance (based on board thickness)10%5%5%
Sequential Laminations3 or less Lamination Cycles4 Lamination Cycles5 Lamination cycles
Buried ViasYesYesYes
Blind ViasYesYesYes
Conductive Filled ViasYesYesYes – Cu plate shut
Non Conductive Filled ViasYesYesYes

Surface finishes

HASL (Vertical or Horizontal)YesYesNo
Lead Free HASLYesYesNo
OSP (Shikoku F2)YesYesYes
OSP (Entek)YesYesYes
ENIG (Electroless Nickel/Immersion Gold)YesYesYes
Immersion SilverYesYesNo
Electrolytic Soft GoldYesYesYes
Electrolytic Hard GoldYesYesYes
Selective Gold

PCB Fabrication

Routed ArrayYesYesYes
V Score, Edge to Copper.01”.007”.007″
V Score Angles35°, 45°, 60°35°, 45°, 60°35°, 45°, 60°
Milling+/- .003”+/- .002”+/- .001”
Edge CastellationYesYesYes
Edge PlatingYesYesYes

Your designs. Our capabilities. Outstanding PCBs.

Low-cost PCB fabrication with Guaranteed quality.